FR2923671B1 - Procede de fabrication d'un composant a fonction electronique. - Google Patents
Procede de fabrication d'un composant a fonction electronique.Info
- Publication number
- FR2923671B1 FR2923671B1 FR0707976A FR0707976A FR2923671B1 FR 2923671 B1 FR2923671 B1 FR 2923671B1 FR 0707976 A FR0707976 A FR 0707976A FR 0707976 A FR0707976 A FR 0707976A FR 2923671 B1 FR2923671 B1 FR 2923671B1
- Authority
- FR
- France
- Prior art keywords
- electronic function
- manufacturing component
- manufacturing
- component
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0707976A FR2923671B1 (fr) | 2007-11-13 | 2007-11-13 | Procede de fabrication d'un composant a fonction electronique. |
EP08871932.3A EP2210457B1 (fr) | 2007-11-13 | 2008-11-12 | Procédé de fabrication d'un composant à fonction électronique |
PCT/FR2008/001590 WO2009095559A2 (fr) | 2007-11-13 | 2008-11-12 | Procédé de fabrication d'un composant à fonction électronique |
US12/742,565 US20100294549A1 (en) | 2007-11-13 | 2008-11-12 | Method for making a component having an electronic function |
ES08871932.3T ES2490166T3 (es) | 2007-11-13 | 2008-11-12 | Procedimiento de fabricación de un componente con función electrónica |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0707976A FR2923671B1 (fr) | 2007-11-13 | 2007-11-13 | Procede de fabrication d'un composant a fonction electronique. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2923671A1 FR2923671A1 (fr) | 2009-05-15 |
FR2923671B1 true FR2923671B1 (fr) | 2010-08-27 |
Family
ID=39530162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0707976A Expired - Fee Related FR2923671B1 (fr) | 2007-11-13 | 2007-11-13 | Procede de fabrication d'un composant a fonction electronique. |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100294549A1 (fr) |
EP (1) | EP2210457B1 (fr) |
ES (1) | ES2490166T3 (fr) |
FR (1) | FR2923671B1 (fr) |
WO (1) | WO2009095559A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2381451B1 (fr) | 2010-04-22 | 2018-08-01 | Epcos AG | Procédé de production d'un composant électrique multicouches et composant électrique multicouches |
CN103717378B (zh) | 2011-06-02 | 2016-04-27 | A·雷蒙德公司 | 通过三维印刷制造的紧固件 |
US8916085B2 (en) | 2011-06-02 | 2014-12-23 | A. Raymond Et Cie | Process of making a component with a passageway |
US8883064B2 (en) | 2011-06-02 | 2014-11-11 | A. Raymond & Cie | Method of making printed fastener |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6835473B2 (en) * | 2001-12-06 | 2004-12-28 | Konica Corporation | Organic electroluminescence element and display |
JP3805273B2 (ja) * | 2002-03-29 | 2006-08-02 | Uht株式会社 | 積層型電子部品の製造装置 |
JP2003318133A (ja) * | 2002-04-22 | 2003-11-07 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体 |
FR2859128B1 (fr) * | 2003-08-29 | 2006-03-10 | Centre Nat Rech Scient | Procede et dispositif de fabrication d'un composant multimateriaux tridimensionnel par impression du type jet d'encre |
JP2005081335A (ja) * | 2003-09-11 | 2005-03-31 | Seiko Epson Corp | パターン形成方法、導電性薄膜、電気光学装置、電子機器 |
US7229936B2 (en) * | 2004-05-03 | 2007-06-12 | International Business Machines Corporation | Method to reduce photoresist pattern collapse by controlled surface microroughening |
WO2006076610A2 (fr) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Controle de la migration d'encre lors de la formation d'elements electroniques imprimables |
KR100663941B1 (ko) * | 2005-03-30 | 2007-01-02 | 삼성전기주식회사 | 어레이형 적층 세라믹 콘덴서 및 그 제조 방법 |
TWI270901B (en) * | 2005-09-16 | 2007-01-11 | Ctech Technology Corp | Solid capacitor and fabrication method thereof |
-
2007
- 2007-11-13 FR FR0707976A patent/FR2923671B1/fr not_active Expired - Fee Related
-
2008
- 2008-11-12 US US12/742,565 patent/US20100294549A1/en not_active Abandoned
- 2008-11-12 EP EP08871932.3A patent/EP2210457B1/fr not_active Not-in-force
- 2008-11-12 ES ES08871932.3T patent/ES2490166T3/es active Active
- 2008-11-12 WO PCT/FR2008/001590 patent/WO2009095559A2/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2009095559A2 (fr) | 2009-08-06 |
EP2210457A2 (fr) | 2010-07-28 |
WO2009095559A3 (fr) | 2009-11-05 |
ES2490166T3 (es) | 2014-09-03 |
FR2923671A1 (fr) | 2009-05-15 |
US20100294549A1 (en) | 2010-11-25 |
EP2210457B1 (fr) | 2014-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20160729 |