JP5609680B2 - 放熱構造及び電子機器 - Google Patents

放熱構造及び電子機器 Download PDF

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Publication number
JP5609680B2
JP5609680B2 JP2011015205A JP2011015205A JP5609680B2 JP 5609680 B2 JP5609680 B2 JP 5609680B2 JP 2011015205 A JP2011015205 A JP 2011015205A JP 2011015205 A JP2011015205 A JP 2011015205A JP 5609680 B2 JP5609680 B2 JP 5609680B2
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JP
Japan
Prior art keywords
heat
circuit board
heat dissipation
chassis
electronic component
Prior art date
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Expired - Fee Related
Application number
JP2011015205A
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English (en)
Japanese (ja)
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JP2012069902A5 (enrdf_load_stackoverflow
JP2012069902A (ja
Inventor
香山　俊
俊 香山
清水　有希子
有希子 清水
義寛 加藤
義寛 加藤
厚秀 埴生
厚秀 埴生
正文 田村
正文 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011015205A priority Critical patent/JP5609680B2/ja
Publication of JP2012069902A publication Critical patent/JP2012069902A/ja
Publication of JP2012069902A5 publication Critical patent/JP2012069902A5/ja
Application granted granted Critical
Publication of JP5609680B2 publication Critical patent/JP5609680B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011015205A 2010-08-27 2011-01-27 放熱構造及び電子機器 Expired - Fee Related JP5609680B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011015205A JP5609680B2 (ja) 2010-08-27 2011-01-27 放熱構造及び電子機器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010191096 2010-08-27
JP2010191096 2010-08-27
JP2011015205A JP5609680B2 (ja) 2010-08-27 2011-01-27 放熱構造及び電子機器

Publications (3)

Publication Number Publication Date
JP2012069902A JP2012069902A (ja) 2012-04-05
JP2012069902A5 JP2012069902A5 (enrdf_load_stackoverflow) 2014-02-27
JP5609680B2 true JP5609680B2 (ja) 2014-10-22

Family

ID=46166754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011015205A Expired - Fee Related JP5609680B2 (ja) 2010-08-27 2011-01-27 放熱構造及び電子機器

Country Status (1)

Country Link
JP (1) JP5609680B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6024297B2 (ja) * 2012-08-30 2016-11-16 株式会社村田製作所 電子機器、電子機器の製造方法
WO2014049898A1 (ja) * 2012-09-26 2014-04-03 パナソニック株式会社 電子機器
US9357677B2 (en) 2012-09-26 2016-05-31 Panasonic Intellectual Property Management Co., Ltd. Electronic device with efficient heat radiation structure for electronic components
CN103415187A (zh) * 2013-07-30 2013-11-27 昆山维金五金制品有限公司 散热结构
JP6492935B2 (ja) * 2015-04-27 2019-04-03 株式会社デンソー 制御装置一体型回転電機
JP6740946B2 (ja) * 2017-03-30 2020-08-19 株式会社オートネットワーク技術研究所 回路装置
WO2020162417A1 (ja) 2019-02-04 2020-08-13 株式会社ソニー・インタラクティブエンタテインメント 電子機器、半導体装置、絶縁シート、及び半導体装置の製造方法
TW202220064A (zh) 2020-09-24 2022-05-16 日商索尼互動娛樂股份有限公司 半導體封裝、電子機器及電子機器的製造方法
JP7444007B2 (ja) * 2020-09-24 2024-03-06 株式会社オートネットワーク技術研究所 基板ユニット
CN118140195A (zh) * 2021-10-27 2024-06-04 松下知识产权经营株式会社 电子设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03255697A (ja) * 1989-12-04 1991-11-14 Hitachi Ltd 集積回路用放熱構造体
JPH09283976A (ja) * 1996-04-08 1997-10-31 Kitagawa Ind Co Ltd 放熱・シールド材
JP2912268B2 (ja) * 1996-12-04 1999-06-28 群馬日本電気株式会社 電子部品の放熱方法および装置
JPH118484A (ja) * 1997-06-16 1999-01-12 Nec Corp 電子機器の放熱構造
JP2000294950A (ja) * 1999-04-09 2000-10-20 Matsushita Electric Ind Co Ltd 高周波装置
JP2001147061A (ja) * 1999-09-08 2001-05-29 Sega Corp 冷却装置を有する電子機器
JP4839244B2 (ja) * 2001-07-30 2011-12-21 日立プラズマディスプレイ株式会社 プラズマディスプレイ装置およびフラットディスプレイ装置
JP4228753B2 (ja) * 2002-04-12 2009-02-25 株式会社デンソー 電子制御装置
JP4075481B2 (ja) * 2002-06-20 2008-04-16 ソニー株式会社 金属−グラファイトシート複合体および電子機器
JP2004241573A (ja) * 2003-02-05 2004-08-26 Seiko Epson Corp 回路基板の放熱構造
JP2007059608A (ja) * 2005-08-24 2007-03-08 Denso Corp 電子制御装置
JP2009026871A (ja) * 2007-07-18 2009-02-05 Denso Corp 電子装置の製造方法
JP2009182942A (ja) * 2008-02-01 2009-08-13 Sharp Corp 電子機器
JP4407759B2 (ja) * 2008-03-04 2010-02-03 株式会社デンソー 電子制御装置

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Publication number Publication date
JP2012069902A (ja) 2012-04-05

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