GB2516148A - Method and device for encapsulating electronic components using a reduction material which undergoes a phase change - Google Patents

Method and device for encapsulating electronic components using a reduction material which undergoes a phase change Download PDF

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Publication number
GB2516148A
GB2516148A GB1407324.1A GB201407324A GB2516148A GB 2516148 A GB2516148 A GB 2516148A GB 201407324 A GB201407324 A GB 201407324A GB 2516148 A GB2516148 A GB 2516148A
Authority
GB
United Kingdom
Prior art keywords
encapsulating
undergoes
phase change
electronic components
reduction material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1407324.1A
Other versions
GB201407324D0 (en
GB2516148B (en
Inventor
Joannes Leonardus Jurrian Zijl
Wilhelmus Gerardus Jozef Gal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Netherlands BV
Original Assignee
Besi Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands BV filed Critical Besi Netherlands BV
Publication of GB201407324D0 publication Critical patent/GB201407324D0/en
Publication of GB2516148A publication Critical patent/GB2516148A/en
Application granted granted Critical
Publication of GB2516148B publication Critical patent/GB2516148B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1701—Component parts, details or accessories; Auxiliary operations using a particular environment during moulding, e.g. moisture-free or dust-free
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/005—Using a particular environment, e.g. sterile fluids other than air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and C) at least partially curing the encapsulating material in the mould cavity A reduction material is introduced during processing step B). Said material undergoes a phase change during processing step B) whereby the volume of the reduction material decreases. The invention also relates to a device for applying this method.
GB1407324.1A 2011-10-18 2012-10-18 Method and device for encapsulating electronic components using a reduction material which undergoes a phase change Expired - Fee Related GB2516148B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2007614A NL2007614C2 (en) 2011-10-18 2011-10-18 METHOD AND DEVICE FOR COVERING ELECTRONIC COMPONENTS USING A REDUCTION MATERIAL UNDERTAKING A PHASE TRANSITION
PCT/NL2012/050724 WO2013066162A1 (en) 2011-10-18 2012-10-18 Method and device for encapsulating electronic components using a reduction material which undergoes a phase change

Publications (3)

Publication Number Publication Date
GB201407324D0 GB201407324D0 (en) 2014-06-11
GB2516148A true GB2516148A (en) 2015-01-14
GB2516148B GB2516148B (en) 2016-10-26

Family

ID=47116232

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1407324.1A Expired - Fee Related GB2516148B (en) 2011-10-18 2012-10-18 Method and device for encapsulating electronic components using a reduction material which undergoes a phase change

Country Status (9)

Country Link
JP (1) JP6133879B2 (en)
KR (1) KR102017672B1 (en)
CN (1) CN103874569B (en)
DE (1) DE112012004392B4 (en)
GB (1) GB2516148B (en)
MY (1) MY165079A (en)
NL (1) NL2007614C2 (en)
SG (1) SG2014011431A (en)
WO (1) WO2013066162A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2016011B1 (en) * 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
DE102017216711A1 (en) * 2017-09-21 2019-03-21 Robert Bosch Gmbh Apparatus and method for the production of at least partially covered with a casting material components

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1554851A1 (en) * 1966-04-16 1970-01-22 Phoenix Gummiwerke Ag Method for injecting a plastic rubber or plastic mixture into a hollow mold
JPS6297812A (en) * 1985-10-23 1987-05-07 Mitsubishi Electric Corp Resin molding
EP0665584A1 (en) * 1994-01-27 1995-08-02 " 3P" Licensing B.V. Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method
JPH0864627A (en) * 1994-08-18 1996-03-08 Towa Kk Storing method for molding die and resin sealing method for electronic device
US20020025352A1 (en) * 2000-08-22 2002-02-28 Fumio Miyajima Method of resin molding and resin molding machine
US20090097139A1 (en) * 2007-10-15 2009-04-16 Masanori Minamio Optical device and manufacturing method thereof
WO2011008098A2 (en) * 2009-07-17 2011-01-20 Fico B.V. Method and device for encapsulating electronic components with controlled gas pressure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427309C2 (en) 1994-08-02 1999-12-02 Ibm Production of a carrier element module for installation in chip cards or other data carrier cards
JP3569224B2 (en) * 2000-12-11 2004-09-22 アピックヤマダ株式会社 Resin sealing method and resin sealing device
JP2006198813A (en) * 2005-01-18 2006-08-03 Hitachi Chem Co Ltd Seal-molding method and seal-molding machine

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1554851A1 (en) * 1966-04-16 1970-01-22 Phoenix Gummiwerke Ag Method for injecting a plastic rubber or plastic mixture into a hollow mold
JPS6297812A (en) * 1985-10-23 1987-05-07 Mitsubishi Electric Corp Resin molding
EP0665584A1 (en) * 1994-01-27 1995-08-02 " 3P" Licensing B.V. Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method
JPH0864627A (en) * 1994-08-18 1996-03-08 Towa Kk Storing method for molding die and resin sealing method for electronic device
US20020025352A1 (en) * 2000-08-22 2002-02-28 Fumio Miyajima Method of resin molding and resin molding machine
US20090097139A1 (en) * 2007-10-15 2009-04-16 Masanori Minamio Optical device and manufacturing method thereof
WO2011008098A2 (en) * 2009-07-17 2011-01-20 Fico B.V. Method and device for encapsulating electronic components with controlled gas pressure

Also Published As

Publication number Publication date
NL2007614C2 (en) 2013-04-22
GB201407324D0 (en) 2014-06-11
CN103874569A (en) 2014-06-18
CN103874569B (en) 2017-02-15
MY165079A (en) 2018-02-28
JP6133879B2 (en) 2017-05-24
WO2013066162A1 (en) 2013-05-10
GB2516148B (en) 2016-10-26
KR20140079453A (en) 2014-06-26
DE112012004392T5 (en) 2014-07-10
JP2014530510A (en) 2014-11-17
DE112012004392B4 (en) 2021-10-28
KR102017672B1 (en) 2019-09-03
SG2014011431A (en) 2014-06-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20211018