JP5585784B2 - 積層型電子部品製造装置及び積層型電子部品の製造方法 - Google Patents

積層型電子部品製造装置及び積層型電子部品の製造方法 Download PDF

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Publication number
JP5585784B2
JP5585784B2 JP2011091597A JP2011091597A JP5585784B2 JP 5585784 B2 JP5585784 B2 JP 5585784B2 JP 2011091597 A JP2011091597 A JP 2011091597A JP 2011091597 A JP2011091597 A JP 2011091597A JP 5585784 B2 JP5585784 B2 JP 5585784B2
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forming
ceramic sheet
electrode circuit
dielectric coating
film
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JP2011091597A
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English (en)
Japanese (ja)
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JP2011258933A (ja
Inventor
和久 早川
洋 九鬼
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2011091597A priority Critical patent/JP5585784B2/ja
Priority to TW100116218A priority patent/TW201230098A/zh
Priority to CN201110130340.2A priority patent/CN102315024B/zh
Priority to KR20110044590A priority patent/KR101152765B1/ko
Publication of JP2011258933A publication Critical patent/JP2011258933A/ja
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Publication of JP5585784B2 publication Critical patent/JP5585784B2/ja
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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Producing Shaped Articles From Materials (AREA)
JP2011091597A 2010-05-13 2011-04-15 積層型電子部品製造装置及び積層型電子部品の製造方法 Active JP5585784B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011091597A JP5585784B2 (ja) 2010-05-13 2011-04-15 積層型電子部品製造装置及び積層型電子部品の製造方法
TW100116218A TW201230098A (en) 2010-05-13 2011-05-09 Laminated electronic component manufacturing device and method for manufacturing laminated electronic components
CN201110130340.2A CN102315024B (zh) 2010-05-13 2011-05-12 层叠型电子元器件制造装置及层叠型电子元器件的制造方法
KR20110044590A KR101152765B1 (ko) 2010-05-13 2011-05-12 적층형 전자 부품 제조 장치 및 적층형 전자 부품의 제조 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010111341 2010-05-13
JP2010111341 2010-05-13
JP2011091597A JP5585784B2 (ja) 2010-05-13 2011-04-15 積層型電子部品製造装置及び積層型電子部品の製造方法

Publications (2)

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JP2011258933A JP2011258933A (ja) 2011-12-22
JP5585784B2 true JP5585784B2 (ja) 2014-09-10

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JP2011091597A Active JP5585784B2 (ja) 2010-05-13 2011-04-15 積層型電子部品製造装置及び積層型電子部品の製造方法

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JP (1) JP5585784B2 (zh)
TW (1) TW201230098A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5796610B2 (ja) * 2013-08-14 2015-10-21 株式会社村田製作所 セラミック積層体の製造装置及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2629857B2 (ja) * 1988-07-27 1997-07-16 松下電器産業株式会社 積層セラミック電子部品の製造方法
JPH0669066A (ja) * 1992-08-19 1994-03-11 Tdk Corp セラミック電子部品の製造方法
JP3166694B2 (ja) * 1997-12-22 2001-05-14 松下電器産業株式会社 積層セラミック電子部品の製造方法
JP3166693B2 (ja) * 1997-12-22 2001-05-14 松下電器産業株式会社 積層セラミック電子部品の製造方法
JP2002170737A (ja) * 2000-11-30 2002-06-14 Uht Corp セラミック積層体の製造装置
JP3948288B2 (ja) * 2002-01-21 2007-07-25 松下電器産業株式会社 積層型電子部品の積層体作製装置
JP4415554B2 (ja) * 2003-03-26 2010-02-17 株式会社村田製作所 積層セラミック電子部品の製造方法
JP4432450B2 (ja) * 2003-10-22 2010-03-17 株式会社村田製作所 積層型セラミック電子部品の製造方法
JP4046080B2 (ja) * 2003-12-16 2008-02-13 松下電器産業株式会社 積層体製造装置
JP2006168029A (ja) * 2004-12-14 2006-06-29 Matsushita Electric Ind Co Ltd セラミックグリーンシートの製造方法および製造装置
JP2006302932A (ja) * 2005-04-15 2006-11-02 Matsushita Electric Ind Co Ltd 積層型電子部品の製造方法
JP5267260B2 (ja) * 2008-08-08 2013-08-21 株式会社村田製作所 積層セラミック電子部品の製造装置および製造方法

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Publication number Publication date
TWI560729B (zh) 2016-12-01
TW201230098A (en) 2012-07-16
JP2011258933A (ja) 2011-12-22

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