CN101941674B - 用于制造电子部件的方法 - Google Patents

用于制造电子部件的方法 Download PDF

Info

Publication number
CN101941674B
CN101941674B CN201010221261.8A CN201010221261A CN101941674B CN 101941674 B CN101941674 B CN 101941674B CN 201010221261 A CN201010221261 A CN 201010221261A CN 101941674 B CN101941674 B CN 101941674B
Authority
CN
China
Prior art keywords
coating
receiving device
cladding
microstructured
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010221261.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN101941674A (zh
Inventor
W-I·拉策尔
M·路德维希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN101941674A publication Critical patent/CN101941674A/zh
Application granted granted Critical
Publication of CN101941674B publication Critical patent/CN101941674B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201010221261.8A 2009-07-01 2010-06-30 用于制造电子部件的方法 Expired - Fee Related CN101941674B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009027391A DE102009027391A1 (de) 2009-07-01 2009-07-01 Verfahren zur Herstellung eines elektronischen Bauteils
DE102009027391.3 2009-07-01

Publications (2)

Publication Number Publication Date
CN101941674A CN101941674A (zh) 2011-01-12
CN101941674B true CN101941674B (zh) 2016-09-21

Family

ID=43412198

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010221261.8A Expired - Fee Related CN101941674B (zh) 2009-07-01 2010-06-30 用于制造电子部件的方法

Country Status (5)

Country Link
US (1) US20110001262A1 (https=)
JP (1) JP5645508B2 (https=)
CN (1) CN101941674B (https=)
DE (1) DE102009027391A1 (https=)
FR (1) FR2948115B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013224296A1 (de) * 2013-11-27 2015-05-28 Robert Bosch Gmbh Elektrische Steckvorrichtung zum Anschluss einer Magnetspule und/oder eines Sensorelements
KR101779005B1 (ko) * 2016-06-16 2017-09-18 한국단자공업 주식회사 감지장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5692973A (en) * 1995-06-07 1997-12-02 Acushnet Company Golf ball
US6506328B1 (en) * 1998-09-10 2003-01-14 Beru G Process for producing an electronic component
CN101110406A (zh) * 2006-07-20 2008-01-23 威宇科技测试封装有限公司 一种多芯片封装结构及其封装方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
JPH11254477A (ja) * 1998-03-13 1999-09-21 Mitsubishi Eng Plast Corp 電気・電子部品の樹脂封止成形品の製造方法
US7390551B2 (en) * 2004-07-02 2008-06-24 Caterpillar Inc. System and method for encapsulation and protection of components
US7837917B2 (en) * 2006-08-30 2010-11-23 Lrm Industries International, Inc. Method of forming a molded plastic article having molded extensions
US20080277747A1 (en) * 2007-05-08 2008-11-13 Nazir Ahmad MEMS device support structure for sensor packaging

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5692973A (en) * 1995-06-07 1997-12-02 Acushnet Company Golf ball
US6506328B1 (en) * 1998-09-10 2003-01-14 Beru G Process for producing an electronic component
CN101110406A (zh) * 2006-07-20 2008-01-23 威宇科技测试封装有限公司 一种多芯片封装结构及其封装方法

Also Published As

Publication number Publication date
DE102009027391A1 (de) 2011-03-17
JP5645508B2 (ja) 2014-12-24
JP2011011548A (ja) 2011-01-20
US20110001262A1 (en) 2011-01-06
FR2948115B1 (fr) 2016-06-10
FR2948115A1 (fr) 2011-01-21
CN101941674A (zh) 2011-01-12

Similar Documents

Publication Publication Date Title
CN101616556B (zh) 电子装置的壳体及其制造方法
JP5815315B2 (ja) 圧力センサならびに圧力センサの作製方法
US8688176B2 (en) Components with mechanically-bonded plastic and methods for forming such components
RU2538353C2 (ru) Соединительное устройство для датчика и датчик
CN102933365A (zh) 用于通过注射成型生产树脂成型制品的方法和注射成型设备
CN106099468B (zh) 连接器及其制造方法
JP6256208B2 (ja) 樹脂成形体付きケーブルの製造方法及び樹脂成形体付きケーブル
JP4767955B2 (ja) 連結可能な圧力又は温度センサを有する成形装置
CN102474035B (zh) 用于电导体的连接部件和用于包覆该连接部件的方法
CN101941674B (zh) 用于制造电子部件的方法
US20200223135A1 (en) Additively manufactured components having a non-planar inclusion
JP2011040257A (ja) コネクタの製造方法
CN103336139B (zh) 模块化传感器及其制造工艺
CN102460666A (zh) 电子组件的制造方法及电子组件
US20110044375A1 (en) Sensing device for detecting a physical quantity and method for producing said sensor
JP5768287B2 (ja) 車載用電子モジュールの樹脂モールド方法
JP2013243251A (ja) 電子モジュール及び電子モジュールの製造方法
CN108025756A (zh) 车辆方向盘
JP2016004702A (ja) モールド成形体付きケーブルの製造方法及びモールド成形体付きケーブル
KR20180041206A (ko) 자동차용 전기 부품 장착형 측정 센서
CN101320700B (zh) 制造具有树脂模制外壳的电子装置的方法及模制工具
CN104067453B (zh) 内置复合件
CN106029327B (zh) 成形机和成形方法
CN206098848U (zh) 连接件、电连接器及连接端子集合体
CN206076570U (zh) 连接件、电连接器及连接端子集合体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160921

Termination date: 20190630