JP5684455B2 - 成長中にp型ドーパントがドープされたp型半極性III窒化物半導体を使用して、該III窒化物デバイスまたはIII窒化物半導体を製造する方法、半極性III窒化物半導体、および、p型III窒化物半導体を製造する方法 - Google Patents

成長中にp型ドーパントがドープされたp型半極性III窒化物半導体を使用して、該III窒化物デバイスまたはIII窒化物半導体を製造する方法、半極性III窒化物半導体、および、p型III窒化物半導体を製造する方法 Download PDF

Info

Publication number
JP5684455B2
JP5684455B2 JP2008554403A JP2008554403A JP5684455B2 JP 5684455 B2 JP5684455 B2 JP 5684455B2 JP 2008554403 A JP2008554403 A JP 2008554403A JP 2008554403 A JP2008554403 A JP 2008554403A JP 5684455 B2 JP5684455 B2 JP 5684455B2
Authority
JP
Japan
Prior art keywords
nitride semiconductor
semipolar
concentration
iii nitride
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008554403A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009526405A (ja
JP2009526405A5 (enExample
Inventor
ジョン エフ. ケディング,
ジョン エフ. ケディング,
佐藤 均
均 佐藤
マイケル イザ,
マイケル イザ,
啓州 浅水
啓州 浅水
ホン チョン,
ホン チョン,
スティーブン ピー. デンバース,
スティーブン ピー. デンバース,
シュウジ ナカムラ,
シュウジ ナカムラ,
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of California
University of California Berkeley
Original Assignee
University of California San Diego UCSD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of California San Diego UCSD filed Critical University of California San Diego UCSD
Publication of JP2009526405A publication Critical patent/JP2009526405A/ja
Publication of JP2009526405A5 publication Critical patent/JP2009526405A5/ja
Application granted granted Critical
Publication of JP5684455B2 publication Critical patent/JP5684455B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • H01L21/02573Conductivity type
    • H01L21/02579P-type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02609Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • H10D62/405Orientations of crystalline planes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/81Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
    • H10D62/815Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/854Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
JP2008554403A 2006-02-10 2007-02-09 成長中にp型ドーパントがドープされたp型半極性III窒化物半導体を使用して、該III窒化物デバイスまたはIII窒化物半導体を製造する方法、半極性III窒化物半導体、および、p型III窒化物半導体を製造する方法 Active JP5684455B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US77218406P 2006-02-10 2006-02-10
US60/772,184 2006-02-10
PCT/US2007/003607 WO2007095137A2 (en) 2006-02-10 2007-02-09 Method for conductivity control of (al,in,ga,b)n

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2013081851A Division JP2013191851A (ja) 2006-02-10 2013-04-10 (Al,In,Ga,B)Nの伝導性制御方法
JP2014245563A Division JP2015046640A (ja) 2006-02-10 2014-12-04 (Al,In,Ga,B)Nの伝導性制御方法

Publications (3)

Publication Number Publication Date
JP2009526405A JP2009526405A (ja) 2009-07-16
JP2009526405A5 JP2009526405A5 (enExample) 2015-01-29
JP5684455B2 true JP5684455B2 (ja) 2015-03-11

Family

ID=38372037

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2008554403A Active JP5684455B2 (ja) 2006-02-10 2007-02-09 成長中にp型ドーパントがドープされたp型半極性III窒化物半導体を使用して、該III窒化物デバイスまたはIII窒化物半導体を製造する方法、半極性III窒化物半導体、および、p型III窒化物半導体を製造する方法
JP2013081851A Pending JP2013191851A (ja) 2006-02-10 2013-04-10 (Al,In,Ga,B)Nの伝導性制御方法
JP2014245563A Withdrawn JP2015046640A (ja) 2006-02-10 2014-12-04 (Al,In,Ga,B)Nの伝導性制御方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013081851A Pending JP2013191851A (ja) 2006-02-10 2013-04-10 (Al,In,Ga,B)Nの伝導性制御方法
JP2014245563A Withdrawn JP2015046640A (ja) 2006-02-10 2014-12-04 (Al,In,Ga,B)Nの伝導性制御方法

Country Status (5)

Country Link
US (3) US8193079B2 (enExample)
EP (1) EP1984940A4 (enExample)
JP (3) JP5684455B2 (enExample)
KR (1) KR101416838B1 (enExample)
WO (1) WO2007095137A2 (enExample)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101845670A (zh) * 2005-03-10 2010-09-29 加利福尼亚大学董事会 用于生长平坦半极性氮化镓的技术
JP5743127B2 (ja) 2005-06-01 2015-07-01 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置
WO2007098215A2 (en) * 2006-02-17 2007-08-30 The Regents Of The University Of California Method for growth of semipolar (al,in,ga,b)n optoelectronic devices
WO2008060349A2 (en) * 2006-11-15 2008-05-22 The Regents Of The University Of California Method for heteroepitaxial growth of high-quality n-face gan, inn, and ain and their alloys by metal organic chemical vapor deposition
US8193020B2 (en) * 2006-11-15 2012-06-05 The Regents Of The University Of California Method for heteroepitaxial growth of high-quality N-face GaN, InN, and AlN and their alloys by metal organic chemical vapor deposition
JP2010512664A (ja) * 2006-12-11 2010-04-22 ルーメンツ リミテッド ライアビリティ カンパニー 酸化亜鉛多接合光電池及び光電子装置
US8458262B2 (en) * 2006-12-22 2013-06-04 At&T Mobility Ii Llc Filtering spam messages across a communication network
KR20100067114A (ko) * 2007-09-19 2010-06-18 더 리전츠 오브 더 유니버시티 오브 캘리포니아 비극성 및 반극성 질화물 기판들의 면적을 증가하기 위한 방법
KR20100134089A (ko) * 2008-04-04 2010-12-22 더 리전츠 오브 더 유니버시티 오브 캘리포니아 평면의 반극성 (Al, In, Ga, B)N계 발광 다이오드들에 대한 MOCVD 성장 기술
US9157167B1 (en) 2008-06-05 2015-10-13 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8871024B2 (en) 2008-06-05 2014-10-28 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8097081B2 (en) * 2008-06-05 2012-01-17 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8303710B2 (en) * 2008-06-18 2012-11-06 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US20100003492A1 (en) * 2008-07-07 2010-01-07 Soraa, Inc. High quality large area bulk non-polar or semipolar gallium based substrates and methods
WO2011044554A1 (en) 2009-10-09 2011-04-14 Soraa, Inc. Method for synthesis of high quality large area bulk gallium based crystals
US8805134B1 (en) 2012-02-17 2014-08-12 Soraa Laser Diode, Inc. Methods and apparatus for photonic integration in non-polar and semi-polar oriented wave-guided optical devices
JP2011530194A (ja) 2008-08-04 2011-12-15 ソラア インコーポレーテッド 物質および蛍光体を含んだ非分極性あるいは半極性のガリウムを用いた白色灯デバイス
US8284810B1 (en) 2008-08-04 2012-10-09 Soraa, Inc. Solid state laser device using a selected crystal orientation in non-polar or semi-polar GaN containing materials and methods
US8979999B2 (en) 2008-08-07 2015-03-17 Soraa, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US8430958B2 (en) 2008-08-07 2013-04-30 Soraa, Inc. Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride
US8323405B2 (en) * 2008-08-07 2012-12-04 Soraa, Inc. Process and apparatus for growing a crystalline gallium-containing nitride using an azide mineralizer
US8021481B2 (en) * 2008-08-07 2011-09-20 Soraa, Inc. Process and apparatus for large-scale manufacturing of bulk monocrystalline gallium-containing nitride
US8148801B2 (en) 2008-08-25 2012-04-03 Soraa, Inc. Nitride crystal with removable surface layer and methods of manufacture
WO2010033792A1 (en) * 2008-09-18 2010-03-25 Lumenz Llc Textured semiconductor light-emitting devices
EP2253988A1 (en) * 2008-09-19 2010-11-24 Christie Digital Systems USA, Inc. A light integrator for more than one lamp
US8354679B1 (en) 2008-10-02 2013-01-15 Soraa, Inc. Microcavity light emitting diode method of manufacture
US8455894B1 (en) 2008-10-17 2013-06-04 Soraa, Inc. Photonic-crystal light emitting diode and method of manufacture
USRE47114E1 (en) 2008-12-12 2018-11-06 Slt Technologies, Inc. Polycrystalline group III metal nitride with getter and method of making
US8878230B2 (en) 2010-03-11 2014-11-04 Soraa, Inc. Semi-insulating group III metal nitride and method of manufacture
US8987156B2 (en) 2008-12-12 2015-03-24 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US8461071B2 (en) 2008-12-12 2013-06-11 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
WO2010101946A1 (en) * 2009-03-02 2010-09-10 The Regents Of The University Of California DEVICES GROWN ON NONPOLAR OR SEMIPOLAR (Ga,Al,In,B)N SUBSTRATES
WO2010113238A1 (ja) * 2009-04-03 2010-10-07 パナソニック株式会社 窒化物系半導体素子およびその製造方法
US8299473B1 (en) 2009-04-07 2012-10-30 Soraa, Inc. Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors
US8306081B1 (en) 2009-05-27 2012-11-06 Soraa, Inc. High indium containing InGaN substrates for long wavelength optical devices
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
CN105824179B (zh) * 2009-05-29 2018-01-30 天空激光二极管有限公司 一种投影系统
US9829780B2 (en) 2009-05-29 2017-11-28 Soraa Laser Diode, Inc. Laser light source for a vehicle
US8427590B2 (en) 2009-05-29 2013-04-23 Soraa, Inc. Laser based display method and system
US10108079B2 (en) 2009-05-29 2018-10-23 Soraa Laser Diode, Inc. Laser light source for a vehicle
WO2010141943A1 (en) * 2009-06-05 2010-12-09 The Regents Of The University Of California LONG WAVELENGTH NONPOLAR AND SEMIPOLAR (Al,Ga,In)N BASED LASER DIODES
EP3569235A1 (en) 2009-09-04 2019-11-20 Horizon Orphan LLC Use of aerosolized levofloxacin for treating cystic fibrosis
US20150004435A1 (en) * 2009-09-17 2015-01-01 National Chiao Tung University Method for growing non-polar m-plane epitaxial layer of wurtzite semiconductors on single crystal oxide substrates
US8435347B2 (en) 2009-09-29 2013-05-07 Soraa, Inc. High pressure apparatus with stackable rings
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
FR2968301B1 (fr) 2010-09-23 2020-05-01 Gelest Technologies, Inc. Derives d'alcoxysilane des acides amines a groupement n-acyle, des dipeptides a groupement n-acyle et des tripeptides a groupement n-acyle, ainsi que les particules et formulations huile dans l'eau stables les utilisant
US8729559B2 (en) 2010-10-13 2014-05-20 Soraa, Inc. Method of making bulk InGaN substrates and devices thereon
US8786053B2 (en) 2011-01-24 2014-07-22 Soraa, Inc. Gallium-nitride-on-handle substrate materials and devices and method of manufacture
US8399367B2 (en) * 2011-06-28 2013-03-19 Nitride Solutions, Inc. Process for high-pressure nitrogen annealing of metal nitrides
US8482104B2 (en) 2012-01-09 2013-07-09 Soraa, Inc. Method for growth of indium-containing nitride films
US9076896B2 (en) * 2012-03-21 2015-07-07 Seoul Viosys Co., Ltd. Method of fabricating nonpolar gallium nitride-based semiconductor layer, nonpolar semiconductor device, and method of fabricating the same
JP5699983B2 (ja) * 2012-04-27 2015-04-15 住友電気工業株式会社 窒化ガリウム系半導体を作製する方法、iii族窒化物半導体デバイスを作製する方法、及びiii族窒化物半導体デバイス
US9196709B2 (en) * 2013-02-01 2015-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for forming semiconductor regions in trenches
JP6098259B2 (ja) * 2013-03-19 2017-03-22 豊田合成株式会社 半導体装置の製造方法
KR102061696B1 (ko) 2013-11-05 2020-01-03 삼성전자주식회사 반극성 질화물 반도체 구조체 및 이의 제조 방법
US11437774B2 (en) 2015-08-19 2022-09-06 Kyocera Sld Laser, Inc. High-luminous flux laser-based white light source
US9787963B2 (en) 2015-10-08 2017-10-10 Soraa Laser Diode, Inc. Laser lighting having selective resolution
US10771155B2 (en) 2017-09-28 2020-09-08 Soraa Laser Diode, Inc. Intelligent visible light with a gallium and nitrogen containing laser source
US10222474B1 (en) 2017-12-13 2019-03-05 Soraa Laser Diode, Inc. Lidar systems including a gallium and nitrogen containing laser light source
US10551728B1 (en) 2018-04-10 2020-02-04 Soraa Laser Diode, Inc. Structured phosphors for dynamic lighting
WO2020018709A1 (en) * 2018-07-18 2020-01-23 The Regents Of The University Of California Method for the fabrication of electrically-conductive semiconductor layers
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
US12152742B2 (en) 2019-01-18 2024-11-26 Kyocera Sld Laser, Inc. Laser-based light guide-coupled wide-spectrum light system
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
US12000552B2 (en) 2019-01-18 2024-06-04 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system for a vehicle
CN117178369A (zh) * 2021-04-20 2023-12-05 华为技术有限公司 半导体器件、电子设备及形成半导体器件的方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5306662A (en) * 1991-11-08 1994-04-26 Nichia Chemical Industries, Ltd. Method of manufacturing P-type compound semiconductor
EP0942459B1 (en) * 1997-04-11 2012-03-21 Nichia Corporation Method of growing nitride semiconductors
US6849472B2 (en) 1997-09-30 2005-02-01 Lumileds Lighting U.S., Llc Nitride semiconductor device with reduced polarization fields
WO1999066565A1 (en) * 1998-06-18 1999-12-23 University Of Florida Method and apparatus for producing group-iii nitrides
JP3883303B2 (ja) 1998-10-09 2007-02-21 独立行政法人科学技術振興機構 p型III族窒化物半導体の製造方法
JP3592553B2 (ja) * 1998-10-15 2004-11-24 株式会社東芝 窒化ガリウム系半導体装置
US20010047751A1 (en) * 1998-11-24 2001-12-06 Andrew Y. Kim Method of producing device quality (a1) ingap alloys on lattice-mismatched substrates
JP4006537B2 (ja) 1999-10-19 2007-11-14 日本電信電話株式会社 P型の窒化物半導体の作製方法
JP2001308017A (ja) * 2000-04-24 2001-11-02 Sony Corp p型窒化物系III−V族化合物半導体の製造方法および半導体素子の製造方法
JP3882539B2 (ja) * 2000-07-18 2007-02-21 ソニー株式会社 半導体発光素子およびその製造方法、並びに画像表示装置
US6599362B2 (en) * 2001-01-03 2003-07-29 Sandia Corporation Cantilever epitaxial process
US6635904B2 (en) * 2001-03-29 2003-10-21 Lumileds Lighting U.S., Llc Indium gallium nitride smoothing structures for III-nitride devices
US6479313B1 (en) * 2001-05-25 2002-11-12 Kopin Corporation Method of manufacturing GaN-based p-type compound semiconductors and light emitting diodes
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US7105865B2 (en) * 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
JP2004111514A (ja) * 2002-09-17 2004-04-08 Sanyo Electric Co Ltd 窒化物系半導体発光素子およびその製造方法
KR101086155B1 (ko) * 2002-12-16 2011-11-25 독립행정법인 과학기술진흥기구 수소화합물 기상 성장법에 의한 평면, 비극성 질화 갈륨의 성장
US7186302B2 (en) * 2002-12-16 2007-03-06 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
WO2004084275A2 (en) * 2003-03-18 2004-09-30 Crystal Photonics, Incorporated Method for making group iii nitride devices and devices produced thereby
US6847057B1 (en) * 2003-08-01 2005-01-25 Lumileds Lighting U.S., Llc Semiconductor light emitting devices
US7009215B2 (en) * 2003-10-24 2006-03-07 General Electric Company Group III-nitride based resonant cavity light emitting devices fabricated on single crystal gallium nitride substrates
US20050218414A1 (en) * 2004-03-30 2005-10-06 Tetsuzo Ueda 4H-polytype gallium nitride-based semiconductor device on a 4H-polytype substrate
JP5379973B2 (ja) * 2004-05-10 2013-12-25 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 有機金属気相成長法による非極性窒化インジウムガリウム薄膜、ヘテロ構造物およびデバイスの製作
US7432142B2 (en) * 2004-05-20 2008-10-07 Cree, Inc. Methods of fabricating nitride-based transistors having regrown ohmic contact regions
US7407872B2 (en) * 2004-08-20 2008-08-05 Yale University Epitaxial growth of aligned AlGalnN nanowires by metal-organic chemical vapor deposition
JP4548117B2 (ja) * 2004-12-28 2010-09-22 ソニー株式会社 半導体発光素子の製造方法、集積型半導体発光装置の製造方法、画像表示装置の製造方法および照明装置の製造方法
CN101845670A (zh) * 2005-03-10 2010-09-29 加利福尼亚大学董事会 用于生长平坦半极性氮化镓的技术
JP5743127B2 (ja) * 2005-06-01 2015-07-01 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置
WO2007009035A2 (en) * 2005-07-13 2007-01-18 The Regents Of The University Of California Lateral growth method for defect reduction of semipolar nitride films

Also Published As

Publication number Publication date
US20070190758A1 (en) 2007-08-16
US20120187415A1 (en) 2012-07-26
WO2007095137A8 (en) 2008-09-18
US8193079B2 (en) 2012-06-05
US8709925B2 (en) 2014-04-29
WO2007095137A3 (en) 2008-11-20
EP1984940A2 (en) 2008-10-29
KR101416838B1 (ko) 2014-07-08
WO2007095137A2 (en) 2007-08-23
KR20080108985A (ko) 2008-12-16
US20140191244A1 (en) 2014-07-10
JP2009526405A (ja) 2009-07-16
EP1984940A4 (en) 2010-11-10
JP2013191851A (ja) 2013-09-26
JP2015046640A (ja) 2015-03-12

Similar Documents

Publication Publication Date Title
JP5684455B2 (ja) 成長中にp型ドーパントがドープされたp型半極性III窒化物半導体を使用して、該III窒化物デバイスまたはIII窒化物半導体を製造する方法、半極性III窒化物半導体、および、p型III窒化物半導体を製造する方法
JP2009526405A5 (enExample)
TWI489668B (zh) 利用金屬有機化學汽相沉積之高品質氮面GaN、InN及AlN及其合金之異質磊晶生長的方法
US7709284B2 (en) Method for deposition of magnesium doped (Al, In, Ga, B)N layers
JP5896442B2 (ja) Iii族窒化物膜の成長方法
JP5706601B2 (ja) 平坦な半極性窒化ガリウムの成長技術
JP2005019872A (ja) 窒化物半導体の製造方法及び半導体ウエハ並びに半導体デバイス
JP6966063B2 (ja) 結晶基板、紫外発光素子およびそれらの製造方法
EP1977441A2 (en) Method for enhancing growth of semipolar (ai,in,ga,b)n via metalorganic chemical vapor deposition
JP2012209586A (ja) 半極性窒化物を備え、窒化物核生成層又はバッファ層に特徴を有するデバイス構造
US7951617B2 (en) Group III nitride semiconductor stacked structure and production method thereof
JP2017208502A (ja) Iii族窒化物半導体及びその製造方法
CN107482092A (zh) 一种395nm短波长紫外LED结构的外延加工方法
US20060175681A1 (en) Method to grow III-nitride materials using no buffer layer
KR20130035995A (ko) 구조체, 및 반도체 기판의 제조 방법
JPH09148626A (ja) 3−5族化合物半導体の製造方法
US20140183579A1 (en) Miscut semipolar optoelectronic device
JP7430316B2 (ja) 半導体成長用基板、半導体素子、半導体発光素子および半導体素子製造方法
US10665752B2 (en) Air void structures for semiconductor fabrication

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110114

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111115

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120213

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120220

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120306

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120313

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120413

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121210

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130410

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20130426

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20130621

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130909

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130912

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20140901

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20140904

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20141204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150115

R150 Certificate of patent or registration of utility model

Ref document number: 5684455

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250