JP2011011548A5 - - Google Patents

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Publication number
JP2011011548A5
JP2011011548A5 JP2010148570A JP2010148570A JP2011011548A5 JP 2011011548 A5 JP2011011548 A5 JP 2011011548A5 JP 2010148570 A JP2010148570 A JP 2010148570A JP 2010148570 A JP2010148570 A JP 2010148570A JP 2011011548 A5 JP2011011548 A5 JP 2011011548A5
Authority
JP
Japan
Prior art keywords
coating
support device
electronic component
component
overmolding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010148570A
Other languages
English (en)
Japanese (ja)
Other versions
JP5645508B2 (ja
JP2011011548A (ja
Filing date
Publication date
Priority claimed from DE102009027391A external-priority patent/DE102009027391A1/de
Application filed filed Critical
Publication of JP2011011548A publication Critical patent/JP2011011548A/ja
Publication of JP2011011548A5 publication Critical patent/JP2011011548A5/ja
Application granted granted Critical
Publication of JP5645508B2 publication Critical patent/JP5645508B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010148570A 2009-07-01 2010-06-30 電子構成部材を作製する方法および電子構成部材 Expired - Fee Related JP5645508B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009027391A DE102009027391A1 (de) 2009-07-01 2009-07-01 Verfahren zur Herstellung eines elektronischen Bauteils
DE102009027391.3 2009-07-01

Publications (3)

Publication Number Publication Date
JP2011011548A JP2011011548A (ja) 2011-01-20
JP2011011548A5 true JP2011011548A5 (https=) 2013-05-02
JP5645508B2 JP5645508B2 (ja) 2014-12-24

Family

ID=43412198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010148570A Expired - Fee Related JP5645508B2 (ja) 2009-07-01 2010-06-30 電子構成部材を作製する方法および電子構成部材

Country Status (5)

Country Link
US (1) US20110001262A1 (https=)
JP (1) JP5645508B2 (https=)
CN (1) CN101941674B (https=)
DE (1) DE102009027391A1 (https=)
FR (1) FR2948115B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013224296A1 (de) * 2013-11-27 2015-05-28 Robert Bosch Gmbh Elektrische Steckvorrichtung zum Anschluss einer Magnetspule und/oder eines Sensorelements
KR101779005B1 (ko) * 2016-06-16 2017-09-18 한국단자공업 주식회사 감지장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
US5692973A (en) * 1995-06-07 1997-12-02 Acushnet Company Golf ball
JPH11254477A (ja) * 1998-03-13 1999-09-21 Mitsubishi Eng Plast Corp 電気・電子部品の樹脂封止成形品の製造方法
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
US7390551B2 (en) * 2004-07-02 2008-06-24 Caterpillar Inc. System and method for encapsulation and protection of components
CN100589245C (zh) * 2006-07-20 2010-02-10 日月光封装测试(上海)有限公司 一种多芯片封装结构的封装方法
US7837917B2 (en) * 2006-08-30 2010-11-23 Lrm Industries International, Inc. Method of forming a molded plastic article having molded extensions
US20080277747A1 (en) * 2007-05-08 2008-11-13 Nazir Ahmad MEMS device support structure for sensor packaging

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