JP5563983B2 - Photocurable resin composition for bonding optical functional materials together - Google Patents
Photocurable resin composition for bonding optical functional materials together Download PDFInfo
- Publication number
- JP5563983B2 JP5563983B2 JP2010527828A JP2010527828A JP5563983B2 JP 5563983 B2 JP5563983 B2 JP 5563983B2 JP 2010527828 A JP2010527828 A JP 2010527828A JP 2010527828 A JP2010527828 A JP 2010527828A JP 5563983 B2 JP5563983 B2 JP 5563983B2
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- JP
- Japan
- Prior art keywords
- meth
- acrylate
- resin composition
- photocurable resin
- mass
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims description 55
- 230000003287 optical effect Effects 0.000 title claims description 24
- 239000008204 material by function Substances 0.000 title description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 111
- 239000000463 material Substances 0.000 claims description 25
- 229920001195 polyisoprene Polymers 0.000 claims description 25
- 239000000178 monomer Substances 0.000 claims description 20
- 239000005062 Polybutadiene Substances 0.000 claims description 18
- 229920002857 polybutadiene Polymers 0.000 claims description 18
- 229920002635 polyurethane Polymers 0.000 claims description 12
- 239000004814 polyurethane Substances 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 11
- 229920000642 polymer Polymers 0.000 claims description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims 1
- -1 thiol compound Chemical class 0.000 description 43
- 239000000853 adhesive Substances 0.000 description 32
- 230000001070 adhesive effect Effects 0.000 description 32
- 239000011521 glass Substances 0.000 description 26
- 239000000203 mixture Substances 0.000 description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 239000004417 polycarbonate Substances 0.000 description 13
- 239000003963 antioxidant agent Substances 0.000 description 10
- 239000012994 photoredox catalyst Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 230000003078 antioxidant effect Effects 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 8
- 239000004926 polymethyl methacrylate Substances 0.000 description 8
- 150000001451 organic peroxides Chemical class 0.000 description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 5
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 4
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical compound C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- 229940058015 1,3-butylene glycol Drugs 0.000 description 2
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 2
- JMIZWXDKTUGEES-UHFFFAOYSA-N 2,2-di(cyclopenten-1-yloxy)ethyl 2-methylprop-2-enoate Chemical compound C=1CCCC=1OC(COC(=O)C(=C)C)OC1=CCCC1 JMIZWXDKTUGEES-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- BAWPQHHUILXQGW-UHFFFAOYSA-N 2-methyl-1-(4-prop-1-en-2-ylphenyl)propane-1,2-diol Chemical compound CC(=C)C1=CC=C(C(O)C(C)(C)O)C=C1 BAWPQHHUILXQGW-UHFFFAOYSA-N 0.000 description 2
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 2
- WPMYUUITDBHVQZ-UHFFFAOYSA-M 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=CC(CCC([O-])=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-M 0.000 description 2
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 2
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical class CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- IHUNBGSDBOWDMA-AQFIFDHZSA-N all-trans-acitretin Chemical compound COC1=CC(C)=C(\C=C\C(\C)=C\C=C\C(\C)=C\C(O)=O)C(C)=C1C IHUNBGSDBOWDMA-AQFIFDHZSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 235000019437 butane-1,3-diol Nutrition 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical group C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 239000005341 toughened glass Substances 0.000 description 2
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NPENBPVOAXERED-UHFFFAOYSA-N (4-benzoylphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 NPENBPVOAXERED-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- WQQZMYRVHZZOEW-UHFFFAOYSA-N 1-benzyl-4-(2-methylphenyl)sulfanylbenzene Chemical compound CC1=CC=CC=C1SC(C=C1)=CC=C1CC1=CC=CC=C1 WQQZMYRVHZZOEW-UHFFFAOYSA-N 0.000 description 1
- HSKPJQYAHCKJQC-UHFFFAOYSA-N 1-ethylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CC HSKPJQYAHCKJQC-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- VYMSWGOFSKMMCE-UHFFFAOYSA-N 10-butyl-2-chloroacridin-9-one Chemical compound ClC1=CC=C2N(CCCC)C3=CC=CC=C3C(=O)C2=C1 VYMSWGOFSKMMCE-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- MWSPXTHIGURRBI-UHFFFAOYSA-N 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-bis(3,4,5-trimethoxyphenyl)imidazol-2-yl]-4,5-bis(3,4,5-trimethoxyphenyl)imidazole Chemical compound COC1=C(OC)C(OC)=CC(C=2C(=NC(N=2)(C=2C(=CC=CC=2)Cl)N2C(=C(N=C2C=2C(=CC=CC=2)Cl)C=2C=C(OC)C(OC)=C(OC)C=2)C=2C=C(OC)C(OC)=C(OC)C=2)C=2C=C(OC)C(OC)=C(OC)C=2)=C1 MWSPXTHIGURRBI-UHFFFAOYSA-N 0.000 description 1
- MHDULSOPQSUKBQ-UHFFFAOYSA-N 2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-diphenylimidazol-2-yl]-4,5-diphenylimidazole Chemical compound ClC1=CC=CC=C1C(N1C2(N=C(C(=N2)C=2C=CC=CC=2)C=2C=CC=CC=2)C=2C(=CC=CC=2)Cl)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 MHDULSOPQSUKBQ-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- COORVRSSRBIIFJ-UHFFFAOYSA-N 2-[2-(2-hydroxyethoxy)ethoxy]-1-methoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(O)COCCOCCO COORVRSSRBIIFJ-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- IEVADDDOVGMCSI-UHFFFAOYSA-N 2-hydroxybutyl 2-methylprop-2-enoate Chemical compound CCC(O)COC(=O)C(C)=C IEVADDDOVGMCSI-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- UOCCBQSLWGBRRR-UHFFFAOYSA-N 2-methyl-3-(octylsulfanylmethoxy)phenol Chemical compound C(CCCCCCC)SCOC1=C(C(=CC=C1)O)C UOCCBQSLWGBRRR-UHFFFAOYSA-N 0.000 description 1
- GAODDBNJCKQQDY-UHFFFAOYSA-N 2-methyl-4,6-bis(octylsulfanylmethyl)phenol Chemical compound CCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCC)=C1 GAODDBNJCKQQDY-UHFFFAOYSA-N 0.000 description 1
- FJDLQLIRZFKEKJ-UHFFFAOYSA-N 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanamide Chemical compound CC(C)(C)C1=CC(CCC(N)=O)=CC(C(C)(C)C)=C1O FJDLQLIRZFKEKJ-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical compound CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 1
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- VIQGKXOVPDLASV-UHFFFAOYSA-N 4-methoxybutyl 2-sulfanylpropanoate Chemical compound COCCCCOC(=O)C(C)S VIQGKXOVPDLASV-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- NOEMSRWQFGPZQS-UHFFFAOYSA-N CCC(O)=S.CCC(O)=S.CCC(O)=S.CCC(CO)(CO)CO Chemical compound CCC(O)=S.CCC(O)=S.CCC(O)=S.CCC(CO)(CO)CO NOEMSRWQFGPZQS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZGFPUTOTEJOSAY-UHFFFAOYSA-N FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 Chemical compound FC1=C([Ti])C(F)=CC=C1N1C=CC=C1 ZGFPUTOTEJOSAY-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- OVBHWXGJUPTVBR-UHFFFAOYSA-N azane;diphenylmethanone Chemical compound N.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 OVBHWXGJUPTVBR-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- OHZRFQFGSXWZPT-UHFFFAOYSA-N methyl-[3-(oxiran-2-ylmethoxy)propyl]-silylsilane Chemical compound C(C1CO1)OCCC[SiH]([SiH3])C OHZRFQFGSXWZPT-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- INJVFBCDVXYHGQ-UHFFFAOYSA-N n'-(3-triethoxysilylpropyl)ethane-1,2-diamine Chemical compound CCO[Si](OCC)(OCC)CCCNCCN INJVFBCDVXYHGQ-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SJNXJRVDSTZUFB-UHFFFAOYSA-N naphthalen-2-yl(phenyl)methanone Chemical compound C=1C=C2C=CC=CC2=CC=1C(=O)C1=CC=CC=C1 SJNXJRVDSTZUFB-UHFFFAOYSA-N 0.000 description 1
- XVKLLVZBGMGICC-UHFFFAOYSA-N o-[3-propanethioyloxy-2,2-bis(propanethioyloxymethyl)propyl] propanethioate Chemical compound CCC(=S)OCC(COC(=S)CC)(COC(=S)CC)COC(=S)CC XVKLLVZBGMGICC-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- SFHANYOFMGEJCT-UHFFFAOYSA-N octyl 2-sulfanylpropanoate Chemical compound CCCCCCCCOC(=O)C(C)S SFHANYOFMGEJCT-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- HPAFOABSQZMTHE-UHFFFAOYSA-N phenyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)C1=CC=CC=C1 HPAFOABSQZMTHE-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- KGDQKMRJLRNYEX-UHFFFAOYSA-N tridecyl 2-sulfanylpropanoate Chemical compound SC(C(=O)OCCCCCCCCCCCCC)C KGDQKMRJLRNYEX-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
本発明は、ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー及び柔軟化成分を含むタッチパネル接着用光硬化型接着組成物、前記（メタ）アクリレートオリゴマー、柔軟化成分及び特定の（メタ）アクリレートモノマー又はチオール化合物を含み、その硬化物が特定の弾性率及び破断時の伸びを有する光硬化型接着組成物、並びに、これらで貼り合わせた、タッチパネル又は表示パネルに関する。 The present invention relates to a photocurable adhesive composition for touch panel adhesion comprising a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane as a skeleton and a softening component, the (meth) acrylate oligomer, the softening component and a specific (meta) ) A photocurable adhesive composition containing an acrylate monomer or a thiol compound, the cured product having a specific elastic modulus and elongation at break, and a touch panel or display panel bonded together.
ＬＣＤ等の表示体の上に搭載するタッチパネルには、抵抗膜式、静電容量式、電磁誘導式、光学式などがある。これらのタッチパネルの上には、見た目のデザイン性をよくするための化粧板やタッチする位置を指定するようなアイコンシートを貼り合わせる場合がある。また、静電容量式タッチパネルは、透明基板の上に透明電極を形成し、その上に透明板を貼り合わせた構造を有している。 Examples of touch panels mounted on a display body such as an LCD include a resistance film type, a capacitance type, an electromagnetic induction type, and an optical type. On these touch panels, there is a case where a decorative board for improving the design of appearance and an icon sheet for designating a touch position are pasted together. The capacitive touch panel has a structure in which a transparent electrode is formed on a transparent substrate and a transparent plate is bonded thereon.
従来は、上記の化粧板とタッチパネルとの貼り合わせ、アイコンシートとタッチパネルとの貼り合わせ、静電容量式タッチパネルにおける透明電極を形成した透明基板と透明板との貼り合わせを、シート状の両面粘着シートを用いて行うか、被着体の片面に粘着加工して行っていた。このような粘着材を使用する技術では、接着が不十分であったり、貼り合わせ面に気泡が混入するという問題があった。特に、貼り合わせ面に印刷加工がしてあると、印刷のあるところとないところの段差部分に気泡が残りやすいという問題があった。 Conventionally, bonding of the decorative plate and the touch panel, bonding of the icon sheet and the touch panel, and bonding of the transparent substrate on which the transparent electrode is formed in the capacitive touch panel and the transparent plate are performed by sheet-like double-sided adhesive. It was performed using a sheet or by performing an adhesive process on one side of the adherend. In the technique using such an adhesive material, there is a problem that adhesion is insufficient or bubbles are mixed into the bonding surface. In particular, when printing is performed on the bonding surface, there is a problem that bubbles are likely to remain in the stepped portions where printing is performed and where printing is not performed.
また、近年ＬＣＤ等の表示体のガラスが薄くなってきている。ガラスが薄くなると外部応力でＬＣＤが変形しやすくなる。この薄いガラスのＬＣＤ等の表示体と、アクリル板やポリカーボネート板等の光学機能材料とを貼り合わせる場合、ガラスとアクリル等の線膨張の違いや、アクリル板やポリカーボネートなどのプラスチック成型材の成型時の歪みにより、耐熱試験や耐湿試験において成形歪みの緩和や吸湿／乾燥がおこり、寸法変化や反りなどの面精度変化がおきる。従来の接着剤（例えば、特許文献１）でこの変形を抑えようとした場合は、接着面が剥がれたり、ＬＣＤが割れたり、ＬＣＤの表示ムラになるという問題点があった。 In recent years, glass for display bodies such as LCDs has become thinner. When the glass becomes thinner, the LCD is easily deformed by external stress. When this thin glass LCD or other optical display material is bonded to an optical functional material such as an acrylic plate or a polycarbonate plate, the difference in linear expansion between the glass and acrylic or the molding of plastic molding materials such as an acrylic plate or polycarbonate Due to this distortion, molding distortion is relaxed and moisture absorption / drying occurs in the heat resistance test and moisture resistance test, and surface accuracy changes such as dimensional changes and warping occur. When trying to suppress this deformation with a conventional adhesive (for example, Patent Document 1), there are problems that the adhesive surface is peeled off, the LCD is cracked, or the LCD is unevenly displayed.
したがって、本発明の課題は、タッチパネルの上に化粧板やアイコンシートを貼り合わせる場合や、静電容量式タッチパネルにおける透明電極を形成した透明基板と透明板とを貼り合わせる場合に、十分な接着性を付与し、気泡を含ませずに貼り合わせることが困難であるという従来技術の問題点、あるいは、表示体と光学機能材料とを貼り合わせた場合に、接着面が剥がれたり、表示体のガラスが割れたりする従来技術の問題点を解決する接着組成物の提供である。 Therefore, the problem of the present invention is that sufficient adhesion is obtained when a decorative plate or an icon sheet is pasted on a touch panel, or when a transparent substrate on which a transparent electrode is formed in a capacitive touch panel and a transparent plate are pasted together. The problem with the prior art is that it is difficult to bond without containing bubbles, or when the display and optical functional material are bonded together, the adhesive surface may peel off, or the glass of the display It is providing the adhesive composition which solves the problem of the prior art which cracks.
本発明者らは、光硬化型接着組成物において、ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー及び柔軟化成分を含有させることにより、あるいは、前記（メタ）アクリレートオリゴマー及び柔軟化成分に加えて特定の（メタ）アクリレートモノマー又はチオール化合物を含有させかつ、その硬化物の弾性率及び破断時の伸びを特定の範囲内とすることにより、上記の課題が達成されることを見出して本発明を完成した。 The present inventors include a (meth) acrylate oligomer having a polyisoprene, polybutadiene, or polyurethane as a skeleton and a softening component in the photocurable adhesive composition, or alternatively, the (meth) acrylate oligomer and the softening. It has been found that the above-mentioned problems can be achieved by containing a specific (meth) acrylate monomer or thiol compound in addition to the components and making the cured product elastic modulus and elongation at break within a specific range. The present invention has been completed.
第１の本発明は、（Ａ）ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー及び（Ｂ）柔軟化成分を含むタッチパネル接着用光硬化型接着組成物である。 1st this invention is the photocurable adhesive composition for touchscreen adhesion | attachment containing (A) (meth) acrylate oligomer which has polyisoprene, polybutadiene, or polyurethane in frame | skeleton, and (B) softening component.
さらに、本発明は、上記のタッチパネル接着用光硬化型接着組成物で貼り合わせた、静電容量式タッチパネルにおける透明電極が形成してある透明基板と透明板との貼り合わせ体又はタッチパネルとシート又は板との貼り合わせ体である。 Furthermore, the present invention is a bonded body of a transparent substrate and a transparent plate, or a touch panel and a sheet, or a transparent plate on which a transparent electrode in a capacitive touch panel is bonded with the above-mentioned photocurable adhesive composition for bonding a touch panel. It is a bonded body with a plate.
第２の本発明は、（Ａ）ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー、（Ｂ）柔軟化成分、並びに（Ｃ１）フェノキシエチル（メタ）アクリレート、フェノキシポリエチレングリコール（メタ）アクリレート、２−ヒドロキシ−３−フェノキシプロピル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ノニルフェノールＥＯ付加物（メタ）アクリレート、メトキシトリエチレングリコール（メタ）アクリレート及びテトラヒドロフルフリル（メタ）アクリレートから選択した（メタ）アクリレートモノマーを含む、表示体と光学機能材料を貼り合わせるための光硬化型樹脂組成物であって、硬化物の弾性率が１２kPa未満であり、かつ硬化物の破断時の伸びが３００％以上であることを特徴とする光硬化型樹脂組成物である。 The second invention relates to (A) a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane as a skeleton, (B) a softening component, and (C1) phenoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth). Selected from acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, nonylphenol EO adduct (meth) acrylate, methoxytriethylene glycol (meth) acrylate and tetrahydrofurfuryl (meth) acrylate ( A photocurable resin composition for bonding a display body and an optical functional material containing a (meth) acrylate monomer, wherein the cured product has an elastic modulus of less than 12 kPa, and the cured product has an elongation at break of 300%. Above A photocurable resin composition characterized Rukoto.
第３の本発明は、（Ａ）ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー、（Ｂ）柔軟化成分及び（Ｃ２）チオール化合物及びを含む、表示体と光学機能材料を貼り合わせるための光硬化型樹脂組成物であって、硬化物の弾性率が１０kPa未満であり、かつ硬化物の破断時の伸びが３００％以上であることを特徴とする光硬化型樹脂組成物である。硬化物の弾性率は、好ましくは１kPa以上であり、硬化物の破断時の伸びは、好ましくは、１０００％以下である The third aspect of the present invention is to paste a display body and an optical functional material containing (A) a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane as a skeleton, (B) a softening component and (C2) a thiol compound. A photocurable resin composition for combining, wherein the cured product has an elastic modulus of less than 10 kPa, and the cured product has an elongation at break of 300% or more. is there. The elastic modulus of the cured product is preferably 1 kPa or more, and the elongation at break of the cured product is preferably 1000% or less.
さらに、本発明は、上記の第２又は第３の光硬化型樹脂組成物で貼り合わせた、表示体と光学機能材料を含む表示パネルである。 Furthermore, the present invention is a display panel including a display body and an optical functional material bonded together by the second or third photocurable resin composition.
第１の本発明によれば、タッチパネルの上に化粧板やアイコンシートを貼り合わせる場合や、静電容量式タッチパネルにおける透明電極を形成した透明基板と透明板を貼り合わせる場合に、十分な接着力を持って、気泡を含ませずに貼り合わせることができる。 According to the first aspect of the present invention, when a decorative plate or an icon sheet is pasted on the touch panel, or when a transparent substrate on which a transparent electrode is formed in a capacitive touch panel is pasted with a transparent plate, sufficient adhesive strength is obtained. Can be attached without containing bubbles.
第２及び第３の本発明によれば、表示体と光学機能材料を貼り合わせた場合に、接着面が剥がれたり、表示体のガラスが割れたりすることがない。 According to the second and third aspects of the present invention, when the display body and the optical functional material are bonded together, the adhesive surface is not peeled off, and the glass of the display body is not broken.
第１の発明
第１の本発明は、（Ａ）ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー及び（Ｂ）柔軟化成分を含むタッチパネル接着用光硬化型接着組成物である。 1st invention 1st this invention is the photocurable adhesive composition for touch-panel adhesion | attachment containing (A) (meth) acrylate oligomer which has (A) polyisoprene, polybutadiene, or polyurethane in frame | skeleton, and (B) softening component.
本発明の成分（Ａ）は、ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマーである。これらの（メタ）アクリレートオリゴマーは、１種類又は２種類以上を使用できる。 Component (A) of the present invention is a (meth) acrylate oligomer having a polyisoprene, polybutadiene, or polyurethane as a skeleton. These (meth) acrylate oligomers can be used alone or in combination of two or more.
ポリイソプレンを骨格にもつ（メタ）アクリレートオリゴマーは、（メタ）アクリル変性ポリイソプレンとも呼ばれ、好ましくは１０００〜１０００００、より好ましくは１０００００〜５００００の分子量を有する。市販品として、例えば、クラレ社製の「ＵＣ−１」（分子量２５０００）がある。 The (meth) acrylate oligomer having polyisoprene as a skeleton is also called (meth) acryl-modified polyisoprene, and preferably has a molecular weight of 1000 to 100,000, more preferably 100,000 to 50,000. As a commercial item, there exists "UC-1" (molecular weight 25000) made from Kuraray, for example.
ポリブタジエンを骨格にもつ（メタ）アクリレートオリゴマーは、（メタ）アクリル変性ポリブタジエンとも呼ばれ、好ましくは５００〜１０００００、より好ましくは１０００〜３００００の分子量を有する。市販品として、例えば、日本石油社製の「ＴＥ２０００」（分子量２０００）がある。 The (meth) acrylate oligomer having a polybutadiene as a skeleton is also called (meth) acryl-modified polybutadiene, and preferably has a molecular weight of 500 to 100,000, more preferably 1,000 to 30,000. An example of a commercially available product is “TE2000” (molecular weight 2000) manufactured by Nippon Oil Corporation.
ポリウレタンを骨格にもつ（メタ）アクリレートオリゴマーは、（メタ）アクリル変性ポリウレタンとも呼ばれ、好ましくは１０００〜１０００００、より好ましくは１００００〜５００００の分子量を有する。市販品として、例えば、ライトケミカル社製の「ＵＡ−１」がある。 The (meth) acrylate oligomer having a polyurethane as a skeleton is also called a (meth) acryl-modified polyurethane, and preferably has a molecular weight of 1000 to 100,000, more preferably 10,000 to 50,000. As a commercial item, there exists "UA-1" by a light chemical company, for example.
成分（Ａ）の（メタ）アクリレートオリゴマーとしては、ポリイソプレンを骨格にもつ（メタ）アクリレートオリゴマーが特に好ましい。 As the (meth) acrylate oligomer of component (A), a (meth) acrylate oligomer having polyisoprene as a skeleton is particularly preferable.
本発明の成分（Ｂ）は、柔軟化成分である。柔軟化成分として、成分（Ａ）と相溶するポリマー、オリゴマー、フタル酸エステル類、ヒマシ油類等が挙げられる。オリゴマー又はポリマーとして、ポリイソプレン系、ポリブタジエン系又はキシレン系のオリゴマー又はポリマーを例示できる。これらの柔軟化成分は、クラレからＬＩＲシリーズ、デグッサ社からポリオイルシリーズとして市販されている。これらの柔軟化成分は１種類または２種類以上を使用できる。 Component (B) of the present invention is a softening component. Examples of the softening component include polymers, oligomers, phthalates, castor oils and the like that are compatible with the component (A). Examples of the oligomer or polymer include polyisoprene-based, polybutadiene-based, and xylene-based oligomers or polymers. These softening ingredients are commercially available from Kuraray as the LIR series and from Degussa as the polyoil series. One or more kinds of these softening components can be used.
本発明のタッチパネル接着用光硬化型接着組成物において、成分（Ａ）１００質量部に対して、成分（Ｂ）は、好ましくは１０〜４００質量部、より好ましくは５０〜３００質量部、もっとも好ましくは１００〜３００質量部である。 In the photocurable adhesive composition for bonding a touch panel of the present invention, the component (B) is preferably 10 to 400 parts by mass, more preferably 50 to 300 parts by mass, most preferably, relative to 100 parts by mass of the component (A). Is 100 to 300 parts by mass.
本発明のタッチパネル接着用光硬化型接着組成物は、さらに、（Ｃ）特定の（メタ）アクリレートモノマー（Ｃ１）又はチオール化合物（Ｃ２）を含むことが好ましい。 The photocurable adhesive composition for touch panel adhesion of the present invention preferably further contains (C) a specific (meth) acrylate monomer (C1) or a thiol compound (C2).
特定の（メタ）アクリレートモノマー（Ｃ１）は、フェノキシエチル（メタ）アクリレート（ＰＯ）、フェノキシポリエチレングリコール（メタ）アクリレート、２−ヒドロキシ−３−フェノキシプロピル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート（ＣＨ）、ノニルフェノールＥＯ付加物（メタ）アクリレート、メトキシトリエチレングリコール（メタ）アクリレート及びテトラヒドロフルフリル（メタ）アクリレートから選択される。これらの（メタ）アクリレートモノマーは、１種類又は２種類以上を使用できる。成分（Ｃ１）は、硬化物に伸びを付与するための成分である。 Specific (meth) acrylate monomers (C1) include phenoxyethyl (meth) acrylate (PO), phenoxypolyethylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate (CH ), Nonylphenol EO adduct (meth) acrylate, methoxytriethylene glycol (meth) acrylate and tetrahydrofurfuryl (meth) acrylate. These (meth) acrylate monomers can be used alone or in combination of two or more. The component (C1) is a component for imparting elongation to the cured product.
本発明の成分（Ｃ２）は、チオール化合物である。チオール化合物として、たとえば、メルカプトプロピオン酸トリデシル、メルカプトプロピオン酸メトキシブチル、メルカプトプロピオン酸オクチル、トリメチロールプロパントリスチオプロピオネート、ペンタエリスリトールテトラキスチオプロピオネート、ジペンタエリスリトールヘキサキス（３−メルカプトプロピオネート）、トリス［（３−メルカプトプロピオニロキシ）−エチル］イソシアヌレート及び３−メルカプトブチレート誘導体などを例示できる。これらのチオール化合物は、１種類または２種類以上を使用できる。 Component (C2) of the present invention is a thiol compound. Examples of the thiol compound include tridecyl mercaptopropionate, methoxybutyl mercaptopropionate, octyl mercaptopropionate, trimethylolpropane tristhiopropionate, pentaerythritol tetrakisthiopropionate, dipentaerythritol hexakis (3-mercaptopropionate). Nate), tris [(3-mercaptopropionyloxy) -ethyl] isocyanurate and 3-mercaptobutyrate derivatives. These thiol compounds can be used alone or in combination of two or more.
成分（Ｃ２）は、好ましくは、３−メルカプトブチレート誘導体であり、例えば、１，４−ビス（３−メルカプトブチリルオキシ）ブタン、１，３，５−トリス（３−メルカブトブチルオキシエチル）−１，３，５−トリアジン−２，４，６−（１Ｈ，３Ｈ，５Ｈ）−トリオン、ペンタエリスリトールテトラキス（３−メルカプトブチレート）、トリメチロールプロパントリス（３−メルカプトプロピオネート）などを例示できる。これらのチオール化合物は、昭和電工社から、商品名：カレンズＭＴ ＢＤ１、カレンズＭＴ ＰＥ１、カレンズＭＴ ＮＲ１、堺化学社から商品名：ＴＭＭＰとして市販されている。 Component (C2) is preferably a 3-mercaptobutyrate derivative, such as 1,4-bis (3-mercaptobutyryloxy) butane, 1,3,5-tris (3-mercaptobutyloxyethyl). ) -1,3,5-triazine-2,4,6- (1H, 3H, 5H) -trione, pentaerythritol tetrakis (3-mercaptobutyrate), trimethylolpropane tris (3-mercaptopropionate), etc. Can be illustrated. These thiol compounds are commercially available from Showa Denko as trade names: Karenz MT BD1, Karenz MT PE1, Karenz MT NR1, and trade names: TMMP from Sakai Chemical.
本発明のタッチパネル接着用光硬化型接着組成物において、成分（Ａ）１００質量部に対して、成分（Ｃ１）は、好ましくは１〜１００質量部、より好ましくは５〜５０質量部である。また、成分（Ｃ２）は、成分（Ａ）１００質量部に対して、好ましくは０．０５〜１００質量部、より好ましくは０．１〜１０質量部である。 In the photocurable adhesive composition for bonding a touch panel of the present invention, the component (C1) is preferably 1 to 100 parts by mass, more preferably 5 to 50 parts by mass with respect to 100 parts by mass of the component (A). Moreover, a component (C2) becomes like this. Preferably it is 0.05-100 mass parts with respect to 100 mass parts of components (A), More preferably, it is 0.1-10 mass parts.
本発明のタッチパネル接着用光硬化型接着組成物は、成分の相溶性が悪い場合あるいは粘度が高く作業性が悪い場合には、反応希釈剤として、成分（Ｃ１）以外の一般的な（メタ）アクリレートモノマーを含むことができる。一般的な（メタ）アクリレートモノマーとして、例えば、２−エチルヘキシル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｉ−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、ラウリル（メタ）アクリレート、アルキル（メタ）アクリレート、メトキシエチル（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシブチル（メタ）アクリレート、ベンジル（メタ）アクリレート、フェニル（メタ）アクリレート、エチレングリコールジ（メタ）アクリレート、ジエチレングリコールジ（メタ）アクリレート、トリエチレングリコールジ（メタ）アクリレート、ヒドロキシエチル（メタ）アクリレート、１，３−ブチレングリコールジ（メタ）アクリレート、１，４−ブチレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、１，６−ヘキサンジオールジ（メタ）アクリレート、ジシクロペンテニルオキシエチル（メタ）アクリレート、ノルボネン（メタ）アクリレートを例示できる。これらの（メタ）アクリレートは１種類または２種類以上を使用できる。 The photocurable adhesive composition for touch panel adhesion of the present invention is a general (meta) other than the component (C1) as a reaction diluent when the compatibility of the components is poor or when the viscosity is high and the workability is poor. An acrylate monomer can be included. Examples of general (meth) acrylate monomers include 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) acrylate, lauryl (meth) acrylate, Alkyl (meth) acrylate, methoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) Acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, hydroxyethyl (meth) acrylate, 1,3-butyleneglycol Di (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, norbonene A (meth) acrylate can be illustrated. These (meth) acrylates can be used alone or in combination of two or more.
本発明のタッチパネル接着用光硬化型接着組成物は、さらに、光開始剤を含み得る。光開始剤としては、一般的な開始剤が使用でき、例えば、１−［４−（２−ヒドロキシエトキシ）フェニル］−２−ヒドロキシ−２−メチル−１−プロパン−１−オン、１−ヒドロキシ−シクロヘキシル−フェニル−ケトン、ベンゾフェノン、２，２−ジメトキシ−１，２−ジフェニルエタン−１−オン、２，４，６−トリメチルベンゾイルジフェニルホスフィンオキサイド、２，４，６−トリメチルベンゾイルフェニルエトキシホスフィンオキサイド、２−ベンジル−２−ジメチルアミノ−１−（４−モルホリノフェニル）ブタノン−１、２−ヒドロキシ−２−メチル−１−フェニル−プロパン−１−オン、２−メチル−１−［４−メチルチオ］フェニル］−２−モルホリノプロパンー１−オン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソブチルエーテル、ベンゾインイソプロピルエーテル、ビス（２，４，６−トリメチルベンゾイル）−フェニルホスフィンオキサイド、２−ヒドロキシ−２−メチル−［４−（１−メチルビニル）フェニル］プロパノールオリゴマー、２−ヒドロキシ−２−メチル−［４−（１−メチルビニル）フェニル］プロパノールオリゴマー，２−ヒドロキシ−２−メチル−１−フェニル−１−プロパノン、イソプロピルチオキサントン、ｏ−ベンゾイル安息香酸メチル、［４−（メチルフェニルチオ）フェニル］フェニルメタン、２，４−ジエチルチオキサントン、２ークロロチオキサントン、ベンゾフェノン、エチルアントラキノン、ベンゾフェノンアンモニウム塩、チオキサントンアンモニウム塩、ビス（２，６−ジメトキシベンゾイル）−２，４，４−トリメチル−ペンチルホスフィンオキサイド、ビス（２，６−ジメトキシベンゾイル）−２，４，４−トリメチル−ペンチルホスフィンオキサイド、２，４，６−トリメチルベンゾフェノン、４−メチルベンゾフェノン、４，４’−ビスジエチルアミノベンゾフェノン、１，４ジベンゾイルベンゼン、１０−ブチル−２−クロロアクリドン、２，２’ビス（ｏ−クロロフェニル）４，５，４’，５’−テトラキス（３，４，５−トリメトキシフェニル）１，２’−ビイミダゾール、２，２’ビス（ｏ−クロロフェニル）４，５，４’，５’−テトラフェニル−１，２’−ビイミダゾール、２−ベンゾイルナフタレン、４−ベンゾイル ビフェニル、４−ベンゾイルジフェニルエーテル、アクリル化ベンゾフェノン、ビス（η５−２，４−シクロペンタジエン−１−イル）−ビス（２，６−ジフルオロ−３−（１Ｈ−ピロール−１−イル）−フェニル）チタニウム、ｏ−メチルベンゾイルベンゾエート、ｐ−ジメチルアミノ安息香酸エチルエステル、ｐ−ジメチルアミノ安息香酸イソアミルエチルエステル、活性ターシャリアミン、カルバゾール・フェノン系光重合開始剤、アクリジン系光重合開始剤、トリアジン系光重合開始剤、ベンゾイル系光重合開始剤などを例示できる。これらの光開始剤の１種類または２種類以上を使用できる。光開始剤の量は、成分（Ａ）１００質量部に対して、０．１〜１０質量部である。 The photocurable adhesive composition for touch panel adhesion of the present invention may further contain a photoinitiator. As the photoinitiator, a general initiator can be used, for example, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 1-hydroxy -Cyclohexyl-phenyl-ketone, benzophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoylphenylethoxyphosphine oxide 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 2-methyl-1- [4-methylthio ] Phenyl] -2-morpholinopropan-1-one, benzoin methyl ether, benzoin ester Ether, benzoin isobutyl ether, benzoin isopropyl ether, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, 2-hydroxy-2-methyl- [4- (1-methylvinyl) phenyl] propanol oligomer, 2- Hydroxy-2-methyl- [4- (1-methylvinyl) phenyl] propanol oligomer, 2-hydroxy-2-methyl-1-phenyl-1-propanone, isopropylthioxanthone, methyl o-benzoylbenzoate, [4- ( Methylphenylthio) phenyl] phenylmethane, 2,4-diethylthioxanthone, 2-chlorothioxanthone, benzophenone, ethyl anthraquinone, benzophenone ammonium salt, thioxanthone ammonium salt, bis (2,6-di) Toxibenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, 2,4,6-trimethylbenzophenone, 4-methyl Benzophenone, 4,4′-bisdiethylaminobenzophenone, 1,4 dibenzoylbenzene, 10-butyl-2-chloroacridone, 2,2′bis (o-chlorophenyl) 4,5,4 ′, 5′-tetrakis ( 3,4,5-trimethoxyphenyl) 1,2′-biimidazole, 2,2′bis (o-chlorophenyl) 4,5,4 ′, 5′-tetraphenyl-1,2′-biimidazole, 2 -Benzoylnaphthalene, 4-benzoyl biphenyl, 4-benzoyl diphenyl ether, acrylated benzoph Non, bis (η5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, o-methylbenzoylbenzoate, p- Dimethylaminobenzoic acid ethyl ester, p-dimethylaminobenzoic acid isoamyl ethyl ester, active tertiary amine, carbazole / phenone photopolymerization initiator, acridine photopolymerization initiator, triazine photopolymerization initiator, benzoyl photopolymerization initiation An agent etc. can be illustrated. One or more of these photoinitiators can be used. The quantity of a photoinitiator is 0.1-10 mass parts with respect to 100 mass parts of component (A).
本発明において、好ましい光開始剤として、２，４，６−トリメチルベンゾイルフェニルエトキシホスフィンオキサイド、１−ヒドロキシ−シクロヘキシル−フェニル−ケトンが挙げられ、それぞれを単独でも使用してもよいし、組み合わせてもよい。 In the present invention, preferable photoinitiators include 2,4,6-trimethylbenzoylphenylethoxyphosphine oxide and 1-hydroxy-cyclohexyl-phenyl-ketone, and each may be used alone or in combination. Good.
本発明の光硬化型接着組成物は、さらに、接着付与剤を含有することができる。接着付与剤として、シランカップリング剤、例えば、ビニルトリメトキシシラン、２−（３，４−エポキシシクロヘキシル）エチルトリメトキシシラン、３−グリシドキシプロピルトリメトキシシラン、３−グリシドキシプロピルメチルジエトキシシラン、３−グリシドキシプロピルトリエトキシシラン、ｐ−スチリルトリメトキシシラン、３−メタクリロキシプロピルメチルジメトキシシラン、３−メタクリロキシプロピルトリメトキシシラン、３−メタクリロキシプロピルメチルジエトキシシラン、３−メタクリロキシプロピルトリエトキシシラン、３−アクリロキシプロピルトリメトキシシラン、Ｎ−２−（アミノエチル）−３−アミノプロピルメチルジメトキシシラン、Ｎ−２−（アミノエチル）−３−アミノプロピルトリメトキシシラン、Ｎ−２−（アミノエチル）−３−アミノプロピルトリエトキシシラン、３−アミノプロピルトリメトキシシラン、３−アミノプロピルトリエトキシシラン、３−トリエトキシシリル−Ｎ−（１，３−ジメチル−ブチリデン）プロピルアミン、Ｎ−フェニル−３−アミノプロピルトリメトキシシラン、３−ウレイドプロピルトリエトキシシラン、３−クロロプロピルトリメトキシシラン、３−メルカプトプロピル、メチルジメトキシシラン、３−メルカプトプロピルトリメトキシシラン、ビス（トリエトキシシリルプロピル）テトラスルフィド、３−イソシアネートプロピルトリエトキシシランなどを例示できる。これらの接着付与剤の１種類または２種類以上を使用できる。接着付与剤の量は、成分（Ａ）１００質量部に対して、０．０１〜１０質量部、好ましくは０．５〜５質量部である。 The photocurable adhesive composition of the present invention can further contain an adhesion-imparting agent. Silane coupling agents such as vinyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldisilane as adhesion promoters Ethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3- Methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxy Lan, N-2- (aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl- Butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropyl, methyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, Examples thereof include bis (triethoxysilylpropyl) tetrasulfide and 3-isocyanatopropyltriethoxysilane. One kind or two or more kinds of these adhesion-imparting agents can be used. The amount of the adhesion-imparting agent is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the component (A).
本発明の光硬化型接着組成物は、さらに、酸化防止剤を含有することができる。酸化防止剤としては、ＢＨＴ、２，４−ビス−（ｎ−オクチルチオ）−６−（４−ヒドロキシ−３，５−ジ−ｔ−ブチルアニリノ）−１，３，５−トリアジン、ペンタエリスリチル・テトラキス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］、２，２−チオ−ジエチレンビス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］、トリエチレングリコール−ビス［３−（３−ｔ−ブチル−５−メチル−４−ヒドロキシフェニル）プロピオネート］、１，６−ヘキサンジオール−ビス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］、オクタデシル−３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、Ｎ，Ｎ’−ヘキサメチレンビス（３，５−ジ−ｔ−ブチル−４−ヒドロキシ−ヒドロシンナマミド）、１，３，５−トリメチル−２，４，６−トリス（３，５−ジ−ｔ−ブチル−４−ヒドロキシベンジル）ベンゼン、トリス−（３，５−ジ−ｔ−ブチル−４−ヒドロキシベンジル）−イソシアヌレート、オクチル化ジフェニルアミン、２，４，−ビス［（オクチルチオ）メチル］−Ｏ−クレゾール、イソオクチル−３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、ジブチルヒドロキシトルエンを例示できる。これらの酸化防止剤は１種類または２種類以上で使用できる。酸化防止剤の量は、成分（Ａ）１００質量部に対して、０．０１〜１０質量部、好ましくは０．５〜５質量部である。 The photocurable adhesive composition of the present invention can further contain an antioxidant. Antioxidants include BHT, 2,4-bis- (n-octylthio) -6- (4-hydroxy-3,5-di-t-butylanilino) -1,3,5-triazine, pentaerythrityl. Tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 2,2-thio-diethylenebis [3- (3,5-di-t-butyl-4-hydroxyphenyl) Propionate], triethylene glycol-bis [3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis [3- (3,5-di-t- Butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, N, N′-hexamethyle Bis (3,5-di-tert-butyl-4-hydroxy-hydrocinnamamide), 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4- Hydroxybenzyl) benzene, tris- (3,5-di-t-butyl-4-hydroxybenzyl) -isocyanurate, octylated diphenylamine, 2,4, -bis [(octylthio) methyl] -O-cresol, isooctyl- Examples include 3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate and dibutylhydroxytoluene. These antioxidants can be used alone or in combination of two or more. The amount of the antioxidant is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the component (A).
本発明の光硬化型接着組成物は、光学機能材料の構造によって接着面に塗布した接着組成物の一部に光が当たらない場合には、光が当たるところは光で硬化させ、光の当たらないところは有機過酸化物を添加して熱で硬化させるような、光硬化と熱硬化の併用タイプの接着組成物にできる。有機過酸化物の例としてケトンパーオキサイド系、パーオキシケタール系、ハイドロパーオキサイド系、ジアルキルパーオキサイド系、ジアシルパーオキサイド系、パーオキシエステル系、パーオキシジカーボネート系などが例示できる。これらの有機化酸化物は、１種類または２種類以上を使用できる。これらの有機化酸化物は１種類または２種類以上を使用でき、その量は、成分（Ａ）１００質量部に対して、０．１〜１０質量部、好ましくは１〜５質量部である。 When the light curable adhesive composition of the present invention is not exposed to a part of the adhesive composition applied to the adhesive surface due to the structure of the optical functional material, the portion that is exposed to light is cured with light. If there is not, an adhesive composition of a combination of photocuring and thermosetting, in which an organic peroxide is added and cured by heat, can be obtained. Examples of organic peroxides include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxyesters, and peroxydicarbonates. One type or two or more types of these organic oxides can be used. One kind or two or more kinds of these organic oxides can be used, and the amount thereof is 0.1 to 10 parts by mass, preferably 1 to 5 parts by mass with respect to 100 parts by mass of the component (A).
また、これら有機過酸化物の硬化促進剤として、ナフテン酸金属錯体、ジメチルアニリン、４級アンモニウム塩、リン酸エステル類を使用できる。 In addition, naphthenic acid metal complexes, dimethylaniline, quaternary ammonium salts, and phosphate esters can be used as curing accelerators for these organic peroxides.
本発明の光硬化型接着組成物は、静電容量式タッチパネルにおいて、透明電極が形成してある透明基板と透明板とを貼り合わせるための接着剤であることが好ましい。透明基板の材質は、例えば、ガラス、ＰＣ、ＰＭＭＡ、ＰＣとＰＭＭＡの複合体、ＣＯＣ、ＣＯＰである。透明板の材質は、例えば、ガラス、ＰＣ、ＰＭＭＡ、ＰＣとＰＭＭＡの複合体、ＣＯＣ、ＣＯＰある。 The photocurable adhesive composition of the present invention is preferably an adhesive for bonding a transparent substrate on which a transparent electrode is formed and a transparent plate in a capacitive touch panel. The material of the transparent substrate is, for example, glass, PC, PMMA, a composite of PC and PMMA, COC, or COP. Examples of the material of the transparent plate include glass, PC, PMMA, a composite of PC and PMMA, COC, and COP.
本発明の光硬化型接着組成物は、タッチパネルとこの上にシート又は板を貼り合わせるための接着剤であることが好ましい。シートとしては、例えば、アイコンシート、保護シート，化粧シートがあり、その材質は、例えば、ＰＥＴ、ＰＣ、ＣＯＣ、ＣＯＰである。板としては、例えば、化粧板、保護板があり、その材質は、例えば、ＰＥＴ、ガラス、ＰＣ、ＰＭＭＡ、ＰＣとＰＭＭＡの複合体、ＣＯＣ、ＣＯＰである。シート又は板と貼り合わせるタッチパネル面の材質は、例えば、ガラス、ＰＥＴ、ＰＣ、ＰＭＭＡ、ＰＣとＰＭＭＡの複合体、ＣＯＣ、ＣＯＰである。 The photocurable adhesive composition of the present invention is preferably an adhesive for bonding a touch panel and a sheet or plate thereon. Examples of the sheet include an icon sheet, a protective sheet, and a decorative sheet, and materials thereof are, for example, PET, PC, COC, and COP. Examples of the plate include a decorative plate and a protective plate, and materials thereof are, for example, PET, glass, PC, PMMA, a composite of PC and PMMA, COC, and COP. The material of the touch panel surface to be bonded to the sheet or plate is, for example, glass, PET, PC, PMMA, a composite of PC and PMMA, COC, or COP.
また、本発明は、上記の光硬化型接着組成物により貼り合わせた、静電容量式タッチパネルにおける透明電極が形成してある透明基板と透明板との貼り合わせ体又はタッチパネルとシート又は板との貼り合わせ体にも関する。 In addition, the present invention provides a bonded body of a transparent substrate and a transparent plate, or a touch panel and a sheet or plate, on which a transparent electrode in a capacitive touch panel is bonded by the photocurable adhesive composition. Also related to the bonded body.
第２の発明
第２の本発明は、（Ａ）ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー、（Ｂ）柔軟化成分、並びに（Ｃ１）フェノキシエチル（メタ）アクリレート、フェノキシポリエチレングリコール（メタ）アクリレート、２−ヒドロキシ−３−フェノキシプロピル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ノニルフェノールＥＯ付加物（メタ）アクリレート、メトキシトリエチレングリコール（メタ）アクリレート及びテトラヒドロフルフリル（メタ）アクリレートから選択した（メタ）アクリレートモノマーを含む、表示体と光学機能材料を貼り合わせるための光硬化型樹脂組成物であって、硬化物の弾性率が１２kPa未満であり、かつ硬化物の破断時の伸びが３００％以上であることを特徴とする光硬化型樹脂組成物である。 The second invention of the present invention relates to (A) a (meth) acrylate oligomer having a polyisoprene, polybutadiene or polyurethane backbone, (B) a softening component, and (C1) phenoxyethyl (meth) acrylate, phenoxypolyethylene. Glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, nonylphenol EO adduct (meth) acrylate, methoxytriethylene glycol (meth) acrylate and tetrahydrofurfuryl (meth) acrylate A photocurable resin composition for bonding a display body and an optical functional material, comprising a (meth) acrylate monomer selected from the above, wherein the cured product has an elastic modulus of less than 12 kPa and Elongation is 30 A photocurable resin composition which is characterized in that at least%.
本発明の成分（Ａ）、成分（Ｂ）及び成分（Ｃ１）の具体例は、第１の発明において記載したとおりである。 Specific examples of the component (A), the component (B) and the component (C1) of the present invention are as described in the first invention.
本発明の光硬化性樹脂組成物は、表示体と光学機能材料とを貼り合わせるためのものである。表示体としては、ガラスに偏光板を貼りつけてあるＬＣＤ、ＥＬディスプレー、ＥＬ照明、電子ペーパーやプラズマディスプレー等の表示素子が挙げられる。光学機能材料としては、視認性向上や外部衝撃から表示素子の割れ防止を目的とするアクリル板（片面又は両面ハードコート処理やＡＲコート処理してあってもよい）、ポリカーボネート板、ＰＥＴ板、ＰＥＮ板などの透明プラスチック板、強化ガラス（飛散防止フィルムが付いていてもよい）及びタッチパネル入力センサーなどがあげられる。 The photocurable resin composition of the present invention is for bonding a display body and an optical functional material. Examples of the display body include display elements such as an LCD having a polarizing plate attached to glass, an EL display, EL illumination, electronic paper, and a plasma display. Examples of optical functional materials include acrylic plates (which may be subjected to one-sided or double-sided hard coat treatment or AR coat treatment), polycarbonate plates, PET plates, PEN for the purpose of improving visibility and preventing cracking of display elements from external impacts. Examples thereof include a transparent plastic plate such as a plate, tempered glass (which may be provided with a scattering prevention film), and a touch panel input sensor.
本発明の光硬化型樹脂組成物は、その硬化物の弾性率が１２kPa未満であり、かつ硬化物の破断時の伸びが３００％以上である。硬化物がこのような弾性率及び破断時の伸びを有することにより、本発明の光硬化型樹脂組成物は、表示体と光学機能材料を貼り合わせた場合に、接着面が剥がれたり、表示体のガラスが割れたり、表示ムラになったりすることがない。硬化物の弾性率及び破断時の伸びは、後述の実施例に記載の方法により測定できる。 The photocurable resin composition of the present invention has a cured product having an elastic modulus of less than 12 kPa and an elongation at break of the cured product of 300% or more. When the cured product has such an elastic modulus and elongation at break, the photocurable resin composition of the present invention has a bonding surface peeled off when the display body and the optical functional material are bonded together, or the display body The glass will not break or display unevenness. The elastic modulus of the cured product and the elongation at break can be measured by the methods described in Examples below.
本発明において、硬化物の弾性率は１kPa以上１２kPa未満であることが好ましく、硬化物の破断時の伸びは、３００％以上７００％以下であることが好ましい。 In the present invention, the elastic modulus of the cured product is preferably 1 kPa or more and less than 12 kPa, and the elongation at break of the cured product is preferably 300% or more and 700% or less.
本発明の光硬化型樹脂組成物は、硬化物における、４００〜８００nmの光の初期透過率が９５％以上であり、６０℃、湿度９０％で５００時間の放置後の透過率が７０％以上であり、且つ、８５℃で５００時間放置後の透過率が９０％以上であることが好ましい。 In the photocurable resin composition of the present invention, the initial transmittance of light at 400 to 800 nm in the cured product is 95% or more, and the transmittance after standing at 60 ° C. and 90% humidity for 500 hours is 70% or more. And the transmittance after standing for 500 hours at 85 ° C. is preferably 90% or more.
本発明の光硬化型樹脂組成物は、その硬化物の屈折率が１．４５〜１．５５であることが好ましい。 The photocurable resin composition of the present invention preferably has a refractive index of 1.45 to 1.55 of the cured product.
本発明の光硬化型樹脂組成物において、成分（Ａ）に対する成分（Ｃ１）の量比を増やすと、硬化物の弾性率を低下でき、硬化物の破断時の伸びを大きくでき、また、成分（Ｂ）の量比を増やすと、硬化物の弾性率を低下できる。したがって、成分（Ａ）、成分（Ｂ）及び成分（Ｃ１）の配合比を調節することにより、硬化物に所望の弾性率及び破断時の伸びを付与できる。 In the photocurable resin composition of the present invention, when the amount ratio of the component (C1) to the component (A) is increased, the elastic modulus of the cured product can be decreased, and the elongation at break of the cured product can be increased. When the amount ratio of (B) is increased, the elastic modulus of the cured product can be lowered. Therefore, the desired elastic modulus and elongation at break can be imparted to the cured product by adjusting the compounding ratio of component (A), component (B) and component (C1).
本発明の光硬化型樹脂組成物は、好ましくは、（Ａ）の（メタ）アクリレートオリゴマーを１００質量部、（Ｂ）の柔軟化成分を１００〜４００質量部、好ましくは１００〜３００質量部、及び（Ｃ１）の（メタ）アクリレートモノマーを１〜１００質量部、好ましくは５〜５０質量部含む。 The photocurable resin composition of the present invention is preferably 100 parts by weight of (A) (meth) acrylate oligomer, 100 to 400 parts by weight of softening component (B), preferably 100 to 300 parts by weight, And 1 to 100 parts by mass, preferably 5 to 50 parts by mass of the (meth) acrylate monomer (C1).
本発明の光硬化型樹脂組成物は、より好ましくは、成分（Ａ）のオリゴマーとして、ポリイソプレンメタクリレートオリゴマー（１００質量部）を、成分（Ｂ）の柔軟化成分として、液状ポリブタジエン（１０〜３００質量部、好ましくは５０〜２００質量部）及び／又はポリイソプレン（１０〜３００質量部、好ましくは５０〜２００質量部）、並びに、成分（Ｃ１）の（メタ）アクリルモノマーとして、シクロヘキシルメタクリレート（１〜１００質量部、好ましくは５〜５０質量部）及び／又はフェノキシエチルメタクリレート（１〜１００質量部、好ましくは５〜５０質量部）を含む。 The photocurable resin composition of the present invention is more preferably a liquid polybutadiene (10-300) using a polyisoprene methacrylate oligomer (100 parts by mass) as a component (A) oligomer and a softening component of a component (B). Cyclohexyl methacrylate (1) as a (meth) acrylic monomer of component (C1) and / or polyisoprene (10 to 300 parts by mass, preferably 50 to 200 parts by mass) and / or polyisoprene (preferably 50 to 200 parts by mass). -100 mass parts, preferably 5-50 mass parts) and / or phenoxyethyl methacrylate (1-100 mass parts, preferably 5-50 mass parts).
本発明の光硬化型樹脂組成物は、成分（Ａ）と成分（Ｃ１）の相溶性が悪い場合あるいは粘度が高く作業性が悪い場合には、反応希釈剤として、成分（Ｃ１）以外の一般的な（メタ）アクリレートモノマーを含むことができる。一般的な（メタ）アクリレートモノマーとして、例えば、２−エチルヘキシル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｉ−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、ラウリル（メタ）アクリレート、アルキル（メタ）アクリレート、メトキシエチル（メタ）アクリレート、２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、２−ヒドロキシブチル（メタ）アクリレート、ベンジル（メタ）アクリレート、フェニル（メタ）アクリレート、エチレングリコールジ（メタ）アクリレート、ジエチレングリコールジ（メタ）アクリレート、トリエチレングリコールジ（メタ）アクリレート、ヒドロキシエチル（メタ）アクリレート、１，３−ブチレングリコールジ（メタ）アクリレート、１，４−ブチレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、１，６−ヘキサンジオールジ（メタ）アクリレート、ジシクロペンテニルオキシエチル（メタ）アクリレート、ノルボネン（メタ）アクリレートを例示できる。これらの（メタ）アクリレートは１種類または２種類以上を使用できる。 When the compatibility between the component (A) and the component (C1) is poor, or when the viscosity is high and the workability is poor, the photocurable resin composition of the present invention is generally used as a reaction diluent other than the component (C1). (Meth) acrylate monomers can be included. Examples of general (meth) acrylate monomers include 2-ethylhexyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) acrylate, t-butyl (meth) acrylate, lauryl (meth) acrylate, Alkyl (meth) acrylate, methoxyethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) Acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, hydroxyethyl (meth) acrylate, 1,3-butyleneglycol Di (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, norbonene A (meth) acrylate can be illustrated. These (meth) acrylates can be used alone or in combination of two or more.
本発明の光硬化型樹脂組成物は、さらに、光開始剤を含み得る。光開始剤としては、第１の発明で記載した光開始剤が使用できる。光開始剤の量は、成分（Ａ）１００質量部に対して、０．１〜１０質量部である。 The photocurable resin composition of the present invention may further contain a photoinitiator. As the photoinitiator, the photoinitiator described in the first invention can be used. The quantity of a photoinitiator is 0.1-10 mass parts with respect to 100 mass parts of component (A).
本発明の光硬化型樹脂組成物は、さらに、接着付与剤を含有することができる。接着付与剤として、第１の発明において記載したものが使用できる。接着付与剤の量は、成分（Ａ）１００質量部に対して、０．０１〜１０質量部、好ましくは０．５〜５質量部である。 The photocurable resin composition of the present invention can further contain an adhesion promoter. As the adhesion-imparting agent, those described in the first invention can be used. The amount of the adhesion-imparting agent is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the component (A).
本発明の光硬化型樹脂組成物は、さらに、酸化防止剤を含有することができる。酸化防止剤としては、第１の発明で記載したものが使用できる。酸化防止剤の量は、成分（Ａ）１００質量部に対して、０．０１〜１０質量部、好ましくは０．５〜５質量部である。 The photocurable resin composition of the present invention can further contain an antioxidant. As the antioxidant, those described in the first invention can be used. The amount of the antioxidant is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the component (A).
本発明の光硬化型樹脂組成物は、第１の発明と同様に、光硬化と熱硬化の併用タイプの樹脂組成物にできる。有機過酸化物の量は、成分（Ａ）１００質量部に対して、０．１〜１０質量部、好ましくは１〜５質量部である。 The photocurable resin composition of the present invention can be a combined resin composition of photocuring and thermosetting, as in the first invention. The quantity of an organic peroxide is 0.1-10 mass parts with respect to 100 mass parts of component (A), Preferably it is 1-5 mass parts.
また、有機過酸化物の硬化促進剤として、ナフテン酸金属錯体、ジメチルアニリン、４級アンモニウム塩、リン酸エステル類を使用できる。 Moreover, a naphthenic acid metal complex, a dimethylaniline, a quaternary ammonium salt, and phosphate ester can be used as a hardening accelerator of an organic peroxide.
本発明は、上記の光硬化型樹脂組成物で貼り合わせた、表示体と光学機能材料とを含む表示パネルであり、これは、例えば、テレビ、デジカメ、携帯電話、パソコン、モニターなどの電子機器に組み込むことができる。 The present invention is a display panel including a display body and an optical functional material bonded together with the above-described photocurable resin composition, and includes, for example, electronic devices such as a television, a digital camera, a mobile phone, a personal computer, and a monitor. Can be incorporated into.
第３の発明
第３の本発明は、（Ａ）ポリイソプレン、ポリブタジエン又はポリウレタンを骨格にもつ（メタ）アクリレートオリゴマー、（Ｂ）柔軟化成分及び（Ｃ２）チオール化合物及びを含む、表示体と光学機能材料を貼り合わせるための光硬化型樹脂組成物であって、硬化物の弾性率が１０kPa未満であり、かつ硬化物の破断時の伸びが３００％以上であることを特徴とする光硬化型樹脂組成物である。 Third invention A third invention of the present invention comprises (A) a polyisoprene, polybutadiene or polyurethane (meth) acrylate oligomer having a skeleton, (B) a softening component and (C2) a thiol compound, and a display and optical A photocurable resin composition for bonding functional materials, wherein the cured product has an elastic modulus of less than 10 kPa, and the cured product has an elongation at break of 300% or more. It is a resin composition.
本発明の成分（Ａ）、成分（Ｂ）及び成分（Ｃ２）の具体例は、第１の発明で記載したとおりである。 Specific examples of the component (A), the component (B) and the component (C2) of the present invention are as described in the first invention.
本発明の光硬化性樹脂組成物は、表示体と光学機能材料を貼り合わせるためのものである。表示体としては、ガラスに偏光板を貼りつけてあるＬＣＤ、ＥＬディスプレー、ＥＬ照明、電子ペーパーやプラズマディスプレー等の表示素子が挙げられる。光学機能材料としては、視認性向上や外部衝撃から表示素子の割れ防止を目的とするアクリル板（片面又は両面ハードコート処理やＡＲコート処理してあってもよい）、ポリカーボネート板、ＰＥＴ板、ＰＥＮ板などの透明プラスチック板、強化ガラス（飛散防止フィルムが付いていてもよい）及びタッチパネル入力センサーなどがあげられる。 The photocurable resin composition of the present invention is for bonding a display body and an optical functional material. Examples of the display body include display elements such as an LCD having a polarizing plate attached to glass, an EL display, EL illumination, electronic paper, and a plasma display. Examples of optical functional materials include acrylic plates (which may be subjected to one-sided or double-sided hard coat treatment or AR coat treatment), polycarbonate plates, PET plates, PEN for the purpose of improving visibility and preventing cracking of display elements from external impacts. Examples thereof include a transparent plastic plate such as a plate, tempered glass (which may be provided with a scattering prevention film), and a touch panel input sensor.
本発明の光硬化型樹脂組成物は、その硬化物の弾性率が１０kPa未満であり、かつ硬化物の破断時の伸びが３００％以上である。硬化物がこのような弾性率及び破断時の伸びを有することにより、本発明の光硬化型樹脂組成物は、表示体と光学機能材料を貼り合わせた場合に、接着面が剥がれたり、表示体のガラスが割れたり、表示ムラになったりすることがない。硬化物の弾性率及び破断時の伸びは、後述の実施例に記載の方法により測定できる。 In the photocurable resin composition of the present invention, the elastic modulus of the cured product is less than 10 kPa, and the elongation at break of the cured product is 300% or more. When the cured product has such an elastic modulus and elongation at break, the photocurable resin composition of the present invention has a bonding surface peeled off when the display body and the optical functional material are bonded together, or the display body The glass will not break or display unevenness. The elastic modulus of the cured product and the elongation at break can be measured by the methods described in Examples below.
本発明において、硬化物の弾性率は１kPa以上１０kPa未満であることが好ましく、硬化物の破断時の伸びは、３００％以上７００％以下であることが好ましく、３５０％以上６００％以下であることがより好ましい。 In the present invention, the elastic modulus of the cured product is preferably 1 kPa or more and less than 10 kPa, and the elongation at break of the cured product is preferably 300% or more and 700% or less, and is 350% or more and 600% or less. Is more preferable.
本発明の光硬化型樹脂組成物は、硬化物における、４００〜８００nmの光の初期透過率が９５％以上であり、６０℃、湿度９０％で５００時間の放置後の透過率が７０％以上であり、且つ、８５℃で５００時間放置後の透過率が９０％以上であることが好ましい。 In the photocurable resin composition of the present invention, the initial transmittance of light at 400 to 800 nm in the cured product is 95% or more, and the transmittance after standing at 60 ° C. and 90% humidity for 500 hours is 70% or more. And the transmittance after standing for 500 hours at 85 ° C. is preferably 90% or more.
本発明の光硬化型樹脂組成物は、その硬化物の屈折率が１．４５〜１．５５であることが好ましい。 The photocurable resin composition of the present invention preferably has a refractive index of 1.45 to 1.55 of the cured product.
本発明の光硬化型樹脂組成物において、成分（Ａ）に対する成分（Ｃ２）の量比を増やすと、硬化物の弾性率を低下でき、硬化物の破断時の伸びを大きくでき、成分（Ｂ）の量比を増やすと、硬化物の弾性率を低下できる。したがって、成分（Ａ）、成分（Ｂ）及び成分（Ｂ）の配合比を調節することにより、硬化物に所望の弾性率及び破断時の伸びを付与できる。 In the photocurable resin composition of the present invention, when the amount ratio of the component (C2) to the component (A) is increased, the elastic modulus of the cured product can be reduced, the elongation at break of the cured product can be increased, and the component (B When the quantity ratio of) is increased, the elastic modulus of the cured product can be lowered. Therefore, the desired elastic modulus and elongation at break can be imparted to the cured product by adjusting the compounding ratio of component (A), component (B), and component (B).
本発明の光硬化型樹脂組成物は、（Ａ）の（メタ）アクリレートオリゴマーを１００質量部、（Ｂ）の柔軟化成分を好ましくは１０〜３００質量部、より好ましくは１００〜２００質量部、（Ｃ２）のチオール化合物を好ましくは０．０５〜１００質量部、より好ましくは０．１〜１０質量部含む。 In the photocurable resin composition of the present invention, the (A) (meth) acrylate oligomer is 100 parts by mass, the softening component (B) is preferably 10 to 300 parts by mass, more preferably 100 to 200 parts by mass, The thiol compound (C2) is preferably contained in an amount of 0.05 to 100 parts by mass, more preferably 0.1 to 10 parts by mass.
本発明の光硬化型樹脂組成物は、特に好ましくは、成分（Ａ）のオリゴマーとして、ポリイソプレンメタクリレート（１００質量部）、成分（Ｂ）の柔軟化成分として、液状ポリブタジエン（１０〜３００質量部、好ましくは１００〜２００質量部）及び／又は液状ポリイソプレン（１０〜３００質量部、好ましくは１００〜２００質量部）を、並びに成分（Ｃ２）のチオール化合物として、ペンタエリスリトールテトラキス（３−メルカプトブチレート）（０．０５〜１００質量部、好ましくは０．１〜１０質量部）を含む。 The photocurable resin composition of the present invention is particularly preferably a polyisoprene methacrylate (100 parts by mass) as an oligomer of the component (A), and a liquid polybutadiene (10 to 300 parts by mass) as a softening component of the component (B). , Preferably 100 to 200 parts by mass) and / or liquid polyisoprene (10 to 300 parts by mass, preferably 100 to 200 parts by mass), and thiol compound of component (C2), pentaerythritol tetrakis (3-mercaptobuti Rate) (0.05 to 100 parts by mass, preferably 0.1 to 10 parts by mass).
本発明の光硬化型樹脂組成物は、相溶性が悪い場合あるいは作業性を向上させるために、（メタ）アクリレートモノマーを含むことができる。（メタ）アクリレートモノマーとして、第１の発明において記載したものが使用できる。（メタ）アクリレートモノマーの添加により、チオール化合物および柔軟化成分の添加量を調整できる。アクリレートモノマーは、所望の相溶性を付与できる範囲で添加されるが、好ましくは、成分（Ａ）１００質量部に対して、１〜１００質量部、より好ましくは１０〜５０質量部である。 The photocurable resin composition of the present invention can contain a (meth) acrylate monomer when the compatibility is poor or in order to improve workability. As the (meth) acrylate monomer, those described in the first invention can be used. The addition amount of the thiol compound and the softening component can be adjusted by adding the (meth) acrylate monomer. Although an acrylate monomer is added in the range which can provide desired compatibility, Preferably it is 1-100 mass parts with respect to 100 mass parts of component (A), More preferably, it is 10-50 mass parts.
本発明の光硬化型樹脂組成物は、さらに、光開始剤を含み得る。光開始剤としては、第１の発明に記載したものが使用できる。光開始剤の量は、成分（Ａ）１００質量部に対して、０．１〜１０質量部である The photocurable resin composition of the present invention may further contain a photoinitiator. As the photoinitiator, those described in the first invention can be used. The quantity of a photoinitiator is 0.1-10 mass parts with respect to 100 mass parts of component (A).
本発明の光硬化型樹脂組成物は、さらに、接着付与剤を含有することができる。接着付与剤として、第１の発明で記載したものが使用できる。接着付与剤の量は、成分（Ａ）１００質量部に対して、０．０１〜２０質量部、好ましくは０．５〜５質量部である。 The photocurable resin composition of the present invention can further contain an adhesion promoter. As the adhesion-imparting agent, those described in the first invention can be used. The amount of the adhesion-imparting agent is 0.01 to 20 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the component (A).
本発明の光硬化型樹脂組成物は、さらに、酸化防止剤を含有することができる。酸化防止剤としては、第１の発明で記載したものが使用できる。酸化防止剤の量は、成分（Ａ）１００質量部に対して、０．０１〜１０質量部、好ましくは０．５〜５質量部である。 The photocurable resin composition of the present invention can further contain an antioxidant. As the antioxidant, those described in the first invention can be used. The amount of the antioxidant is 0.01 to 10 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of the component (A).
本発明の光硬化型樹脂組成物は、第１の発明と同様に、光硬化と熱硬化の併用タイプの樹脂組成物にできる。有機過酸化物の量は、成分（Ａ）１００質量部に対して、０．１〜１０質量部、好ましくは１〜５質量部である。 The photocurable resin composition of the present invention can be a combined resin composition of photocuring and thermosetting, as in the first invention. The quantity of an organic peroxide is 0.1-10 mass parts with respect to 100 mass parts of component (A), Preferably it is 1-5 mass parts.
また、これら有機過酸化物の硬化促進剤として、ナフテン酸金属錯体、ジメチルアニリン、４級アンモニウム塩、リン酸エステル類を使用できる。 In addition, naphthenic acid metal complexes, dimethylaniline, quaternary ammonium salts, and phosphate esters can be used as curing accelerators for these organic peroxides.
本発明は、上記の光硬化型樹脂組成物で貼り合わせた、表示体と光学機能材料とを含む表示パネルであり、これは、例えば、テレビ、デジカメ、携帯電話、パソコン、モニター、テレビなどの電子機器に組み込むことができる。 The present invention is a display panel comprising a display body and an optical functional material bonded together with the above-described photocurable resin composition, and includes, for example, a television, a digital camera, a mobile phone, a personal computer, a monitor, a television, and the like. Can be incorporated into electronic equipment.
本発明を以下の実施例により説明するが、本発明はこれらの実施例に限定されない。 The present invention is illustrated by the following examples, but the present invention is not limited to these examples.
（実施例１）
表１及び２に示した成分を表１及び２に示した量（質量部）で配合して実施例Ａ〜Ｉの光硬化型樹脂組成物を得た。
ＱＭ６５７：ジシクロペンテニルオキシエチルメタクリレート
ＬＡ：ラウリルアクリレート
ＣＨ：シクロヘキシルメタクリレート
ＰＯ：フェノキシエチルメタクリレート
ＡＭＰ−２０ＧＹ：フェノキシポリエチレングリコールアクリレート
７０２Ａ：２−ヒドロキシ−３−フェノキシプロピルアクリレート
ＴＨＦ：テトラヒドロフルフリルメタクリレート
ＮＰ−４ＥＡ：ノニルフェノールＥＯ付加物アクリレート
ＭＴＧ−Ａ：メトキシトリエチレングリコールアクリレート
ルシリンＴＰＯ：２，４，６−トリメチルベンゾイルフェニルエトキシホスフィンオキサイド
イルガキュア１８４：１−ヒドロキシ−シクロヘキシル−フェニル−ケトン
ポリオイル１１０：液状ポリブタジエン
Ｌ−ＬＩＲ：液状ポリイソプレン
イルガノックス１０１０：ペンタエリスリチル・テトラキス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］Example 1
The components shown in Tables 1 and 2 were blended in the amounts (parts by mass) shown in Tables 1 and 2 to obtain the photocurable resin compositions of Examples A to I.
QM657: dicyclopentenyloxyethyl methacrylate LA: lauryl acrylate CH: cyclohexyl methacrylate PO: phenoxyethyl methacrylate AMP-20GY: phenoxypolyethylene glycol acrylate 702A: 2-hydroxy-3-phenoxypropyl acrylate THF: tetrahydrofurfuryl methacrylate NP-4EA: Nonylphenol EO adduct acrylate MTG-A: Methoxytriethylene glycol acrylate Lucillin TPO: 2,4,6-Trimethylbenzoylphenylethoxyphosphine oxide Irgacure 184: 1-hydroxy-cyclohexyl-phenyl-ketone Polyoil 110: Liquid polybutadiene L-LIR: Liquid polyisoprene Irganox 1 010: Pentaerythrityl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate]
（試験例１）
実施例１で製造した実施例Ａ〜Ｉの光硬化型樹脂組成物を使用して、下記の各種試験により特性値を分析した。結果を表３〜５に示す。実施例Ａ〜Ｉのいずれにも、ヒートショック試験、耐熱試験及び耐湿試験において気泡は存在しなかった。
弾性率及び破断時の伸びは、ＪＩＳＺ１７０２ Ｎｏ．３ダンベル試験片（厚さ１mmt）を島津製作所製オートグラフを用いて１０m/minの速度により測定した。尚、ダンベル試験片は、コンベア付拡散メタルハライドランプを使用し、積算光量６０００mJ/cm2で硬化させた。
収縮率は、ＪＩＳ−Ｋ−６８３３に準じて液比重と硬化物比重を測定し、両者の体積比から算出した。
透過率は、リファレンス側にガラス（１mm厚）、試料室側に１mm厚ガラスの間に１mm厚で樹脂組成物を硬化させて調製した試験片を日本分光製の紫外可視分光器を用いて４００nm〜８００nmの波長で測定した。８５℃５００時間後および６０℃／９０％５００時間後の透過率についても同様に測定した。
屈折率は、厚さ３００μmのシート状に調製した試験片をアタゴ製アッベ屈折率計（Ｄ線，２５℃）で測定した。
ヒートショック試験は、０．８mm厚のアクリル板（三菱レーヨン社製ＭＲ−２００）と０．８mm厚のガラス板（３０×４０mm）とを光硬化性樹脂組成物を用いて硬化厚さ１００μmで貼り合わせた試験片（ガラス／アクリル試験片）、又は０．８mm厚のガラス板と０．７ｍｍ厚のガラス板（３０×４０mm）を光硬化性樹脂組成物を用いて硬化厚さ１００μmで貼り合わせて作成した試験片（ガラス／ガラス試験片）を用いて行った。試験片を−４０℃⇔８５℃、各３０minで５００サイクル行い、試験後目視にて剥がれ、気泡および破損の有無を確認した。
耐熱試験は、ヒートショック試験で使用したのと同じ試験片を８５℃オーブン中にて５００時間保持し、試験後目視にて剥がれ、気泡および破損の有無を確認した。
耐湿試験は、ヒートショック試験で使用したのと同じ試験片を６０℃／９０％の恒温恒湿中にて５００時間保持し、試験後目視にて剥がれ、気泡および破損の有無を確認した。
なお、ガラス／ガラス試験片による試験で、タッチパネル接着用の接着特性が測定でき、ガラス／アクリル試験片による試験で、表示体と光学機能材料の接着特性が測定できる。
Using the photocurable resin compositions of Examples A to I produced in Example 1, the characteristic values were analyzed by the following various tests. The results are shown in Tables 3-5. In any of Examples A to I, bubbles were not present in the heat shock test, the heat resistance test, and the moisture resistance test.
The elastic modulus and elongation at break are JISZ1702 No. Three dumbbell test pieces (thickness 1 mmt) were measured at a speed of 10 m / min using an autograph manufactured by Shimadzu Corporation. The dumbbell specimen was cured with a cumulative light quantity of 6000 mJ / cm 2 using a diffusion metal halide lamp with a conveyor.
The shrinkage ratio was calculated from the volume ratio of the liquid specific gravity and the cured product specific gravity measured according to JIS-K-6833.
The transmittance is 400 nm using a UV-visible spectroscope manufactured by JASCO Corporation. A test piece prepared by curing the resin composition with a thickness of 1 mm between glass (1 mm thickness) on the reference side and 1 mm thickness glass on the sample chamber side. Measured at a wavelength of ˜800 nm. The transmittance after 85 hours at 85 ° C. and after 60 ° C./90% after 500 hours was also measured.
The refractive index was measured with an Atago Abbe refractometer (D-line, 25 ° C.) for a test piece prepared in a sheet shape having a thickness of 300 μm.
In the heat shock test, a 0.8 mm thick acrylic plate (Mitsubishi Rayon Co., Ltd. MR-200) and a 0.8 mm thick glass plate (30 × 40 mm) were cured with a photocurable resin composition at a thickness of 100 μm. Bonded test piece (glass / acrylic test piece) or 0.8mm thick glass plate and 0.7mm thick glass plate (30x40mm) with photocuring resin composition with a cured thickness of 100μm A test piece (glass / glass test piece) prepared together was used. The test piece was subjected to 500 cycles at −40 ° C. to 85 ° C. for 30 minutes each, peeled off visually after the test, and checked for bubbles and breakage.
In the heat resistance test, the same test piece used in the heat shock test was held in an oven at 85 ° C. for 500 hours, peeled off visually after the test, and the presence or absence of bubbles and damage was confirmed.
In the moisture resistance test, the same test piece used in the heat shock test was held in a constant temperature and humidity of 60 ° C./90% for 500 hours, peeled off visually after the test, and checked for bubbles and breakage.
In addition, the adhesion characteristic for touch panel adhesion | attachment can be measured by the test by a glass / glass test piece, and the adhesion characteristic of a display body and an optical functional material can be measured by the test by a glass / acryl test piece.
（実施例２）
表６に示した成分を表６に示した量で配合して実施例Ａ２〜Ｈ２の光硬化型樹脂組成物を得た。
ＨＯＢ：２−ヒドロキシブチルメタクリレート
ＱＭ６５７：ジシクロペンテニルオキシエチルメタクリレート
ＢＺ：ベンジルメタアクリレート
カレンズＰＥ−１：ペンタエリスリトールテトラキス（３−メルカプトブチレート）
ＴＭＭＰ：トリメチロールプロパントリス（３−メルカプトプロピオネート）
ルシリンＴＰＯ：２，４，６−トリメチルベンゾイルフェニルエトキシホスフィンオキサイド
イルガキュア１８４：１−ヒドロキシ−シクロヘキシル−フェニル−ケトン
ポリオイル１１０：液状ポリブタジエン
Ｌ−ＬＩＲ：液状ポリイソプレン
イルガノックス１０１０：ペンタエリスリチル・テトラキス［３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート］
イルガノックス１５２０Ｌ：４，６−ビス(オクチルチオメチル)−ｏ−クレゾール(Example 2)
The components shown in Table 6 were blended in the amounts shown in Table 6 to obtain photocurable resin compositions of Examples A2 to H2.
HOB: 2-hydroxybutyl methacrylate QM657: dicyclopentenyloxyethyl methacrylate BZ: benzyl methacrylate
Karenz PE-1: Pentaerythritol tetrakis (3-mercaptobutyrate)
TMMP: Trimethylolpropane tris (3-mercaptopropionate)
Lucillin TPO: 2,4,6-trimethylbenzoylphenylethoxyphosphine oxide Irgacure 184: 1-hydroxy-cyclohexyl-phenyl-ketone Polyoil 110: Liquid polybutadiene L-LIR: Liquid polyisoprene Irganox 1010: Pentaerythrityl tetrakis [3 -(3,5-di-tert-butyl-4-hydroxyphenyl) propionate]
Irganox 1520L: 4,6-bis (octylthiomethyl) -o-cresol
（試験例２）
実施例２で製造した実施例Ａ２〜Ｈ２の光硬化型樹脂組成物を使用して、各種の試験を行い特性値を分析した。
分析結果を表７に示す。実施例Ａ２〜Ｈ２のいずれにも、ヒートショック試験、耐熱試験及び耐湿試験において気泡は存在しなかった。
Using the photocurable resin compositions of Examples A2 to H2 manufactured in Example 2, various tests were performed and characteristic values were analyzed.
The analysis results are shown in Table 7. In any of Examples A2 to H2, bubbles were not present in the heat shock test, the heat resistance test, and the moisture resistance test.
第１の本発明によれば、タッチパネルの上に化粧板やアイコンシートを貼り合わせる場合や、静電容量式タッチパネルにおける透明電極を形成した透明基板と透明板とを貼り合わせる場合に、十分な接着性を付与し気泡を含ませずに貼り合わせるための光硬化型接着組成物を提供できる。
第２又は第３の本発明によれば、接着面が剥がれたり、表示体のガラスが割れたりすることのない、表示体と光学機能性材料とを貼り合わせるための光硬化型樹脂組成物、及び表示体と光学機能性材料とを貼り合わせた表示パネルを提供できる。According to 1st this invention, when bonding a decorative board and an icon sheet | seat on a touch panel, or when bonding the transparent substrate and transparent plate which formed the transparent electrode in an electrostatic capacitance type touch panel, sufficient adhesion | attachment is carried out. It is possible to provide a photocurable adhesive composition for imparting properties and bonding without containing bubbles.
According to the second or third aspect of the present invention, a photocurable resin composition for bonding a display body and an optical functional material without bonding surfaces being peeled off or glass of the display body being broken, In addition, a display panel in which the display body and the optical functional material are bonded can be provided.
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| JP2017210578A (en) * | 2016-05-27 | 2017-11-30 | 協立化学産業株式会社 | Curable resin composition |
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| JPWO2012005169A1 (en) * | 2010-07-08 | 2013-09-02 | 電気化学工業株式会社 | Curable resin composition |
| JP5755419B2 (en) * | 2010-08-27 | 2015-07-29 | 協立化学産業株式会社 | Photo-curing adhesive composition for bonding optical display or touch sensor and optical display or touch sensor bonded using the same |
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| JP2014095080A (en) | 2014-05-22 |
| CN102144009A (en) | 2011-08-03 |
| KR101805275B1 (en) | 2017-12-05 |
| KR20110050711A (en) | 2011-05-16 |
| CN103589347A (en) | 2014-02-19 |
| KR20150038553A (en) | 2015-04-08 |
| KR20150038554A (en) | 2015-04-08 |
| CN102144009B (en) | 2016-04-20 |
| JPWO2010027041A1 (en) | 2012-02-02 |
| KR101643511B1 (en) | 2016-07-27 |
| KR101823196B1 (en) | 2018-01-29 |
| TW201026801A (en) | 2010-07-16 |
| TWI485214B (en) | 2015-05-21 |
| JP5947275B2 (en) | 2016-07-06 |
| KR20140048346A (en) | 2014-04-23 |
| WO2010027041A1 (en) | 2010-03-11 |
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