JP5572575B2 - 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体 - Google Patents

基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体 Download PDF

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JP5572575B2
JP5572575B2 JP2011058278A JP2011058278A JP5572575B2 JP 5572575 B2 JP5572575 B2 JP 5572575B2 JP 2011058278 A JP2011058278 A JP 2011058278A JP 2011058278 A JP2011058278 A JP 2011058278A JP 5572575 B2 JP5572575 B2 JP 5572575B2
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substrate
positioning
unit
contact
positioning mechanism
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Japanese (ja)
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JP2011258924A (ja
JP2011258924A5 (enExample
Inventor
嘉文 天野
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2011058278A priority Critical patent/JP5572575B2/ja
Priority to KR1020110032787A priority patent/KR101599086B1/ko
Priority to TW100115790A priority patent/TWI509728B/zh
Priority to US13/104,374 priority patent/US9008817B2/en
Priority to CN201110125137.6A priority patent/CN102244026B/zh
Publication of JP2011258924A publication Critical patent/JP2011258924A/ja
Publication of JP2011258924A5 publication Critical patent/JP2011258924A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011058278A 2010-05-12 2011-03-16 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体 Active JP5572575B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011058278A JP5572575B2 (ja) 2010-05-12 2011-03-16 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
KR1020110032787A KR101599086B1 (ko) 2010-05-12 2011-04-08 기판 위치 결정 장치, 기판 처리 장치, 기판 위치 결정 방법, 및 프로그램을 기록한 기억 매체
TW100115790A TWI509728B (zh) 2010-05-12 2011-05-05 基板定位裝置、基板處理裝置、基板定位方法及記錄有程式之記憶媒體
US13/104,374 US9008817B2 (en) 2010-05-12 2011-05-10 Substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and computer readable medium having a program stored thereon
CN201110125137.6A CN102244026B (zh) 2010-05-12 2011-05-12 基板定位装置、基板处理装置和基板定位方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010110366 2010-05-12
JP2010110366 2010-05-12
JP2011058278A JP5572575B2 (ja) 2010-05-12 2011-03-16 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体

Publications (3)

Publication Number Publication Date
JP2011258924A JP2011258924A (ja) 2011-12-22
JP2011258924A5 JP2011258924A5 (enExample) 2013-04-04
JP5572575B2 true JP5572575B2 (ja) 2014-08-13

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Country Status (5)

Country Link
US (1) US9008817B2 (enExample)
JP (1) JP5572575B2 (enExample)
KR (1) KR101599086B1 (enExample)
CN (1) CN102244026B (enExample)
TW (1) TWI509728B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10727090B2 (en) 2017-05-31 2020-07-28 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

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JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP5243491B2 (ja) * 2010-06-18 2013-07-24 東京エレクトロン株式会社 位置決め装置、基板処理装置及び基準部材の固定方法
JP5727244B2 (ja) * 2011-01-28 2015-06-03 リンテック株式会社 支持装置及び支持方法
JP5996381B2 (ja) * 2011-12-28 2016-09-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5835188B2 (ja) * 2012-11-06 2015-12-24 東京エレクトロン株式会社 基板周縁部の塗布膜除去方法、基板処理装置及び記憶媒体
CN103594406B (zh) * 2013-11-05 2016-08-24 中国电子科技集团公司第四十五研究所 自定心定位卡盘及半导体晶圆的定心定位方法
TWI668795B (zh) * 2014-09-15 2019-08-11 美商瓦里安半導體設備公司 半導體製程用的主動式基板對準系統及對準基板的方法
KR101963336B1 (ko) * 2015-02-04 2019-03-28 카와사키 주코교 카부시키 카이샤 로봇의 편차 자동조정 장치 및 로봇의 편차 자동조정 방법
JP6612670B2 (ja) * 2016-03-31 2019-11-27 東京応化工業株式会社 基板処理装置、及び、基板処理方法
CN108242417B (zh) * 2016-12-26 2020-10-16 北京北方华创微电子装备有限公司 一种手动输送硅片机构
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
CN111217149B (zh) * 2018-11-23 2024-08-27 合肥欣奕华智能机器股份有限公司 一种基板校准装置、基板校准方法及基板搬运装置
JP2022545273A (ja) 2019-08-23 2022-10-26 ラム リサーチ コーポレーション 温度制御型のシャンデリア型シャワーヘッド
JP7426808B2 (ja) 2019-11-27 2024-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
WO2021141718A1 (en) * 2020-01-06 2021-07-15 Lam Research Corporation Showerhead with faceplate having internal contours
JP2022048506A (ja) * 2020-09-15 2022-03-28 株式会社ダイヘン アライナ装置
CN113634401A (zh) * 2021-09-08 2021-11-12 江苏科环新材料有限公司 一种纳米金属涂层加工装置
CN114446848B (zh) * 2021-12-28 2025-06-24 苏州精濑光电有限公司 一种料盒的辅助定位机构
KR102775356B1 (ko) * 2022-12-21 2025-03-06 세메스 주식회사 편심 보정 유닛을 포함한 기판 처리 장치 및 기판 처리 방법
WO2025083774A1 (ja) * 2023-10-17 2025-04-24 株式会社Fukumura エジェクタ及びこれを用いた熱分解炭化処理装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10727090B2 (en) 2017-05-31 2020-07-28 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
TW201205712A (en) 2012-02-01
CN102244026A (zh) 2011-11-16
CN102244026B (zh) 2016-04-20
US20110282484A1 (en) 2011-11-17
JP2011258924A (ja) 2011-12-22
TWI509728B (zh) 2015-11-21
KR101599086B1 (ko) 2016-03-14
US9008817B2 (en) 2015-04-14
KR20110125166A (ko) 2011-11-18

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