JP5671799B2 - ホルダラック - Google Patents

ホルダラック Download PDF

Info

Publication number
JP5671799B2
JP5671799B2 JP2010000813A JP2010000813A JP5671799B2 JP 5671799 B2 JP5671799 B2 JP 5671799B2 JP 2010000813 A JP2010000813 A JP 2010000813A JP 2010000813 A JP2010000813 A JP 2010000813A JP 5671799 B2 JP5671799 B2 JP 5671799B2
Authority
JP
Japan
Prior art keywords
holder
substrate
substrate holder
pair
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010000813A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011142140A5 (https=
JP2011142140A (ja
Inventor
正博 吉橋
正博 吉橋
恒彦 雨宮
恒彦 雨宮
白数　廣
廣 白数
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2010000813A priority Critical patent/JP5671799B2/ja
Publication of JP2011142140A publication Critical patent/JP2011142140A/ja
Publication of JP2011142140A5 publication Critical patent/JP2011142140A5/ja
Application granted granted Critical
Publication of JP5671799B2 publication Critical patent/JP5671799B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010000813A 2010-01-05 2010-01-05 ホルダラック Expired - Fee Related JP5671799B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010000813A JP5671799B2 (ja) 2010-01-05 2010-01-05 ホルダラック

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010000813A JP5671799B2 (ja) 2010-01-05 2010-01-05 ホルダラック

Publications (3)

Publication Number Publication Date
JP2011142140A JP2011142140A (ja) 2011-07-21
JP2011142140A5 JP2011142140A5 (https=) 2013-02-28
JP5671799B2 true JP5671799B2 (ja) 2015-02-18

Family

ID=44457803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010000813A Expired - Fee Related JP5671799B2 (ja) 2010-01-05 2010-01-05 ホルダラック

Country Status (1)

Country Link
JP (1) JP5671799B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013041877A (ja) * 2011-08-11 2013-02-28 Nikon Corp 管理装置、基板接合装置および管理方法
CN105960703B (zh) * 2014-02-03 2019-12-03 Ev 集团 E·索尔纳有限责任公司 用于结合基体的方法及装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07249676A (ja) * 1994-03-10 1995-09-26 Fujitsu Ltd レチクル保管方法とその装置
JPH11307610A (ja) * 1998-04-22 1999-11-05 Nikon Corp 基板搬送装置及び露光装置
JP2006332563A (ja) * 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP5305220B2 (ja) * 2007-11-12 2013-10-02 株式会社ニコン 基板張り合わせ装置
JP4845916B2 (ja) * 2008-03-27 2011-12-28 信越ポリマー株式会社 半導体ウェーハのマッピング方法
JP4488255B2 (ja) * 2008-05-27 2010-06-23 Ｔｄｋ株式会社 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法
JP5476705B2 (ja) * 2008-11-21 2014-04-23 株式会社ニコン 積層半導体製造装置、積層半導体製造方法および基板ホルダラック

Also Published As

Publication number Publication date
JP2011142140A (ja) 2011-07-21

Similar Documents

Publication Publication Date Title
JP6051523B2 (ja) 基板ホルダ対、基板接合装置およびデバイスの製造方法
JP5549344B2 (ja) 基板接合装置、基板ホルダ、基板接合方法、デバイス製造方法および位置合わせ装置
JP5477053B2 (ja) 重ね合わせ装置、ウェハホルダ、位置検出方法およびデバイスの製造方法
JP5754261B2 (ja) 基板貼り合わせ装置、基板貼り合わせ方法および積層半導体装置の製造方法
JP5370903B2 (ja) 基板貼り合わせ方法
JP5445160B2 (ja) ウェハ処理装置、ウェハ処理方法およびデバイスの製造方法
JP5671799B2 (ja) ホルダラック
JP5707793B2 (ja) 基板貼り合せ装置、基板貼り合せ方法および積層半導体装置製造方法
JP5600952B2 (ja) 位置検出装置、基板貼り合わせ装置、位置検出方法、基板貼り合わせ方法、及びデバイスの製造方法
JP5428638B2 (ja) ステージ装置、基板貼り合わせ装置、基板貼り合わせ方法、半導体製造方法および基板ホルダ
JP5707950B2 (ja) 基板重ね合わせ装置および基板重ね合わせ方法
JP5476705B2 (ja) 積層半導体製造装置、積層半導体製造方法および基板ホルダラック
JP5459025B2 (ja) 基板貼り合わせ装置、積層半導体装置製造方法、積層半導体装置、基板貼り合わせ方法及び積層半導体装置の製造方法
JP5493713B2 (ja) 基板ホルダ、基板貼り合わせ装置、基板ホルダ対および搬送装置
JP2011100901A (ja) 半導体デバイスの製造方法および搬送装置
JP2012054416A (ja) 押圧装置、貼り合わせ装置、貼り合わせ方法、及び、積層半導体装置の製造方法
JP5626710B2 (ja) 基板貼り合わせ方法及び基板貼り合わせ装置
JP5780002B2 (ja) 基板貼り合わせ装置及び基板貼り合わせ方法
JP5614081B2 (ja) 基板位置合わせ装置、基板位置合わせ方法、基板貼り合わせ装置、積層半導体装置製造方法及び積層半導体装置
JP5549335B2 (ja) 基板観察装置およびデバイスの製造方法
JP2011129777A (ja) 基板重ね合わせ装置及びデバイスの製造方法
JP2011142141A (ja) ホルダメンテナンス装置
JP5971367B2 (ja) 基板重ね合わせ装置および基板重ね合わせ方法
JP2013026555A (ja) 管理装置
JP2012124323A (ja) 基板ホルダ、貼り合せシステム、積層半導体装置の製造方法及び積層半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130109

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140415

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140613

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20141125

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20141208

R150 Certificate of patent or registration of utility model

Ref document number: 5671799

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees