JP5681453B2 - 測定方法および測定装置 - Google Patents

測定方法および測定装置 Download PDF

Info

Publication number
JP5681453B2
JP5681453B2 JP2010249431A JP2010249431A JP5681453B2 JP 5681453 B2 JP5681453 B2 JP 5681453B2 JP 2010249431 A JP2010249431 A JP 2010249431A JP 2010249431 A JP2010249431 A JP 2010249431A JP 5681453 B2 JP5681453 B2 JP 5681453B2
Authority
JP
Japan
Prior art keywords
protective film
thickness
measuring
light
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010249431A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012104533A (ja
Inventor
信康 北原
信康 北原
高橋　邦充
邦充 高橋
幸伸 大浦
幸伸 大浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2010249431A priority Critical patent/JP5681453B2/ja
Priority to KR1020110111167A priority patent/KR101844071B1/ko
Priority to CN201110346590.XA priority patent/CN102564327B/zh
Publication of JP2012104533A publication Critical patent/JP2012104533A/ja
Application granted granted Critical
Publication of JP5681453B2 publication Critical patent/JP5681453B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/0209—Low-coherence interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8483—Investigating reagent band
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Molecular Biology (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2010249431A 2010-11-08 2010-11-08 測定方法および測定装置 Active JP5681453B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010249431A JP5681453B2 (ja) 2010-11-08 2010-11-08 測定方法および測定装置
KR1020110111167A KR101844071B1 (ko) 2010-11-08 2011-10-28 측정 방법 및 측정 장치
CN201110346590.XA CN102564327B (zh) 2010-11-08 2011-11-04 测定方法及测定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010249431A JP5681453B2 (ja) 2010-11-08 2010-11-08 測定方法および測定装置

Publications (2)

Publication Number Publication Date
JP2012104533A JP2012104533A (ja) 2012-05-31
JP5681453B2 true JP5681453B2 (ja) 2015-03-11

Family

ID=46267161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010249431A Active JP5681453B2 (ja) 2010-11-08 2010-11-08 測定方法および測定装置

Country Status (3)

Country Link
JP (1) JP5681453B2 (zh)
KR (1) KR101844071B1 (zh)
CN (1) CN102564327B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6037892B2 (ja) * 2013-02-26 2016-12-07 株式会社ディスコ 保護膜の厚さ測定方法
CN103606528B (zh) * 2013-10-23 2016-03-23 上海华力微电子有限公司 生长钨前的硅片检测装置和方法
JP6244843B2 (ja) * 2013-11-14 2017-12-13 三菱ケミカル株式会社 繊維束の監視方法、この監視方法を用いた監視装置及び、この監視方法または監視装置を用いた繊維束の製造方法
JP6478728B2 (ja) * 2015-03-11 2019-03-06 株式会社ディスコ 保護膜検出方法
JP6624919B2 (ja) * 2015-12-18 2019-12-25 株式会社ディスコ レーザー加工用保護膜検出方法
JP2017227532A (ja) * 2016-06-22 2017-12-28 株式会社ディスコ 蛍光検出装置
JP6688695B2 (ja) * 2016-06-24 2020-04-28 株式会社ディスコ 保護膜被覆装置および保護膜被覆方法
JP6764322B2 (ja) * 2016-11-22 2020-09-30 株式会社ディスコ デバイスウェーハの加工方法
JP6775036B2 (ja) * 2017-02-07 2020-10-28 東京エレクトロン株式会社 成膜システム、成膜方法及びコンピュータ記憶媒体
US10236222B2 (en) * 2017-02-08 2019-03-19 Kla-Tencor Corporation System and method for measuring substrate and film thickness distribution
WO2019174709A1 (de) 2018-03-12 2019-09-19 Celonis Se Verfahren zur behebung von prozessanomalien

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243503A (ja) * 1985-08-20 1987-02-25 Toyota Motor Corp メタリツク塗装クリヤ−塗膜の膜厚測定法
JP3624476B2 (ja) * 1995-07-17 2005-03-02 セイコーエプソン株式会社 半導体レーザ装置の製造方法
IL125964A (en) * 1998-08-27 2003-10-31 Tevet Process Control Technolo Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
EP1430270A4 (en) * 2001-09-21 2006-10-25 Kmac METHOD AND DEVICE FOR MEASURING THE THICK PROFILE AND THE DISTRIBUTION OF THIN FILM MULTI-LAYER REFRACTIVE INDICES BY TWO-DIMENSIONAL REFLECTOMETRY
JP4571850B2 (ja) * 2004-11-12 2010-10-27 東京応化工業株式会社 レーザーダイシング用保護膜剤及び該保護膜剤を用いたウエーハの加工方法
KR100665003B1 (ko) 2004-12-07 2007-01-09 삼성전기주식회사 금속표면 상의 유기도막 두께 측정방법
JP5065722B2 (ja) * 2007-03-23 2012-11-07 株式会社ディスコ レーザー加工装置
US20090107399A1 (en) * 2007-10-29 2009-04-30 Harald Bloess System and Method of Measuring Film Height on a Substrate

Also Published As

Publication number Publication date
CN102564327B (zh) 2016-09-14
KR20120049132A (ko) 2012-05-16
KR101844071B1 (ko) 2018-03-30
CN102564327A (zh) 2012-07-11
JP2012104533A (ja) 2012-05-31

Similar Documents

Publication Publication Date Title
JP5681453B2 (ja) 測定方法および測定装置
JP5681452B2 (ja) 測定方法および測定装置
US10692721B2 (en) Wafer processing method for reforming protective film
JP6532273B2 (ja) ウェーハの加工方法
US10086474B2 (en) Protective film applying apparatus and protective film applying method
JP6382568B2 (ja) レーザー加工装置
JP2008108792A (ja) ウエーハの加工方法
TWI411487B (zh) Laser processing of gallium arsenide wafers
KR102313271B1 (ko) 웨이퍼의 가공 방법
JP2017195219A (ja) ウェーハの加工方法
JP2008109015A (ja) ウエーハの分割方法および分割装置
JP2012104780A (ja) 光デバイスウエーハの分割方法
JP2006286763A (ja) ウエーハのレーザー加工方法およびレーザー加工装置
KR20160002353A (ko) 레이저 가공 장치
JP2011253866A (ja) 分割方法
JP2010029906A (ja) レーザー加工装置
JP5010832B2 (ja) レーザー加工装置
JP2011187829A (ja) レーザー加工溝の確認方法
JP2010145230A (ja) チャックテーブルに保持された被加工物の高さ位置計測装置
JP5715370B2 (ja) 検出方法
TW202008059A (zh) 晶圓的分割方法
JP2008229706A (ja) レーザー加工装置
KR20150105210A (ko) 판형물의 가공 방법
JP2012104778A (ja) 光デバイスウエーハの分割方法
KR20200039559A (ko) 웨이퍼의 가공 방법

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20131011

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140918

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140930

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141216

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150109

R150 Certificate of patent or registration of utility model

Ref document number: 5681453

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250