JP5564271B2 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP5564271B2
JP5564271B2 JP2010009615A JP2010009615A JP5564271B2 JP 5564271 B2 JP5564271 B2 JP 5564271B2 JP 2010009615 A JP2010009615 A JP 2010009615A JP 2010009615 A JP2010009615 A JP 2010009615A JP 5564271 B2 JP5564271 B2 JP 5564271B2
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JP
Japan
Prior art keywords
vacuum
vacuum processing
chamber
jig
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010009615A
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English (en)
Japanese (ja)
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JP2011151098A5 (cg-RX-API-DMAC7.html
JP2011151098A (ja
Inventor
勤 中村
英宣 谷村
優也 溝部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2010009615A priority Critical patent/JP5564271B2/ja
Priority to US12/712,834 priority patent/US8366370B2/en
Publication of JP2011151098A publication Critical patent/JP2011151098A/ja
Publication of JP2011151098A5 publication Critical patent/JP2011151098A5/ja
Application granted granted Critical
Publication of JP5564271B2 publication Critical patent/JP5564271B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2010009615A 2010-01-20 2010-01-20 真空処理装置 Expired - Fee Related JP5564271B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010009615A JP5564271B2 (ja) 2010-01-20 2010-01-20 真空処理装置
US12/712,834 US8366370B2 (en) 2010-01-20 2010-02-25 Vacuum processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010009615A JP5564271B2 (ja) 2010-01-20 2010-01-20 真空処理装置

Publications (3)

Publication Number Publication Date
JP2011151098A JP2011151098A (ja) 2011-08-04
JP2011151098A5 JP2011151098A5 (cg-RX-API-DMAC7.html) 2013-02-14
JP5564271B2 true JP5564271B2 (ja) 2014-07-30

Family

ID=44277692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010009615A Expired - Fee Related JP5564271B2 (ja) 2010-01-20 2010-01-20 真空処理装置

Country Status (2)

Country Link
US (1) US8366370B2 (cg-RX-API-DMAC7.html)
JP (1) JP5564271B2 (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015017395A1 (en) * 2013-07-30 2015-02-05 Board Of Regents, The University Of Texas System Sample transfer to high vacuum transition flow
JP6293499B2 (ja) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ 真空処理装置
JP6311579B2 (ja) * 2014-11-12 2018-04-18 株式会社ダイフク 物品搬送設備
CA2981800C (en) * 2015-04-13 2023-09-26 Henrik Falk A lifting jig for lifting elements along the facade of a building
CN105834429A (zh) * 2016-06-08 2016-08-10 王艺 一种3d打印机环境状态保持与隔离装置
JP6960830B2 (ja) * 2017-11-17 2021-11-05 株式会社日立ハイテク 真空処理装置および真空処理装置の運転方法
JP6475877B2 (ja) * 2018-02-14 2019-02-27 株式会社日立ハイテクノロジーズ 真空処理装置
JP6666630B2 (ja) * 2019-02-01 2020-03-18 株式会社日立ハイテク 真空処理装置
US11495486B2 (en) 2019-03-01 2022-11-08 Lam Research Corporation Integrated tool lift
CN110527946B (zh) * 2019-09-04 2024-03-19 立讯电子科技（昆山）有限公司 镀膜装置
CN112992633A (zh) * 2019-12-02 2021-06-18 聚昌科技股份有限公司 线圈水平位置可动态调整的蚀刻机结构
US12350739B2 (en) 2019-12-12 2025-07-08 Arcam Ab Additive manufacturing apparatuses with separable process chamber housing portions and methods of use
US11534967B2 (en) 2019-12-12 2022-12-27 Arcam Ab Additive manufacturing apparatuses with powder distributors and methods of use
JP7482746B2 (ja) * 2020-10-19 2024-05-14 東京エレクトロン株式会社 基板処理装置、基板処理システム、及びメンテナンス方法
CN114044289B (zh) * 2021-10-11 2023-03-14 中国科学院沈阳科学仪器股份有限公司 一种真空垂直交接样品传输系统
CN114941124B (zh) * 2022-06-01 2024-04-30 江苏邑文微电子科技有限公司 一种真空晶圆镀膜装置
CN114777490B (zh) * 2022-06-21 2022-09-09 上海陛通半导体能源科技股份有限公司 可实现自动全向开合的半导体设备
CN115547908B (zh) * 2022-11-29 2023-03-28 浙江果纳半导体技术有限公司 一种装载系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745684A (ja) * 1993-07-27 1995-02-14 Kokusai Electric Co Ltd 半導体製造装置の処理室
US5674123A (en) * 1995-07-18 1997-10-07 Semifab Docking and environmental purging system for integrated circuit wafer transport assemblies
JPH11288991A (ja) * 1998-04-03 1999-10-19 Shinko Electric Co Ltd ロードポート
JP3363405B2 (ja) * 1999-03-17 2003-01-08 株式会社日立製作所 プラズマ処理装置およびプラズマ処理装置システム
WO2000060653A1 (en) * 1999-03-30 2000-10-12 Tokyo Electron Limited Plasma treatment device, its maintenance method and its installation method
US6396072B1 (en) * 1999-06-21 2002-05-28 Fortrend Engineering Corporation Load port door assembly with integrated wafer mapper
US6413356B1 (en) * 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
US6866460B2 (en) * 2001-07-16 2005-03-15 Semitool, Inc. Apparatus and method for loading of carriers containing semiconductor wafers and other media
JP4522795B2 (ja) 2003-09-04 2010-08-11 株式会社日立ハイテクノロジーズ 真空処理装置
US7845618B2 (en) * 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US7581916B2 (en) * 2006-07-14 2009-09-01 Ulvac-Phi, Inc. Sample introduction and transfer system and method
JP4309935B2 (ja) * 2007-07-31 2009-08-05 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法

Also Published As

Publication number Publication date
US20110176893A1 (en) 2011-07-21
US8366370B2 (en) 2013-02-05
JP2011151098A (ja) 2011-08-04

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