FR2948115B1 - Procede de fabrication d'un composant electronique - Google Patents
Procede de fabrication d'un composant electroniqueInfo
- Publication number
- FR2948115B1 FR2948115B1 FR1055190A FR1055190A FR2948115B1 FR 2948115 B1 FR2948115 B1 FR 2948115B1 FR 1055190 A FR1055190 A FR 1055190A FR 1055190 A FR1055190 A FR 1055190A FR 2948115 B1 FR2948115 B1 FR 2948115B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- electronic component
- electronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Micromachines (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009027391A DE102009027391A1 (de) | 2009-07-01 | 2009-07-01 | Verfahren zur Herstellung eines elektronischen Bauteils |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2948115A1 FR2948115A1 (fr) | 2011-01-21 |
FR2948115B1 true FR2948115B1 (fr) | 2016-06-10 |
Family
ID=43412198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1055190A Expired - Fee Related FR2948115B1 (fr) | 2009-07-01 | 2010-06-29 | Procede de fabrication d'un composant electronique |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110001262A1 (fr) |
JP (1) | JP5645508B2 (fr) |
CN (1) | CN101941674B (fr) |
DE (1) | DE102009027391A1 (fr) |
FR (1) | FR2948115B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013224296A1 (de) * | 2013-11-27 | 2015-05-28 | Robert Bosch Gmbh | Elektrische Steckvorrichtung zum Anschluss einer Magnetspule und/oder eines Sensorelements |
KR101779005B1 (ko) * | 2016-06-16 | 2017-09-18 | 한국단자공업 주식회사 | 감지장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0361194A3 (fr) * | 1988-09-30 | 1991-06-12 | Siemens Aktiengesellschaft | Procédé pour enrober des composants ou assemblages de composants électriques ou électroniques et enrobage pour des composants ou assemblages de composants électriques ou électroniques |
US5692973A (en) * | 1995-06-07 | 1997-12-02 | Acushnet Company | Golf ball |
JPH11254477A (ja) * | 1998-03-13 | 1999-09-21 | Mitsubishi Eng Plast Corp | 電気・電子部品の樹脂封止成形品の製造方法 |
DE19841498C2 (de) * | 1998-09-10 | 2002-02-21 | Beru Ag | Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors |
US7390551B2 (en) * | 2004-07-02 | 2008-06-24 | Caterpillar Inc. | System and method for encapsulation and protection of components |
CN100589245C (zh) * | 2006-07-20 | 2010-02-10 | 日月光封装测试(上海)有限公司 | 一种多芯片封装结构的封装方法 |
US7837917B2 (en) * | 2006-08-30 | 2010-11-23 | Lrm Industries International, Inc. | Method of forming a molded plastic article having molded extensions |
US20080277747A1 (en) * | 2007-05-08 | 2008-11-13 | Nazir Ahmad | MEMS device support structure for sensor packaging |
-
2009
- 2009-07-01 DE DE102009027391A patent/DE102009027391A1/de not_active Ceased
-
2010
- 2010-06-14 US US12/802,807 patent/US20110001262A1/en not_active Abandoned
- 2010-06-29 FR FR1055190A patent/FR2948115B1/fr not_active Expired - Fee Related
- 2010-06-30 JP JP2010148570A patent/JP5645508B2/ja not_active Expired - Fee Related
- 2010-06-30 CN CN201010221261.8A patent/CN101941674B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102009027391A1 (de) | 2011-03-17 |
JP5645508B2 (ja) | 2014-12-24 |
CN101941674A (zh) | 2011-01-12 |
CN101941674B (zh) | 2016-09-21 |
FR2948115A1 (fr) | 2011-01-21 |
JP2011011548A (ja) | 2011-01-20 |
US20110001262A1 (en) | 2011-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 6 |
|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
ST | Notification of lapse |
Effective date: 20200205 |