JP5649942B2 - プラズマ溶射装置 - Google Patents

プラズマ溶射装置 Download PDF

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Publication number
JP5649942B2
JP5649942B2 JP2010276142A JP2010276142A JP5649942B2 JP 5649942 B2 JP5649942 B2 JP 5649942B2 JP 2010276142 A JP2010276142 A JP 2010276142A JP 2010276142 A JP2010276142 A JP 2010276142A JP 5649942 B2 JP5649942 B2 JP 5649942B2
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JP
Japan
Prior art keywords
gas
wire
primary
nozzle
plasma
Prior art date
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JP2010276142A
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English (en)
Japanese (ja)
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JP2012121009A (ja
Inventor
正信 ▲杉▼本
正信 ▲杉▼本
謙一 山田
謙一 山田
政信 入江
政信 入江
Original Assignee
株式会社フジエンジニアリング
株式会社富士技建
西日本高速道路株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社フジエンジニアリング, 株式会社富士技建, 西日本高速道路株式会社 filed Critical 株式会社フジエンジニアリング
Priority to JP2010276142A priority Critical patent/JP5649942B2/ja
Priority to TW100145036A priority patent/TWI650182B/zh
Priority to KR1020110131022A priority patent/KR101817626B1/ko
Priority to CN201110409985.XA priority patent/CN102534458B/zh
Publication of JP2012121009A publication Critical patent/JP2012121009A/ja
Application granted granted Critical
Publication of JP5649942B2 publication Critical patent/JP5649942B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying

Landscapes

  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Nozzles (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Plasma Technology (AREA)
JP2010276142A 2010-12-10 2010-12-10 プラズマ溶射装置 Active JP5649942B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010276142A JP5649942B2 (ja) 2010-12-10 2010-12-10 プラズマ溶射装置
TW100145036A TWI650182B (zh) 2010-12-10 2011-12-07 電漿噴塗裝置
KR1020110131022A KR101817626B1 (ko) 2010-12-10 2011-12-08 플라즈마 용사 장치
CN201110409985.XA CN102534458B (zh) 2010-12-10 2011-12-09 等离子体喷镀装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010276142A JP5649942B2 (ja) 2010-12-10 2010-12-10 プラズマ溶射装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014227290A Division JP5960229B2 (ja) 2014-11-07 2014-11-07 プラズマ溶射装置

Publications (2)

Publication Number Publication Date
JP2012121009A JP2012121009A (ja) 2012-06-28
JP5649942B2 true JP5649942B2 (ja) 2015-01-07

Family

ID=46342470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010276142A Active JP5649942B2 (ja) 2010-12-10 2010-12-10 プラズマ溶射装置

Country Status (4)

Country Link
JP (1) JP5649942B2 (zh)
KR (1) KR101817626B1 (zh)
CN (1) CN102534458B (zh)
TW (1) TWI650182B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015091602A (ja) * 2014-11-07 2015-05-14 株式会社フジエンジニアリング プラズマ溶射装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109465526B (zh) * 2018-12-12 2021-04-06 江苏徐工工程机械研究院有限公司 一种小角度填丝等离子焊接装置及方法
KR102607741B1 (ko) * 2021-11-10 2023-11-29 한양대학교 에리카산학협력단 금속 와이어 및 금속 파우더를 이용한 금속 용사 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5913307B2 (ja) * 1976-05-19 1984-03-28 三菱電機株式会社 溶接方法
JP2766680B2 (ja) * 1989-08-04 1998-06-18 大阪電気株式会社 プラズマワイヤ溶射加工方法およびその装置
JPH0641039B2 (ja) * 1989-12-20 1994-06-01 特殊電極株式会社 プラズマアーク溶接法
JP3261518B2 (ja) * 1996-05-22 2002-03-04 島津工業有限会社 プラズマアークトーチ
JP2008229641A (ja) * 2007-03-19 2008-10-02 Daihen Corp プラズマミグ溶接方法
JP2008229705A (ja) * 2007-03-23 2008-10-02 Daihen Corp プラズマｇｍａ溶接トーチおよびプラズマｇｍａ溶接方法
JP5512501B2 (ja) * 2010-12-10 2014-06-04 株式会社フジエンジニアリング プラズマ溶射装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015091602A (ja) * 2014-11-07 2015-05-14 株式会社フジエンジニアリング プラズマ溶射装置

Also Published As

Publication number Publication date
CN102534458A (zh) 2012-07-04
TW201233449A (en) 2012-08-16
CN102534458B (zh) 2015-10-21
JP2012121009A (ja) 2012-06-28
KR20120065251A (ko) 2012-06-20
KR101817626B1 (ko) 2018-01-11
TWI650182B (zh) 2019-02-11

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