JP5645508B2 - 電子構成部材を作製する方法および電子構成部材 - Google Patents

電子構成部材を作製する方法および電子構成部材 Download PDF

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Publication number
JP5645508B2
JP5645508B2 JP2010148570A JP2010148570A JP5645508B2 JP 5645508 B2 JP5645508 B2 JP 5645508B2 JP 2010148570 A JP2010148570 A JP 2010148570A JP 2010148570 A JP2010148570 A JP 2010148570A JP 5645508 B2 JP5645508 B2 JP 5645508B2
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JP
Japan
Prior art keywords
coating
electronic component
support device
component
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010148570A
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English (en)
Japanese (ja)
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JP2011011548A5 (https=
JP2011011548A (ja
Inventor
ラッツェル ヴォルフ−インゴ
ラッツェル ヴォルフ−インゴ
ルートヴィヒ マティアス
ルートヴィヒ マティアス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2011011548A publication Critical patent/JP2011011548A/ja
Publication of JP2011011548A5 publication Critical patent/JP2011011548A5/ja
Application granted granted Critical
Publication of JP5645508B2 publication Critical patent/JP5645508B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2010148570A 2009-07-01 2010-06-30 電子構成部材を作製する方法および電子構成部材 Expired - Fee Related JP5645508B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009027391A DE102009027391A1 (de) 2009-07-01 2009-07-01 Verfahren zur Herstellung eines elektronischen Bauteils
DE102009027391.3 2009-07-01

Publications (3)

Publication Number Publication Date
JP2011011548A JP2011011548A (ja) 2011-01-20
JP2011011548A5 JP2011011548A5 (https=) 2013-05-02
JP5645508B2 true JP5645508B2 (ja) 2014-12-24

Family

ID=43412198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010148570A Expired - Fee Related JP5645508B2 (ja) 2009-07-01 2010-06-30 電子構成部材を作製する方法および電子構成部材

Country Status (5)

Country Link
US (1) US20110001262A1 (https=)
JP (1) JP5645508B2 (https=)
CN (1) CN101941674B (https=)
DE (1) DE102009027391A1 (https=)
FR (1) FR2948115B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013224296A1 (de) * 2013-11-27 2015-05-28 Robert Bosch Gmbh Elektrische Steckvorrichtung zum Anschluss einer Magnetspule und/oder eines Sensorelements
KR101779005B1 (ko) * 2016-06-16 2017-09-18 한국단자공업 주식회사 감지장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
US5692973A (en) * 1995-06-07 1997-12-02 Acushnet Company Golf ball
JPH11254477A (ja) * 1998-03-13 1999-09-21 Mitsubishi Eng Plast Corp 電気・電子部品の樹脂封止成形品の製造方法
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7390551B2 (en) * 2004-07-02 2008-06-24 Caterpillar Inc. System and method for encapsulation and protection of components
CN100589245C (zh) * 2006-07-20 2010-02-10 日月光封装测试(上海)有限公司 一种多芯片封装结构的封装方法
US7837917B2 (en) * 2006-08-30 2010-11-23 Lrm Industries International, Inc. Method of forming a molded plastic article having molded extensions
US20080277747A1 (en) * 2007-05-08 2008-11-13 Nazir Ahmad MEMS device support structure for sensor packaging

Also Published As

Publication number Publication date
DE102009027391A1 (de) 2011-03-17
JP2011011548A (ja) 2011-01-20
CN101941674B (zh) 2016-09-21
US20110001262A1 (en) 2011-01-06
FR2948115B1 (fr) 2016-06-10
FR2948115A1 (fr) 2011-01-21
CN101941674A (zh) 2011-01-12

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