JP5628808B2 - 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 - Google Patents
荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 Download PDFInfo
- Publication number
- JP5628808B2 JP5628808B2 JP2011523757A JP2011523757A JP5628808B2 JP 5628808 B2 JP5628808 B2 JP 5628808B2 JP 2011523757 A JP2011523757 A JP 2011523757A JP 2011523757 A JP2011523757 A JP 2011523757A JP 5628808 B2 JP5628808 B2 JP 5628808B2
- Authority
- JP
- Japan
- Prior art keywords
- charged particle
- stage
- target
- carrier
- particle beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/026—Shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Details Of Measuring And Other Instruments (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8974408P | 2008-08-18 | 2008-08-18 | |
| US61/089,744 | 2008-08-18 | ||
| NL2001896 | 2008-08-18 | ||
| NL2001896A NL2001896C (en) | 2008-08-18 | 2008-08-18 | Charged particle beam lithography system and target positioning device. |
| PCT/NL2009/050499 WO2010021543A1 (en) | 2008-08-18 | 2009-08-18 | Charged particle beam lithography system and target positioning device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012181421A Division JP5539468B2 (ja) | 2008-08-18 | 2012-08-20 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
| JP2014136143A Division JP6117149B2 (ja) | 2008-08-18 | 2014-07-01 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012500492A JP2012500492A (ja) | 2012-01-05 |
| JP5628808B2 true JP5628808B2 (ja) | 2014-11-19 |
Family
ID=41054033
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011523757A Active JP5628808B2 (ja) | 2008-08-18 | 2009-08-18 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
| JP2012181421A Active JP5539468B2 (ja) | 2008-08-18 | 2012-08-20 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
| JP2014136143A Active JP6117149B2 (ja) | 2008-08-18 | 2014-07-01 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012181421A Active JP5539468B2 (ja) | 2008-08-18 | 2012-08-20 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
| JP2014136143A Active JP6117149B2 (ja) | 2008-08-18 | 2014-07-01 | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 |
Country Status (6)
| Country | Link |
|---|---|
| EP (2) | EP2313908B1 (enExample) |
| JP (3) | JP5628808B2 (enExample) |
| KR (2) | KR101785238B1 (enExample) |
| CN (2) | CN102187424B (enExample) |
| TW (3) | TWI544294B (enExample) |
| WO (1) | WO2010021543A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8796644B2 (en) | 2008-08-18 | 2014-08-05 | Mapper Lithography Ip B.V. | Charged particle beam lithography system and target positioning device |
| CN202793315U (zh) | 2011-03-30 | 2013-03-13 | 迈普尔平版印刷Ip有限公司 | 差分干涉仪模块和具有差分干涉仪模块的光刻系统 |
| JP5955964B2 (ja) | 2011-09-12 | 2016-07-20 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | ターゲット処理ツールのためのガイダンス |
| NL1039797C2 (en) * | 2011-09-12 | 2015-02-09 | Mapper Lithography Ip Bv | Target positioning device, method for driving a target positioning device, and a lithography system comprising such a target positioning device. |
| US9551563B2 (en) | 2012-09-27 | 2017-01-24 | Mapper Lithography Ip B.V. | Multi-axis differential interferometer |
| JP6761279B2 (ja) * | 2016-05-16 | 2020-09-23 | キヤノン株式会社 | 位置決め装置、リソグラフィー装置および物品製造方法 |
| JP2021502669A (ja) * | 2017-11-10 | 2021-01-28 | エーエスエムエル ネザーランズ ビー.ブイ. | 電子ビーム検査ツール、及びオブジェクトテーブルを位置決めする方法 |
| WO2019158448A1 (en) * | 2018-02-14 | 2019-08-22 | Asml Netherlands B.V. | Substrate positioning device and electron beam inspection tool |
| JP7391735B2 (ja) * | 2019-09-25 | 2023-12-05 | 株式会社日立ハイテクサイエンス | 荷電粒子ビーム装置 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4514858A (en) * | 1983-03-15 | 1985-04-30 | Micronix Partners | Lithography system |
| JPH0644093Y2 (ja) * | 1986-01-10 | 1994-11-14 | 東芝機械株式会社 | ステ−ジ駆動装置 |
| JPH0652302B2 (ja) * | 1986-12-01 | 1994-07-06 | キヤノン株式会社 | 直動ステ−ジ |
| JP2960423B2 (ja) * | 1988-11-16 | 1999-10-06 | 株式会社日立製作所 | 試料移動装置及び半導体製造装置 |
| JPH03237709A (ja) * | 1990-02-14 | 1991-10-23 | Mitsubishi Electric Corp | 電子ビーム露光装置 |
| US5684856A (en) * | 1991-09-18 | 1997-11-04 | Canon Kabushiki Kaisha | Stage device and pattern transfer system using the same |
| JP2714502B2 (ja) * | 1991-09-18 | 1998-02-16 | キヤノン株式会社 | 移動ステージ装置 |
| JP2902225B2 (ja) * | 1992-09-30 | 1999-06-07 | キヤノン株式会社 | 位置決め装置 |
| US5806193A (en) * | 1995-11-09 | 1998-09-15 | Nikon Corporation | Tilt and movement apparatus using flexure and air cylinder |
| US5830612A (en) * | 1996-01-24 | 1998-11-03 | Fujitsu Limited | Method of detecting a deficiency in a charged-particle-beam exposure mask |
| JPH09197653A (ja) * | 1996-01-24 | 1997-07-31 | Fujitsu Ltd | 荷電粒子ビーム露光に於けるマスクパターン検査方法及び荷電粒子ビーム露光装置 |
| JPH11191585A (ja) * | 1997-12-26 | 1999-07-13 | Canon Inc | ステージ装置、およびこれを用いた露光装置、ならびにデバイス製造方法 |
| US6559456B1 (en) * | 1998-10-23 | 2003-05-06 | Canon Kabushiki Kaisha | Charged particle beam exposure method and apparatus |
| JP4209983B2 (ja) * | 1999-01-21 | 2009-01-14 | 住友重機械工業株式会社 | ステージ機構 |
| JP2001126651A (ja) * | 1999-10-22 | 2001-05-11 | Hitachi Ltd | 電子ビーム描画装置 |
| DE60032568T2 (de) * | 1999-12-01 | 2007-10-04 | Asml Netherlands B.V. | Positionierungsapparat und damit versehener lithographischer Apparat |
| EP1107067B1 (en) * | 1999-12-01 | 2006-12-27 | ASML Netherlands B.V. | Positioning apparatus and lithographic apparatus comprising the same |
| JP2001344833A (ja) * | 2000-06-01 | 2001-12-14 | Fujitsu Ltd | 電子ビーム描画装置 |
| US20030230729A1 (en) | 2000-12-08 | 2003-12-18 | Novak W. Thomas | Positioning stage with stationary and movable magnet tracks |
| JP2004055767A (ja) * | 2002-07-18 | 2004-02-19 | Canon Inc | 電子ビーム露光装置及び半導体デバイスの製造方法 |
| CN101414125B (zh) * | 2002-10-30 | 2012-02-22 | 迈普尔平版印刷Ip有限公司 | 电子束曝光系统 |
| JP3842203B2 (ja) * | 2002-11-07 | 2006-11-08 | 株式会社荏原製作所 | 基板処理装置 |
| JP2004327121A (ja) * | 2003-04-22 | 2004-11-18 | Ebara Corp | 写像投影方式電子線装置 |
| US7138629B2 (en) * | 2003-04-22 | 2006-11-21 | Ebara Corporation | Testing apparatus using charged particles and device manufacturing method using the testing apparatus |
| JP4426276B2 (ja) * | 2003-10-06 | 2010-03-03 | 住友重機械工業株式会社 | 搬送装置、塗布システム、及び検査システム |
| JP2005235991A (ja) * | 2004-02-19 | 2005-09-02 | Riipuru:Kk | 転写装置 |
| JP2005268268A (ja) * | 2004-03-16 | 2005-09-29 | Canon Inc | 電子ビーム露光装置 |
| US7075093B2 (en) * | 2004-05-12 | 2006-07-11 | Gorski Richard M | Parallel multi-electron beam lithography for IC fabrication with precise X-Y translation |
| US7012264B2 (en) * | 2004-06-04 | 2006-03-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7406367B2 (en) * | 2004-08-26 | 2008-07-29 | Shimano Inc. | Input circuit for bicycle component |
| JP4520426B2 (ja) * | 2005-07-04 | 2010-08-04 | 株式会社ニューフレアテクノロジー | 電子ビームのビームドリフト補正方法及び電子ビームの描画方法 |
| US7348752B1 (en) * | 2006-09-20 | 2008-03-25 | Asml Netherlands B.V. | Stage apparatus and lithographic apparatus |
-
2009
- 2009-08-18 CN CN2009801412805A patent/CN102187424B/zh active Active
- 2009-08-18 KR KR1020167034638A patent/KR101785238B1/ko active Active
- 2009-08-18 WO PCT/NL2009/050499 patent/WO2010021543A1/en not_active Ceased
- 2009-08-18 CN CN201110460373.3A patent/CN102522300B/zh active Active
- 2009-08-18 KR KR1020117006381A patent/KR101690338B1/ko active Active
- 2009-08-18 EP EP09788279.9A patent/EP2313908B1/en active Active
- 2009-08-18 JP JP2011523757A patent/JP5628808B2/ja active Active
- 2009-08-18 TW TW103140402A patent/TWI544294B/zh active
- 2009-08-18 TW TW101129490A patent/TWI468879B/zh active
- 2009-08-18 TW TW98127675A patent/TWI472884B/zh active
- 2009-08-18 EP EP14180524.2A patent/EP2819146B1/en active Active
-
2012
- 2012-08-20 JP JP2012181421A patent/JP5539468B2/ja active Active
-
2014
- 2014-07-01 JP JP2014136143A patent/JP6117149B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI468879B (zh) | 2015-01-11 |
| KR20160145209A (ko) | 2016-12-19 |
| EP2313908B1 (en) | 2014-09-24 |
| JP2013038426A (ja) | 2013-02-21 |
| KR101785238B1 (ko) | 2017-10-12 |
| EP2819146A1 (en) | 2014-12-31 |
| TWI472884B (zh) | 2015-02-11 |
| TW201009519A (en) | 2010-03-01 |
| JP2014238402A (ja) | 2014-12-18 |
| CN102522300B (zh) | 2014-10-15 |
| CN102522300A (zh) | 2012-06-27 |
| KR20110055678A (ko) | 2011-05-25 |
| EP2819146B1 (en) | 2017-11-01 |
| KR101690338B1 (ko) | 2016-12-27 |
| EP2313908A1 (en) | 2011-04-27 |
| TW201250411A (en) | 2012-12-16 |
| WO2010021543A1 (en) | 2010-02-25 |
| JP6117149B2 (ja) | 2017-04-19 |
| TWI544294B (zh) | 2016-08-01 |
| CN102187424B (zh) | 2013-07-17 |
| TW201508425A (zh) | 2015-03-01 |
| JP5539468B2 (ja) | 2014-07-02 |
| JP2012500492A (ja) | 2012-01-05 |
| CN102187424A (zh) | 2011-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6117149B2 (ja) | 荷電粒子ビームリソグラフィシステム及びターゲット位置決め装置 | |
| KR101755059B1 (ko) | 지지 및 위치 결정 구조체, 위치 결정을 위한 반도체 장비 시스템 및 방법 | |
| NL1037639C2 (en) | Lithography system with lens rotation. | |
| US9082584B2 (en) | Charged particle beam lithography system and target positioning device | |
| KR102410976B1 (ko) | 멀티 하전 입자 빔 묘화 장치 및 멀티 하전 입자 빔 묘화 방법 | |
| NL2001896C (en) | Charged particle beam lithography system and target positioning device. | |
| JP7455720B2 (ja) | マルチ荷電粒子ビーム照射装置およびマルチ荷電粒子ビーム照射方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120809 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130912 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130917 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131217 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131225 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140115 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140401 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140630 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140902 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141002 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5628808 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |