JP6975834B2 - Manufacturing method of image display device - Google Patents

Manufacturing method of image display device Download PDF

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JP6975834B2
JP6975834B2 JP2020180312A JP2020180312A JP6975834B2 JP 6975834 B2 JP6975834 B2 JP 6975834B2 JP 2020180312 A JP2020180312 A JP 2020180312A JP 2020180312 A JP2020180312 A JP 2020180312A JP 6975834 B2 JP6975834 B2 JP 6975834B2
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light
image display
cover member
shielding layer
resin composition
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JP2021039357A (en
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康一 小川
由久 新家
直樹 林
倫由紀 豊田
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Dexerials Corp
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本発明は、液晶表示パネル等の画像表示部材とその表面側に配される透明保護シート等の光透過性カバー部材とを、光透過性硬化樹脂層を介して接着・積層して画像表示装置を製造する方法に関する。 The present invention is an image display device in which an image display member such as a liquid crystal display panel and a light transmissive cover member such as a transparent protective sheet arranged on the surface side thereof are bonded and laminated via a light transmissive cured resin layer. Regarding the method of manufacturing.

スマートフォーン等の情報端末に用いられている液晶表示パネル等の画像表示装置は、液晶表示パネルや有機ELパネル等の画像表示部材と光透過性カバー部材との間に、光硬化性樹脂組成物を配した後、その組成物に紫外線を照射して硬化させて光透過性硬化樹脂層とし、それにより画像表示部材と光透過性カバー部材とを接着・積層することにより製造されている(特許文献1)。 An image display device such as a liquid crystal display panel used in an information terminal such as a smart phone is a photocurable resin composition between an image display member such as a liquid crystal display panel or an organic EL panel and a light transmissive cover member. After arranging the composition, the composition is cured by irradiating it with ultraviolet rays to form a light-transmitting cured resin layer, whereby the image display member and the light-transmitting cover member are bonded and laminated (patented). Document 1).

ところで、光透過性カバー部材の画像表示部側表面の周縁部には、表示画像の輝度やコントラスト向上のために遮光層が設けられているため、そのような遮光層と画像表示部材との間に挟まれた光硬化性樹脂組成物の硬化が十分に進行せず、そのため十分な接着力が得られず、光透過性カバー部材と画像表示部材との間の剥離や、その間隙への湿気の侵入により画像品質の低下等が生ずるということが懸念されている。 By the way, since a light-shielding layer is provided on the peripheral edge of the surface of the light-transmitting cover member on the image display portion side in order to improve the brightness and contrast of the displayed image, between such a light-shielding layer and the image display member. Curing of the photocurable resin composition sandwiched between the light-curable resin compositions does not proceed sufficiently, so that sufficient adhesive force cannot be obtained, peeling between the light-transmitting cover member and the image display member, and moisture in the gaps thereof. There is a concern that the image quality may deteriorate due to the intrusion of light.

そこで、光硬化性樹脂組成物に熱重合開始剤を配合して熱及び光硬化性樹脂組成物とし、遮光層が形成された光透過性カバー部材の表面に、この熱及び光硬化性樹脂組成物を塗布し、この塗布面を画像表示部材に重ね、紫外線を照射して光硬化させた後に、全体を加熱することにより遮光層と画像表示部材との間に挟まれた熱及び光硬化性樹脂組成物を熱硬化させることが提案されている(特許文献2)。 Therefore, a thermosetting initiator is blended with the photocurable resin composition to obtain a thermosetting resin composition, and the thermosetting resin composition is formed on the surface of the light-transmitting cover member on which the light-shielding layer is formed. An object is applied, the coated surface is superposed on the image display member, and after being photo-cured by irradiating with ultraviolet rays, the whole is heated to have heat and photo-curability sandwiched between the light-shielding layer and the image display member. It has been proposed to thermoset the resin composition (Patent Document 2).

国際公開2010/027041号International Publication 2010/027041 国際公開2008/126860号International Publication No. 2008/128686

しかしながら、特許文献2の技術によれば、特許文献1で懸念された問題の解消は期待できるが、光重合開始剤に熱重合開始剤を同時に併用し、光重合プロセスに加えて熱重合プロセスとを実施しなければならないため、熱重合プロセスのための設備投資の負担が大きくなるという問題や、熱及び光硬化性樹脂組成物の保存安定性が低下するという問題があった。更に、熱及び光硬化性樹脂組成物が塗布された光透過性カバー部材と画像表示部材とに重ねる際、その段階では硬化プロセスを経ていないため、遮光層と光透過性カバー部材の表面との間から樹脂組成物が排除されてしまい、遮光層と光透過性カバー部材表面との間の段差がキャンセルされず、気泡の発生や光透過性カバーと樹脂の層間剥離という問題の発生も懸念されている。 However, according to the technique of Patent Document 2, although the problem of concern in Patent Document 1 can be expected to be solved, the thermal polymerization initiator is used in combination with the photopolymerization initiator at the same time, and the thermal polymerization process is added to the photopolymerization process. Therefore, there is a problem that the burden of capital investment for the thermal polymerization process becomes large, and there is a problem that the storage stability of the heat and photocurable resin composition is lowered. Further, when the light transmissive cover member coated with the heat and photocurable resin composition and the image display member are superposed, the light-shielding layer and the surface of the light transmissive cover member are not subjected to the curing process at that stage. Since the resin composition is removed from the space, the step between the light-shielding layer and the surface of the light-transmitting cover member is not canceled, and there is a concern that bubbles may be generated and problems such as delamination between the light-transmitting cover and the resin may occur. ing.

本発明の目的は、以上の従来の技術の問題点を解決することであり、遮光層と画像表示部材との間の光硬化性樹脂組成物を、そこから排除されることなく十分に光硬化させ且つ遮光層と光透過性カバー部材表面との間の段差をキャンセルすることができる画像表示装置の製造方法を提供する。 An object of the present invention is to solve the above-mentioned problems of the prior art, and the photocurable resin composition between the light-shielding layer and the image display member is sufficiently photo-cured without being excluded from the light-curing resin composition. Provided is a method for manufacturing an image display device capable of canceling a step between a light-shielding layer and a surface of a light-transmitting cover member.

本発明者は、液状の光硬化性樹脂組成物を、一旦、遮光層を含む光透過性カバー部材の表面に、遮光層の厚さより厚く塗布した後、遮光層上に位置する光硬化性樹脂組成物に対し、紫外線を照射して硬化率を高め、仮硬化させておくことにより、遮光層と画像表示部材との間の光透過性硬化樹脂層を、その間から排除することなく十分に光硬化させることができ、しかも遮光層と光透過性カバー部材の遮光層形成側表面との間の段差をキャンセルできることを見出し、本発明を完成させるに至った。 The present inventor applies a liquid photocurable resin composition to the surface of a light-transmitting cover member including a light-shielding layer once thicker than the thickness of the light-shielding layer, and then the photo-curable resin located on the light-shielding layer. By irradiating the composition with ultraviolet rays to increase the curing rate and temporarily curing the composition, sufficient light is not removed from the light-transmitting cured resin layer between the light-shielding layer and the image display member. We have found that it can be cured and can cancel the step between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side, and have completed the present invention.

すなわち、本発明は、画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、液状の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示装置の製造方法において、以下の工程(A)〜(D)を有する製造方法を提供する。 That is, in the present invention, the image display member and the light-transmitting cover member having a light-shielding layer formed on the peripheral edge thereof are light-transmitted through the light-transmitting curable resin layer formed from the liquid photo-curable resin composition. Provided is a manufacturing method having the following steps (A) to (D) in a method for manufacturing an image display device in which a light-shielding layer forming surface of a transparent cover member is arranged so as to be arranged on the image display member side.

<工程(A)>
液状の光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面又は画像表示部材の表面に、遮光層と光透過性カバー部材の遮光層形成側表面とで形成される段差がキャンセルされるように、遮光層の厚さより厚く塗布する工程。
<Process (A)>
The liquid photocurable resin composition has a step formed on the surface of the light-transmitting cover member on the light-shielding layer forming side or the surface of the image display member between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side. The process of applying thicker than the thickness of the light-shielding layer so that it is canceled.

<工程(B)>
少なくとも遮光層上に位置する光硬化性樹脂組成物に対し紫外線を照射して仮硬化させ、遮光層上の仮硬化樹脂層の硬化率を30〜80%とする工程。
<Process (B)>
A step of irradiating at least the photocurable resin composition located on the light-shielding layer with ultraviolet rays to temporarily cure the photo-curable resin composition so that the curing rate of the temporarily-cured resin layer on the light-shielding layer is 30 to 80%.

<工程(C)>
画像表示部材に、遮光層と仮硬化樹脂層とが内側となるように光透過性カバー部材を貼り合わせる工程。
<Process (C)>
A process of attaching a light-transmitting cover member to an image display member so that the light-shielding layer and the temporarily cured resin layer are on the inside.

<工程(D)>
画像表示部材と光透過性カバー部材との間に挟持されている仮硬化樹脂層に対し紫外線を照射して本硬化させることにより、画像表示部材と光透過性カバー部材とを光透過性硬化樹脂層を介して積層して画像表示装置を得る工程。
<Process (D)>
By irradiating the temporarily cured resin layer sandwiched between the image display member and the light transmissive cover member with ultraviolet rays to perform main curing, the image display member and the light transmissive cover member are made of a light transmissive cured resin. A process of obtaining an image display device by laminating through layers.

本発明の画像表示装置の製造方法においては、液状の光硬化性樹脂組成物を、遮光層を含む光透過性カバー部材の表面又は画像表示部材の表面に、遮光層の厚さより厚く塗布した後、少なくとも遮光層上に位置する光硬化性樹脂組成物に対し紫外線を照射して仮硬化させ、遮光層上の仮硬化樹脂層の硬化率を30〜80%とする。続いて、仮硬化樹脂層を介して画像表示部材と光透過性カバー部材とを積層した後に紫外線を照射して本硬化させて光透過性硬化樹脂層を形成する。このため、遮光層と画像表示部材との間の光透過性硬化樹脂層をその間から排除することなく十分に光硬化させ且つ遮光層と光透過性カバー部材の遮光層形成側表面との間の段差をキャンセルできる。 In the method for manufacturing an image display device of the present invention, a liquid photocurable resin composition is applied to the surface of a light transmissive cover member including a light-shielding layer or the surface of an image display member after being thicker than the thickness of the light-shielding layer. At least, the photocurable resin composition located on the light-shielding layer is temporarily cured by irradiating it with ultraviolet rays to set the curing rate of the temporarily-cured resin layer on the light-shielding layer to 30 to 80%. Subsequently, the image display member and the light-transmitting cover member are laminated via the temporarily cured resin layer, and then irradiated with ultraviolet rays to be main-cured to form the light-transmitting cured resin layer. Therefore, the light-transmitting cured resin layer between the light-shielding layer and the image display member is sufficiently photo-cured without being removed from the space between the light-shielding layer and the light-transmitting cover member, and between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side. You can cancel the step.

図1Aは、本発明の画像表示装置の製造方法の工程(A)の説明図である。FIG. 1A is an explanatory diagram of a step (A) of a method for manufacturing an image display device of the present invention. 図1Bは、本発明の画像表示装置の製造方法の工程(A)の説明図である。FIG. 1B is an explanatory diagram of a step (A) of a method for manufacturing an image display device of the present invention. 図1Cは、本発明の画像表示装置の製造方法の工程(B)の説明図である。FIG. 1C is an explanatory diagram of a step (B) of a method for manufacturing an image display device of the present invention. 図1Dは、本発明の画像表示装置の製造方法の工程(B)の説明図である。FIG. 1D is an explanatory diagram of a step (B) of a method for manufacturing an image display device of the present invention. 図1Eは、本発明の画像表示装置の製造方法の工程(C)の説明図である。FIG. 1E is an explanatory diagram of a step (C) of a method for manufacturing an image display device of the present invention. 図1Fは、本発明の画像表示装置の製造方法の工程(D)の説明図である。FIG. 1F is an explanatory diagram of a step (D) of a method for manufacturing an image display device of the present invention. 図1Gは、本発明の画像表示装置の製造方法の工程(D)の説明図である。FIG. 1G is an explanatory diagram of a step (D) of a method for manufacturing an image display device of the present invention. 図2Aは、本発明の画像表示装置の製造方法の工程(AA)の説明図である。FIG. 2A is an explanatory diagram of a process (AA) of a method for manufacturing an image display device of the present invention. 図2Bは、本発明の画像表示装置の製造方法の工程(BB)の説明図である。FIG. 2B is an explanatory diagram of a process (BB) of a method for manufacturing an image display device of the present invention. 図2Cは、本発明の画像表示装置の製造方法の工程(BB)の説明図である。FIG. 2C is an explanatory diagram of a process (BB) of a method for manufacturing an image display device of the present invention. 図2Dは、本発明の画像表示装置の製造方法の工程(CC)の説明図である。FIG. 2D is an explanatory diagram of a process (CC) of a method for manufacturing an image display device of the present invention. 図2Eは、本発明の画像表示装置の製造方法の工程(DD)の説明図である。FIG. 2E is an explanatory diagram of a process (DD) of the manufacturing method of the image display device of the present invention. 図2Fは、本発明の画像表示装置の製造方法の工程(DD)の説明図である。FIG. 2F is an explanatory diagram of a process (DD) of the manufacturing method of the image display device of the present invention. 図3は、光透過性硬化樹脂層の接着強度試験の説明図である。FIG. 3 is an explanatory diagram of an adhesive strength test of a light-transmitting cured resin layer.

以下、工程(A)〜(D)を有する本発明の画像表示装置の製造方法を、図面を参照しながら工程毎に詳細に説明する。 Hereinafter, the method for manufacturing the image display device of the present invention having the steps (A) to (D) will be described in detail for each step with reference to the drawings.

<工程(A)(塗布工程)>
まず、図1Aに示すように、片面の周縁部に形成された遮光層1を有する光透過性カバー部材2を用意し、図1Bに示すように、光透過性カバー部材2の表面2aに、液状の光硬化性樹脂組成物3を、遮光層1と光透過性カバー部材2の遮光層形成側表面2aとで形成される段差4がキャンセルされるように、遮光層1の厚さより厚く塗布する。具体的には、遮光層1の表面も含め、光透過性カバー部材2の遮光層形成側表面2aの全面に光硬化性樹脂組成物3を平坦になるように塗布し、段差が生じないようにする。従って、光硬化性樹脂組成物3を、遮光層1の厚さの好ましくは1.2〜12.5倍、より好ましくは2.5〜4倍の厚さで塗布する。
<Step (A) (Coating step)>
First, as shown in FIG. 1A, a light-transmitting cover member 2 having a light-shielding layer 1 formed on the peripheral edge of one side is prepared, and as shown in FIG. 1B, the surface 2a of the light-transmitting cover member 2 is formed. The liquid photocurable resin composition 3 is applied thicker than the thickness of the light-shielding layer 1 so that the step 4 formed by the light-shielding layer 1 and the light-transmitting layer-forming side surface 2a of the light-transmitting cover member 2 is cancelled. do. Specifically, the photocurable resin composition 3 is applied flatly on the entire surface of the light-shielding layer forming side surface 2a of the light-transmitting cover member 2, including the surface of the light-shielding layer 1, so that a step is not generated. To. Therefore, the photocurable resin composition 3 is applied to a thickness of preferably 1.2 to 12.5 times, more preferably 2.5 to 4 times the thickness of the light-shielding layer 1.

なお、この光硬化性樹脂組成物3の塗布は、必要な厚みが得られるように複数回行ってもよい。 The photocurable resin composition 3 may be applied a plurality of times so as to obtain a required thickness.

光透過性カバー部材2としては、画像表示部材に形成された画像が視認可能となるような光透過性があればよく、ガラス、アクリル樹脂、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリカーボネート等の板状材料やシート状材料が挙げられる。これらの材料には、片面又は両面ハードコート処理、反射防止処理などを施すことができる。光透過性カバー部材2の厚さや弾性などの物性は、使用目的に応じて適宜決定することができる。 The light-transmitting cover member 2 may have light-transmitting properties such that the image formed on the image display member can be visually recognized, and is a plate-like material such as glass, acrylic resin, polyethylene terephthalate, polyethylene naphthalate, or polycarbonate. And sheet-like materials. These materials can be subjected to single-sided or double-sided hardcourt treatment, antireflection treatment, and the like. Physical properties such as the thickness and elasticity of the light transmissive cover member 2 can be appropriately determined according to the purpose of use.

遮光層1は、画像のコントラストを挙げるため等に設けられるものであり、黒色等に着色された塗料をスクリーン印刷法などで塗布し、乾燥・硬化させたものである。遮光層1の厚みとしては、通常5〜100μmであり、この厚みが段差4に相当する。 The light-shielding layer 1 is provided to increase the contrast of an image or the like, and is obtained by applying a paint colored in black or the like by a screen printing method or the like, and drying and curing the paint. The thickness of the light-shielding layer 1 is usually 5 to 100 μm, and this thickness corresponds to the step 4.

本工程で使用する光硬化性樹脂組成物3の性状は液状である。液状のものを使用するので、遮光層1と光透過性カバー部材2の遮光層形成側表面2aとで形成される段差4をキャンセルできる。ここで、液状とは、コーンプレート型粘度計で0.01〜100Pa.s(25℃)の粘度を示すものである。 The properties of the photocurable resin composition 3 used in this step are liquid. Since a liquid material is used, the step 4 formed by the light-shielding layer 1 and the light-shielding layer-forming side surface 2a of the light-transmitting cover member 2 can be canceled. Here, the liquid means 0.01 to 100 Pa. With a cone plate type viscometer. It shows the viscosity of s (25 ° C).

このような光硬化性樹脂組成物3は、アクリレート系オリゴマー成分(成分(イ))、アクリレート系モノマー成分(成分(ロ))、及び光重合開始剤(成分(ハ))を主成分として含有するものを好ましく例示することができる。 Such a photocurable resin composition 3 contains an acrylate-based oligomer component (component (a)), an acrylate-based monomer component (component (b)), and a photopolymerization initiator (component (c)) as main components. Can be preferably exemplified.

成分(イ)のアクリル系オリゴマーは、光硬化性樹脂組成物のベース材料として使用されている。好ましい具体例としては、ポリイソプレン、ポリウレタン、ポリブタジエン等を骨格に持つ(メタ)アクリレート系オリゴマーを挙げることができる。なお、本明細書において、“(メタ)アクリレート”という用語は、アクリレートとメタクリレートとを包含する。 The acrylic oligomer of component (a) is used as a base material for the photocurable resin composition. Preferred specific examples include (meth) acrylate-based oligomers having a skeleton of polyisoprene, polyurethane, polybutadiene and the like. In addition, in this specification, the term "(meth) acrylate" includes acrylate and methacrylate.

ポリイソプレン骨格の(メタ)アクリレートオリゴマーの好ましい具体例としては、ポリイソプレン重合体の無水マレイン酸付加物と2−ヒドロキシエチルメタクリレートとのエステル化物(UC102(ポリスチレン換算分子量17000)、(株)クラレ;UC203(ポリスチレン換算分子量35000)、(株)クラレ;;UC−1(分子量約25000)、(株)クラレ)等を挙げることができる。 Preferred specific examples of the (meth) acrylate oligomer having a polyisoprene skeleton include an esterified product of a maleic anhydride adduct of a polyisoprene polymer and 2-hydroxyethyl methacrylate (UC102 (polystyrene-equivalent molecular weight 17000), Kuraray Co., Ltd.; UC203 (polyisoprene equivalent molecular weight 35,000), Kuraray Co., Ltd .; UC-1 (molecular weight about 25,000), Kuraray Co., Ltd.) and the like can be mentioned.

また、ポリウレタン骨格を持つ(メタ)アクリル系オリゴマーの好ましい具体例としては、脂肪族ウレタンアクリレート(EBECRYL230(分子量5000)、ダイセル・サイテック社;UA−1、ライトケミカル社)等を挙げることができる。 Moreover, as a preferable specific example of the (meth) acrylic oligomer having a polyurethane skeleton, an aliphatic urethane acrylate (EBECRYL230 (molecular weight 5000), Daicel Cytec Co., Ltd .; UA-1, Light Chemical Co., Ltd.) and the like can be mentioned.

ポリブタジエン骨格の(メタ)アクリレート系オリゴマーとしては、公知のものを採用することができる。 As the (meth) acrylate-based oligomer having a polybutadiene skeleton, known ones can be adopted.

成分(ロ)のアクリル系モノマー成分は、画像表示装置の製造工程において、光硬化性樹脂組成物に十分な反応性及び塗布性等を付与するために反応性希釈剤として使用されている。このようなアクリル系モノマーとしては、2−ヒドロキシプロピルメタクリレート、ベンジルアクリレート、ジシクロペンテニルオキシエチルメタクリレート等を挙げることができる。 The acrylic monomer component of the component (b) is used as a reactive diluent in order to impart sufficient reactivity, coatability, etc. to the photocurable resin composition in the manufacturing process of the image display device. Examples of such an acrylic monomer include 2-hydroxypropyl methacrylate, benzyl acrylate, dicyclopentenyloxyethyl methacrylate and the like.

成分(ハ)の光重合開始剤としては、公知の光ラジカル重合開始剤を使用することができ、例えば、1−ヒドロキシ−シクロへキシルフェニルケトン(イルガキュア184、チバ・スペシャリティケミカルズ社)、2−ヒドロキシ−1−{4−[4−(2一ヒドロキシ−2−メチル−プロピロニル)ベンジル]フェニル}−2−メチル−1−プロパン−1−オン(イルガキュア127、チバ・スペシャリティケミカルズ社)、ベンゾフェノン、アセトフェノン等を挙げることができる。 As the photopolymerization initiator of the component (c), a known photoradical polymerization initiator can be used, for example, 1-hydroxy-cyclohexylphenyl ketone (Irgacure 184, Ciba Specialty Chemicals), 2-. Hydroxy-1- {4- [4- (2-1 hydroxy-2-methyl-propironyl) benzyl] phenyl} -2-methyl-1-propane-1-one (Irgacure 127, Ciba Specialty Chemicals), benzophenone, Acetophenone and the like can be mentioned.

このような光重合開始剤は、アクリレート系オリゴマー(イ)及びモノマー(ロ)の合計100質量部に対し、少なすぎると紫外線照射時に硬化不足となり、多すぎると開裂によるアウトガスが増え発泡不具合の傾向があるので、好ましくは0.1〜5質量部、より好ましくは0.2〜3質量部である。 If the amount of such a photopolymerization initiator is too small with respect to a total of 100 parts by mass of the acrylate-based oligomer (a) and the monomer (b), curing will be insufficient when irradiated with ultraviolet rays, and if it is too large, outgas due to cleavage will increase and foaming defects will tend to occur. Therefore, it is preferably 0.1 to 5 parts by mass, and more preferably 0.2 to 3 parts by mass.

また、光硬化性樹脂組成物3は、分子量の調整のために連鎖移動剤を含有することができる。例えば、2−メルカプトエタノール、ラウリルメルカプタン、グリシジルメルカプタン、メルカプト酢酸、チオグリコール酸2−エチルヘキシル、2,3−ジメチルカプト−1−プロパノール、α−メチルスチレンダイマーなどが挙げられる。 Further, the photocurable resin composition 3 can contain a chain transfer agent for adjusting the molecular weight. For example, 2-mercaptoethanol, lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-ethylhexyl thioglycolate, 2,3-dimethylcapto-1-propanol, α-methylstyrene dimer and the like can be mentioned.

また、光硬化性樹脂組成物3は、更に、必要に応じて、可塑剤成分(成分(ニ))、シランカップリング剤等の接着改善剤、酸化防止剤等の一般的な添加剤を含有することができる。 Further, the photocurable resin composition 3 further contains a plasticizer component (component (d)), an adhesion improving agent such as a silane coupling agent, and a general additive such as an antioxidant, if necessary. can do.

成分(ニ)の可塑剤成分は、硬化樹脂層に緩衝性を付与するとともに、光硬化性樹脂組成物の硬化収縮率を低減させるために使用され、紫外線の照射では成分(イ)のアクリレート系オリゴマー成分及び成分(ロ)のアクリレート系モノマー成分と反応しないものである。このような可塑剤成分は、固体の粘着付与剤(1)と液状オイル成分(2)とを含有する。 The plasticizer component of the component (d) is used to impart cushioning properties to the cured resin layer and reduce the curing shrinkage rate of the photocurable resin composition, and is an acrylate-based component (a) when irradiated with ultraviolet rays. It does not react with the oligomer component and the acrylate-based monomer component of the component (b). Such a plasticizer component contains a solid tackifier (1) and a liquid oil component (2).

固形の粘着付与剤(1)としては、テルペン樹脂、テルペンフェノール樹脂、水素添加テルペン樹脂等のテルペン系樹脂、天然ロジン、重合ロジン、ロジンエステル、水素添加ロジン等のロジン樹脂、テルペン系水素添加樹脂を挙げることができる。また、前述のアクリレート系モノマーを予め低分子ポリマー化した非反応性のオリゴマーも使用することができ、具体的には、ブチルアクリレートと2−ヘキシルアクリレートおよびアクリル酸の共重合体やシクロヘキシルアクリレートとメタクリル酸の共重合体等を挙げることができる。 Examples of the solid tackifier (1) include terpene resins such as terpene resin, terpene phenol resin, and hydrogenated terpene resin, rosin resins such as natural rosin, polymerized rosin, rosin ester, and hydrogenated rosin, and terpene hydrogenated resin. Can be mentioned. In addition, a non-reactive oligomer obtained by preliminarily converting the above-mentioned acrylate-based monomer into a low-molecular polymer can also be used. Specifically, a copolymer of butyl acrylate and 2-hexyl acrylate and acrylic acid, or cyclohexyl acrylate and methacrylic can be used. Examples thereof include acid copolymers.

液状オイル成分(2)としては、ポリプタジエン系オイル、又はポリイソプレン系オイル等を含有することができる。 As the liquid oil component (2), a polyptadiene-based oil, a polyisoprene-based oil, or the like can be contained.

光硬化性樹脂組成物3は、基本的には可塑剤成分(成分(ニ))を含有することは必須ではないが、本発明の効果を損なわない範囲で含有させても良い。従って、光硬化性樹脂組成物中に成分(イ)のアクリレート系オリゴマー成分と成分(ロ)のアクリル系モノマー成分との合計含有量は好ましくは25〜85質量%であるが、成分(ニ)の可塑剤成分の含有量は0〜65質量%の範囲である。 Basically, the photocurable resin composition 3 does not necessarily contain the plasticizer component (component (d)), but may be contained within a range that does not impair the effects of the present invention. Therefore, the total content of the acrylate-based oligomer component of the component (a) and the acrylic monomer component of the component (b) in the photocurable resin composition is preferably 25 to 85% by mass, but the component (d). The content of the plasticizer component of the above is in the range of 0 to 65% by mass.

<工程(B)(仮硬化工程)>
次に、図1Cに示すように、少なくとも遮光層1上に位置する光硬化性樹脂組成物3に対し紫外線を照射して仮硬化させることにより遮光層1上の仮硬化樹脂層5aの硬化率を高める。ここで、少なくとも遮光層1上に位置する光硬化性樹脂組成物3を液状から著しく流動しない状態に仮硬化させるのは、遮光層1と光透過性カバー部材2の遮光層形成側表面との間の段差をキャンセルするためである。また、塗布領域の外周を硬化させることで塗布形状を維持し、紫外線が照射されにくい遮光層1上の硬化状態を予め高めておくためである。
<Step (B) (temporary curing step)>
Next, as shown in FIG. 1C, the curing rate of the temporarily cured resin layer 5a on the light-shielding layer 1 is obtained by irradiating at least the photocurable resin composition 3 located on the light-shielding layer 1 with ultraviolet rays to temporarily cure the photocurable resin composition 3. To increase. Here, it is the light-shielding layer 1 and the surface of the light-transmitting cover member 2 on the light-shielding layer formation side that temporarily cures at least the photocurable resin composition 3 located on the light-shielding layer 1 so as not to remarkably flow from the liquid state. This is to cancel the step between them. Further, this is to maintain the coating shape by curing the outer periphery of the coating region and to enhance the cured state on the light-shielding layer 1 which is hard to be irradiated with ultraviolet rays in advance.

このような仮硬化は、図1Cに示すように、例えば紫外線を減衰させる減衰板20を紫外線光源と光硬化性樹脂組成物3との間に設置しても良い。減衰板20は、例えば石英製の板状体で形成され、表面に凹凸が形成されている。この構成により、減衰板20を透過する紫外線が、減衰板20内で減衰すると共に、表面の凹凸で乱反射し、さらに減衰する。減衰板20表面の凹凸は、紫外線が乱反射することができる寸法と形状であれば良い。 For such temporary curing, as shown in FIG. 1C, for example, a damping plate 20 for attenuating ultraviolet rays may be installed between the ultraviolet light source and the photocurable resin composition 3. The damping plate 20 is formed of, for example, a quartz plate-like body, and has irregularities on its surface. With this configuration, the ultraviolet rays transmitted through the attenuation plate 20 are attenuated in the attenuation plate 20 and diffusely reflected by the unevenness of the surface, and further attenuated. The unevenness on the surface of the attenuation plate 20 may have dimensions and a shape that allow ultraviolet rays to be diffusely reflected.

また、仮硬化は、例えば光を遮蔽する遮蔽板を紫外線光源と光硬化性樹脂組成物3との間に設置し、パネル周縁部は露出、パネル主面部は遮蔽板によって遮蔽しても良い。また、紫外線の照射時間の一部期間に遮蔽板を設置するようにしても良い。 Further, for temporary curing, for example, a shielding plate that shields light may be installed between the ultraviolet light source and the photocurable resin composition 3, the peripheral portion of the panel may be exposed, and the main surface portion of the panel may be shielded by the shielding plate. Further, the shielding plate may be installed during a part of the irradiation time of ultraviolet rays.

遮光層1上の仮硬化樹脂層5aの硬化率(ゲル分率)は、好ましくは30〜80%、より好ましくは40〜70%となるようなレベルである。これにより、工程(D)の本硬化工程において、パネル主面部である光透過性カバー部材2上の光透過性硬化樹脂層7を完全硬化させる際、遮光層1上の光透過性硬化樹脂層7も完全硬化させることができる。ここで、完全硬化とは、後述するように硬化率が少なくとも90%となるように硬化した状態を意味する。 The curing rate (gel fraction) of the temporarily cured resin layer 5a on the light-shielding layer 1 is preferably at a level of 30 to 80%, more preferably 40 to 70%. As a result, when the light-transmitting cured resin layer 7 on the light-transmitting cover member 2 which is the main surface of the panel is completely cured in the main curing step of the step (D), the light-transmitting cured resin layer on the light-shielding layer 1 is cured. 7 can also be completely cured. Here, the complete curing means a state in which the curing rate is at least 90% as described later.

また、光透過性カバー部材2表面の仮硬化樹脂層5bの硬化率は、好ましくは0〜80%、より好ましくは20〜70%である好ましい。仮硬化樹脂層の硬化率が80%を超えると、界面剥離が生じ易くなり、接着状態が悪くなる傾向にある。 The curing rate of the temporarily cured resin layer 5b on the surface of the light transmissive cover member 2 is preferably 0 to 80%, more preferably 20 to 70%. When the curing rate of the temporarily cured resin layer exceeds 80%, interfacial peeling tends to occur and the adhesive state tends to deteriorate.

また、遮光層1と光透過性カバー部材2との間から樹脂組成物が排除されるのを防ぐため、遮光層1上の仮硬化樹脂層5aの硬化率は、光透過性カバー部材2表面の仮硬化樹脂層5bの硬化率よりも高いことが好ましい。 Further, in order to prevent the resin composition from being excluded from between the light-shielding layer 1 and the light-transmitting cover member 2, the curing rate of the temporarily cured resin layer 5a on the light-shielding layer 1 is set to the surface of the light-transmitting cover member 2. It is preferable that the curing rate is higher than that of the temporarily cured resin layer 5b.

ここで、硬化率(ゲル分率)とは、紫外線照射前の光硬化性樹脂組成物3中の(メタ)アクリロイル基の存在量に対する紫外線照射後の(メタ)アクリロイル基の存在量の割合(消費量割合)と定義される数値であり、この数値が大きい程、硬化が進行していることを示す。 Here, the curing rate (gel fraction) is the ratio of the abundance of (meth) acryloyl groups after ultraviolet irradiation to the abundance of (meth) acryloyl groups in the photocurable resin composition 3 before ultraviolet irradiation (the ratio of the abundance of (meth) acryloyl groups after ultraviolet irradiation. It is a numerical value defined as (consumption ratio), and the larger this numerical value is, the more the curing is progressing.

なお、硬化率(ゲル分率)は、紫外線照射前の樹脂組成物層のFT−IR測定チャートにおけるベースラインからの1640〜1620cm−1の吸収ピーク高さ(X)と、紫外線照射後の樹脂組成物層のFT−IR測定チャートにおけるベースラインからの1640〜1620cm−1の吸収ピーク高さ(Y)とを、以下の数式(1)に代入することにより算出することができる。 The curing rate (gel fraction) is the absorption peak height (X) of 1640 to 1620 cm -1 from the baseline in the FT-IR measurement chart of the resin composition layer before UV irradiation, and the resin after UV irradiation. It can be calculated by substituting the absorption peak height (Y) of 1640 to 1620 cm -1 from the baseline in the FT-IR measurement chart of the composition layer into the following formula (1).

Figure 0006975834
Figure 0006975834

紫外線の照射に関し、遮光層1上の仮硬化樹脂層の硬化率(ゲル分率)が、好ましくは30〜80%、より好ましくは40〜70%となるように仮硬化させることができる限り、光源の種類、出力、累積光量などは特に制限はなく、公知の紫外線照射による(メタ)アクリレートの光ラジカル重合プロセス条件を採用することができる。 With respect to irradiation with ultraviolet rays, as long as the temporary curing resin layer on the light-shielding layer 1 can be temporarily cured so that the curing rate (gel fraction) is preferably 30 to 80%, more preferably 40 to 70%. The type, output, cumulative amount of light, etc. of the light source are not particularly limited, and known photoradical polymerization process conditions of (meth) acrylate by ultraviolet irradiation can be adopted.

また、紫外線照射条件に関し、上述の硬化率の範囲内において、図1Dに示すように、仮硬化樹脂層を天地逆転させても液だれや変形が生じないような条件の一つとして、粘度が20Pa・S以上(コーンプレートレオメーター、25℃、コーン及びプレートC35/2、回転数10rpm)であることが好ましい。なお、仮硬化樹脂層を天地を逆転させない場合は、粘度が20Pa・S未満であっても構わない。 Further, regarding the ultraviolet irradiation condition, as shown in FIG. 1D, the viscosity is one of the conditions under which no dripping or deformation occurs even if the temporarily cured resin layer is turned upside down within the range of the above-mentioned curing rate. It is preferably 20 Pa · S or more (cone plate rheometer, 25 ° C., cone and plate C35 / 2, rotation speed 10 rpm). If the temporarily cured resin layer is not turned upside down, the viscosity may be less than 20 Pa · S.

また、紫外線照射条件に関し、上述の硬化率の範囲内において、後述する工程(C)の貼り合わせ操作の際、仮硬化樹脂層5の表面のべとつき(タック性)を維持できるような条件を選択することが好ましい。そのようなべとつきを維持できるような条件をタッキング試験機(TAC−1000、レスカ社)を用いるプローブタック法(レスカ法:試料の粘着面を上にして置き、その上部からプローブを粘着面に押し付け、引き剥がす方法)により得られる測定数値で表現すると、30N/cm以上である(http://www.rhesca.co.jp/main/technical/technical.htmlの「粘着物質の物性測定法」参照)。 Further, regarding the ultraviolet irradiation conditions, a condition is selected so that the stickiness (tackiness) of the surface of the temporarily cured resin layer 5 can be maintained during the bonding operation in the step (C) described later within the range of the above-mentioned curing rate. It is preferable to do so. The probe tacking method using a tacking tester (TAC-1000, Resca) under the conditions that can maintain such stickiness (Resca method: Place the sample with the adhesive side facing up and press the probe against the adhesive surface from above. Expressed as a measured value obtained by peeling off), it is 30 N / cm 2 or more (http://www.rhesca.co.jp/main/technical/technical.html "Method for measuring physical properties of adhesive substances". reference).

<工程(C)(貼り合わせ工程)>
次に、図1Eに示すように、画像表示部材6に、光透過性カバー部材2をその仮硬化樹脂層5側から貼り合わせる。貼り合わせは、公知の圧着装置を用いて、10℃〜80℃で加圧することにより行うことができる。
<Process (C) (bonding process)>
Next, as shown in FIG. 1E, the light transmissive cover member 2 is attached to the image display member 6 from the temporarily cured resin layer 5 side. The bonding can be performed by pressurizing at 10 ° C to 80 ° C using a known crimping device.

<工程(D)(本硬化工程)>
次に、図1Fに示すように、画像表示部材6と光透過性カバー部材2との間に挟持されている仮硬化樹脂層5に対し紫外線を照射して本硬化させる。さらに必要に応じて,光透過性カバー部材2の遮光層と画像表示部材6との間の樹脂層に紫外線を照射することにより、該樹脂層を本硬化させる。これにより、画像表示部材6と光透過性カバー部材2とを光透過性硬化樹脂層7を介して積層して画像表示装置10(図1G)を得る。
<Step (D) (main curing step)>
Next, as shown in FIG. 1F, the temporarily cured resin layer 5 sandwiched between the image display member 6 and the light transmissive cover member 2 is irradiated with ultraviolet rays to be finally cured. Further, if necessary, the resin layer between the light-shielding layer of the light-transmitting cover member 2 and the image display member 6 is irradiated with ultraviolet rays to cure the resin layer. As a result, the image display member 6 and the light transmissive cover member 2 are laminated via the light transmissive cured resin layer 7 to obtain an image display device 10 (FIG. 1G).

画像表示部材6としては、液晶表示パネル、有機EL表示パネル、プラズマ表示パネル、タッチパネル等を挙げることができる。ここで、タッチパネルとは、液晶表示パネルのような表示素子とタッチパッドのような位置入力装置を組み合わせた画像表示・入力パネルを意味する。 Examples of the image display member 6 include a liquid crystal display panel, an organic EL display panel, a plasma display panel, a touch panel, and the like. Here, the touch panel means an image display / input panel in which a display element such as a liquid crystal display panel and a position input device such as a touch pad are combined.

また、本工程において本硬化させるのは、仮硬化樹脂層5を十分に硬化させて、画像表示部材6と光透過性カバー部材2とを接着し積層するためである。このような本硬化のレベルは、遮光層1上及び光透過性カバー部材2上の両者の光透過性硬化樹脂層7の硬化率(ゲル分率)が好ましくは90%以上、より好ましくは95%以上となるようなレベルである。 Further, the main curing in this step is to sufficiently cure the temporarily cured resin layer 5 so that the image display member 6 and the light transmissive cover member 2 are adhered and laminated. At such a level of main curing, the curing rate (gel fraction) of the light-transmitting cured resin layer 7 on both the light-shielding layer 1 and the light-transmitting cover member 2 is preferably 90% or more, more preferably 95. It is a level that becomes% or more.

なお、光透過性硬化樹脂層7の光透過性のレベルは、画像表示部材6に形成された画像が視認可能となるような光透過性であればよい。 The level of light transmission of the light-transmitting cured resin layer 7 may be such that the image formed on the image display member 6 can be visually recognized.

以上、図1A〜図1Gでは、光透過性カバー部材の遮光層側形成表面に光硬化性樹脂組成物を塗布した例を説明したが、以下の図2A〜図2Fでは、画像表示部材表面に光硬化性樹脂組成物を塗布した例を説明する。なお、図1A〜図1Gと図2A〜図2Fとにおいて同じ図番は同一の構成要素を表している。 As described above, in FIGS. 1A to 1G, an example in which the photocurable resin composition is applied to the surface formed on the light-shielding layer side of the light-transmitting cover member has been described, but in FIGS. 2A to 2F below, the surface of the image display member is covered. An example in which the photocurable resin composition is applied will be described. It should be noted that the same figure numbers in FIGS. 1A to 1G and FIGS. 2A to 2F represent the same components.

<工程(AA)(塗布工程)>
まず、図2Aに示すように、画像表示部材6の表面に光硬化性樹脂組成物3を平坦になるように塗布する。この場合の塗布厚は、遮光層と光透過性カバー部材の遮光層形成側表面とで形成される段差がキャンセルされるように、遮光層の厚さの好ましくは1.2〜12.5倍、より好ましくは2.5〜4倍の厚さで塗布する。
<Process (AA) (Coating process)>
First, as shown in FIG. 2A, the photocurable resin composition 3 is applied to the surface of the image display member 6 so as to be flat. In this case, the coating thickness is preferably 1.2 to 12.5 times the thickness of the light-shielding layer so that the step formed between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side is cancelled. , More preferably 2.5-4 times thicker.

なお、この光硬化性樹脂組成物3の塗布は、必要な厚みが得られるように複数回行ってもよい。 The photocurable resin composition 3 may be applied a plurality of times so as to obtain a required thickness.

<工程(BB)(仮硬化工程)>
次に、図2Bに示すように、少なくとも遮光層1上に位置する光硬化性樹脂組成物3に対し紫外線を照射して仮硬化させる(図2C)。ここで、少なくとも遮光層1上に位置する画像表示部材6上の光硬化性樹脂組成物3を液状から著しく流動しない状態に仮硬化させるのは、遮光層1と光透過性カバー部材2の遮光層形成側表面との間の段差をキャンセルするためである。また、塗布領域の外周を硬化させることで塗布形状を維持し、紫外線が照射されにくい遮光層1上の硬化状態を予め高めておくためである。
<Process (BB) (temporary curing process)>
Next, as shown in FIG. 2B, at least the photocurable resin composition 3 located on the light-shielding layer 1 is irradiated with ultraviolet rays to be temporarily cured (FIG. 2C). Here, it is the light shielding of the light shielding layer 1 and the light transmitting cover member 2 that temporarily cures the photocurable resin composition 3 on the image display member 6 located at least on the light shielding layer 1 so as not to remarkably flow from the liquid state. This is to cancel the step between the layer-forming side surface and the surface. Further, this is to maintain the coating shape by curing the outer periphery of the coating region and to enhance the cured state on the light-shielding layer 1 which is hard to be irradiated with ultraviolet rays in advance.

このような仮硬化は、図2Bに示すように、例えば紫外線を減衰させる減衰板2を紫外線光源と光硬化性樹脂組成物3との間に設置することにより得ることができる。また、例えば光を遮蔽する遮蔽板を紫外線光源と光硬化性樹脂組成物3との間に設置し、パネル周縁部は露出、パネル主面部は遮蔽板によって遮蔽しても良い。また、紫外線の照射時間の一部期間に遮蔽板を設置するようにしても良い。 As shown in FIG. 2B, such temporary curing can be obtained, for example, by installing a damping plate 2 for attenuating ultraviolet rays between the ultraviolet light source and the photocurable resin composition 3. Further, for example, a shielding plate that shields light may be installed between the ultraviolet light source and the photocurable resin composition 3, the peripheral portion of the panel may be exposed, and the main surface portion of the panel may be shielded by the shielding plate. Further, the shielding plate may be installed during a part of the irradiation time of ultraviolet rays.

遮光層1に対向する仮硬化樹脂層5aの硬化率(ゲル分率)は、好ましくは30〜80%、より好ましくは40〜70%となるようなレベルである。これにより、工程(D)の本硬化工程において、パネル主面部である光透過性カバー部材2上の光透過性硬化樹脂層7を完全硬化させる際、遮光層1上の光透過性硬化樹脂層7も完全硬化させることができる。 The curing rate (gel fraction) of the temporarily cured resin layer 5a facing the light-shielding layer 1 is preferably at a level of 30 to 80%, more preferably 40 to 70%. As a result, when the light-transmitting cured resin layer 7 on the light-transmitting cover member 2 which is the main surface of the panel is completely cured in the main curing step of the step (D), the light-transmitting cured resin layer on the light-shielding layer 1 is cured. 7 can also be completely cured.

また、光透過性カバー部材2表面に対向する仮硬化樹脂層5bの硬化率は、好ましくは0〜80%、より好ましくは20〜70%である好ましい。仮硬化樹脂層の硬化率が80%を超えると、界面剥離が生じ易くなり、接着状態が悪くなる傾向にある。 The curing rate of the temporarily cured resin layer 5b facing the surface of the light transmissive cover member 2 is preferably 0 to 80%, more preferably 20 to 70%. When the curing rate of the temporarily cured resin layer exceeds 80%, interfacial peeling tends to occur and the adhesive state tends to deteriorate.

また、遮光層1と光透過性カバー部材2との間から樹脂組成物が排除されるのを防ぐため、遮光層1上の仮硬化樹脂層5aの硬化率は、光透過性カバー部材2表面の仮硬化樹脂層5bの硬化率よりも高いことが好ましい。 Further, in order to prevent the resin composition from being excluded from between the light-shielding layer 1 and the light-transmitting cover member 2, the curing rate of the temporarily cured resin layer 5a on the light-shielding layer 1 is set to the surface of the light-transmitting cover member 2. It is preferable that the curing rate is higher than that of the temporarily cured resin layer 5b.

<工程(CC)(貼り合わせ工程)>
次に、図2Dに示すように、画像表示部材6の仮硬化樹脂層5に、光透過性カバー部材2をその遮光層1側から貼り合わせる。貼り合わせは、公知の圧着装置を用いて、10〜80℃で加圧することにより行うことができる。
<Process (CC) (bonding process)>
Next, as shown in FIG. 2D, the light transmissive cover member 2 is attached to the temporarily cured resin layer 5 of the image display member 6 from the light-shielding layer 1 side. The bonding can be performed by pressurizing at 10 to 80 ° C. using a known crimping device.

<工程(DD)(本硬化工程)>
次に、図2Eに示すように、画像表示部材6と光透過性カバー部材2との間に挟持されている仮硬化樹脂層5に対し紫外線を照射して本硬化させる。さらに必要に応じて,光透過性カバー部材2の遮光層と画像表示部材6との間の樹脂層に紫外線を照射することにより,該樹脂層を本硬化させる。これにより、画像表示部材6と光透過性カバー部材2とを光透過性硬化樹脂層7を介して積層して画像表示装置10(図2F)を得る。
<Process (DD) (main curing process)>
Next, as shown in FIG. 2E, the temporarily cured resin layer 5 sandwiched between the image display member 6 and the light transmissive cover member 2 is irradiated with ultraviolet rays to be fully cured. Further, if necessary, the resin layer between the light-shielding layer of the light-transmitting cover member 2 and the image display member 6 is irradiated with ultraviolet rays to cure the resin layer. As a result, the image display member 6 and the light transmissive cover member 2 are laminated via the light transmissive cured resin layer 7 to obtain an image display device 10 (FIG. 2F).

画像表示部材6としては、液晶表示パネル、有機EL表示パネル、プラズマ表示パネル、タッチパネル等を挙げることができる。 Examples of the image display member 6 include a liquid crystal display panel, an organic EL display panel, a plasma display panel, a touch panel, and the like.

また、本工程において本硬化のレベルは、遮光層1上及び光透過性カバー部材2上の両者の光透過性硬化樹脂層7の硬化率(ゲル分率)が好ましくは90%以上、より好ましくは95%以上となるようなレベルである。 Further, in this step, the curing rate (gel fraction) of the light-transmitting cured resin layer 7 on both the light-shielding layer 1 and the light-transmitting cover member 2 is preferably 90% or more, more preferably 90% or more. Is a level that is 95% or more.

なお、光透過性硬化樹脂層7の光透過性のレベルは、画像表示部材6に形成された画像が視認可能となるような光透過性であればよい。 The level of light transmission of the light-transmitting cured resin layer 7 may be such that the image formed on the image display member 6 can be visually recognized.

以上のように、本実施の形態の画像表示装置の製造方法によれば、光透過性硬化樹脂を遮光部が設けられた保護パネルに塗布した後、遮光部側から紫外光を照射し仮硬化させる際に、保護パネル周縁部を露出、パネル主面部を減衰部材や遮蔽部材によって紫外線の入射を制限することで、遮光部上の光透過性硬化樹脂の硬化反応率を高めることができる。
その後、遮蔽部材を取り除いて、画像表示部材を貼り合わせ、保護パネル側から紫外光を照射することにより、保護パネルの周縁部の光透過性硬化樹脂の硬化率を、保護パネルの主面部上の硬化率と同等に高くすることができる。
As described above, according to the manufacturing method of the image display device of the present embodiment, after the light-transmitting curing resin is applied to the protective panel provided with the light-shielding portion, it is temporarily cured by irradiating ultraviolet light from the light-shielding portion side. By exposing the peripheral edge of the protective panel and limiting the incident of ultraviolet rays by a damping member or a shielding member on the main surface of the panel, the curing reaction rate of the light-transmitting curing resin on the light-shielding portion can be increased.
After that, by removing the shielding member, pasting the image display member, and irradiating ultraviolet light from the protective panel side, the curing rate of the light transmissive curing resin at the peripheral portion of the protective panel can be measured on the main surface portion of the protective panel. It can be as high as the curing rate.

以下、本発明を実施例により具体的に説明する。 Hereinafter, the present invention will be specifically described with reference to Examples.

<実験例1>
実施例1
(工程(A)(塗布工程))
まず、45(w)×80(l)×0.4(t)mmのサイズのガラス板を用意し、このガラス板の周縁部全域に、乾燥厚で40μmとなるように4mm幅の遮光層を、熱硬化タイプの黒色インク(MRXインキ、帝国インキ製造社)を用いて、スクリーン印刷法により塗布し、乾燥させることにより、遮光層付きガラス板を用意した。
<Experimental Example 1>
Example 1
(Step (A) (Coating step))
First, a glass plate having a size of 45 (w) × 80 (l) × 0.4 (t) mm is prepared, and a light-shielding layer having a width of 4 mm is provided over the entire peripheral edge of the glass plate so that the dry thickness is 40 μm. Was applied by a screen printing method using a heat-curable black ink (MRX ink, Teikoku Printing Inks) and dried to prepare a glass plate with a light-shielding layer.

また、ポリイソプレンの骨格を持つアクリル系オリゴマー(UC203、(株)クラレ)40質量部、ジシクロペンテニルオキシエチルメタクリレート(FA512M、日立化成工業(株))20質量部、ヒドロキシプロピルメタクリレート(HPMA、日本化成(株))3質量部、テトラヒドロフルフリルアクリレート(ライトエステルTHF、共栄社化学(株))15質量部、ラウリルアクリレート(ライトエステルL、共栄社化学社製)、ポリブタジエン重合体(Polyoil110、デグサ(株))20質量部、水添テルペン樹脂(P85、ヤスハラケミカル(株))45質量部、光重合開始剤(Irg184D、BASF(株))4質量部を均一に配合して光硬化性樹脂組成物を調整した。この光硬化性樹脂組成物は、硬化率0%から90%までの間で、3.4%の全硬化収縮率を示すものであった。また、この光硬化性樹脂組成物の粘度(コーンプレートレオメーター、25℃、コーン及びプレートC35/2、回転数10rpm)は、約6000mPa・sであった。 In addition, 40 parts by mass of an acrylic oligomer (UC203, Claret Co., Ltd.) having a polyisoprene skeleton, 20 parts by mass of dicyclopentenyloxyethyl methacrylate (FA512M, Hitachi Kasei Kogyo Co., Ltd.), hydroxypropyl methacrylate (HPMA, Japan). Kasei Co., Ltd. 3 parts by mass, tetrahydrofurfuryl acrylate (light ester THF, Kyoeisha Chemical Co., Ltd.) 15 parts by mass, lauryl acrylate (light ester L, manufactured by Kyoeisha Chemical Co., Ltd.), polybutadiene polymer (Polyoil110, Degusa Co., Ltd.) )) 20 parts by mass, hydrogenated terpene resin (P85, Yasuhara Chemical Co., Ltd.) 45 parts by mass, and photopolymerization initiator (Irg184D, BASF Co., Ltd.) 4 parts by mass are uniformly blended to prepare a photocurable resin composition. It was adjusted. This photocurable resin composition exhibited a total curing shrinkage rate of 3.4% between 0% and 90%. The viscosity of this photocurable resin composition (cone plate rheometer, 25 ° C., cone and plate C35 / 2, rotation speed 10 rpm) was about 6000 mPa · s.

次に、この光硬化性樹脂組成物を、樹脂用ディスペンサーを用いて遮光層付きガラス板の遮光層形成面の全面に吐出し、平均200μmの光硬化性樹脂組成物膜を形成した。この光硬化性樹脂組成物膜は、図1(B)のように遮光層のほぼ全域に跨るように形成されており、40μm厚の遮光層よりも160μmほど厚く形成されていた。 Next, this photocurable resin composition was discharged onto the entire surface of the light-shielding layer-forming surface of the glass plate with a light-shielding layer using a resin dispenser to form a photo-curable resin composition film having an average of 200 μm. As shown in FIG. 1 (B), the photocurable resin composition film was formed so as to extend over almost the entire area of the light-shielding layer, and was formed to be about 160 μm thicker than the light-shielding layer having a thickness of 40 μm.

(工程(B)(仮硬化工程))
次に、遮蔽板を紫外線光源と光硬化性樹脂組成物との間に設置し、紫外線照射装置(LC−8、浜松ホトニクス製)を使って、光硬化性樹脂組成物膜を仮硬化させ、仮硬化樹脂層を形成した。FT−IR測定チャートにおけるベースラインからの1640〜1620cm−1の吸収ピーク高さを指標として求めた、紫外線照射後の光硬化性樹脂組成物膜、即ち、仮硬化樹脂層の硬化率は、遮光層上で約30%、光透過性カバー部材表面上で約0%であった。
(Step (B) (Temporary curing step))
Next, a shielding plate is installed between the ultraviolet light source and the photocurable resin composition, and the photocurable resin composition film is temporarily cured using an ultraviolet irradiation device (LC-8, manufactured by Hamamatsu Photonics). A temporarily cured resin layer was formed. The curing rate of the photocurable resin composition film after ultraviolet irradiation, that is, the temporary curing resin layer, which was obtained by using the absorption peak height of 1640 to 1620 cm -1 from the baseline in the FT-IR measurement chart as an index, is light-shielded. It was about 30% on the layer and about 0% on the surface of the light transmissive cover member.

(工程(C)(貼り合わせ工程))
次に、40(W)×70(L)mmのサイズの液晶表示素子の偏光板が積層された面に、工程(B)で得たガラス板をその仮硬化樹脂層側が偏光板側となるように載置し、ガラス板側からゴムローラで加圧して、ガラス板を貼り付けた。貼り付けられた状態でガラス板側から液晶表示素子を目視観察した場合、遮光層の周囲に気泡は確認されなかった。
(Process (C) (bonding process))
Next, the glass plate obtained in the step (B) is placed on the surface on which the polarizing plates of the liquid crystal display element having a size of 40 (W) × 70 (L) mm are laminated, and the temporarily cured resin layer side thereof is the polarizing plate side. The glass plate was attached by applying pressure from the glass plate side with a rubber roller. When the liquid crystal display element was visually observed from the glass plate side in the attached state, no bubbles were confirmed around the light-shielding layer.

(工程(D)(本硬化工程))
次に、この液晶表示素子に対し、ガラス板側から、紫外線照射装置(LC−8、浜松ホトニクス製)を使って紫外線(50mW/cm)を照射することにより、光透過性カバー部材上の光透過性硬化樹脂層の硬化率を95%以上に硬化させ、光透過性硬化樹脂層を形成した。遮光層上の光透過性硬化樹脂層の硬化率は約90%であった。これにより、液晶表示素子に、光透過性カバー部材としてのガラス板が光透過性硬化樹脂層を介して積層された液晶表示装置が得られた。
(Step (D) (Main curing step))
Next, the liquid crystal display element is irradiated with ultraviolet rays (50 mW / cm 2 ) from the glass plate side using an ultraviolet irradiation device (LC-8, manufactured by Hamamatsu Photonics) on the light transmissive cover member. The curing rate of the light-transmitting cured resin layer was cured to 95% or more to form a light-transmitting cured resin layer. The curing rate of the light-transmitting cured resin layer on the light-shielding layer was about 90%. As a result, a liquid crystal display device in which a glass plate as a light transmissive cover member is laminated on the liquid crystal display element via a light transmissive cured resin layer is obtained.

<評価>
実施例1の各工程における遮光層と画像表示部材との間からの光硬化性樹脂組成物の排除の有無を以下に説明するように目視観察した。また、液晶表示装置の接着状態の評価を以下に説明するように行った。
<Evaluation>
Whether or not the photocurable resin composition was removed from between the light-shielding layer and the image display member in each step of Example 1 was visually observed as described below. In addition, the evaluation of the adhesive state of the liquid crystal display device was performed as described below.

(遮光層と画像表示部材との間からの光硬化性樹脂組成物の排除)
実施例1の各工程の結果物における遮光層と画像表示部材との間からの光硬化性樹脂組成物の排除の有無を、目視観察した。その結果、いずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。
(Elimination of the photocurable resin composition between the light-shielding layer and the image display member)
The presence or absence of removal of the photocurable resin composition from between the light-shielding layer and the image display member in the result of each step of Example 1 was visually observed. As a result, no exclusion of the photocurable resin composition was observed in the product of any of the steps and in the final liquid crystal display device.

(接着状態の評価)
液晶表示装置を作成する際に、図3に示すように、液晶表示素子に代えて40(W)×70(L)mmのサイズのガラスベース30を使用し、そのガラスベース30に対し、仮硬化樹脂層が形成されたガラス板31を、仮硬化樹脂層側から十文字に貼り合わせることによりガラス接合体を得た。そして、その下側に位置するガラスベース30を固定し、上側に位置するガラス板31を直上方向に引き剥がし、その剥離性状を目視観察し、以下の基準で接着状態を評価したところ、“A”評価であった。
ランク 基準
A: 凝集破壊が生じた場合
B: 凝集破壊と界面剥離とが混在している場合
C: 界面剥離が生じた場合
(Evaluation of adhesive condition)
When creating a liquid crystal display device, as shown in FIG. 3, a glass base 30 having a size of 40 (W) × 70 (L) mm is used instead of the liquid crystal display element, and the glass base 30 is tentatively used. A glass bonded body was obtained by laminating the glass plate 31 on which the cured resin layer was formed in a cross shape from the temporarily cured resin layer side. Then, the glass base 30 located on the lower side thereof was fixed, the glass plate 31 located on the upper side was peeled off in the direct upward direction, the peeling property was visually observed, and the adhesive state was evaluated according to the following criteria. "It was an evaluation.
Rank Criteria A: When coagulation fracture occurs B: When coagulation fracture and interfacial delamination coexist C: When interfacial delamination occurs

実施例2
実施例1の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約50%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“A”評価であった。
Example 2
In the step (B) (temporary curing step) of Example 1, the liquid crystal display device is the same as in Example 1 except that the temporary curing resin layer on the light-shielding layer is irradiated with ultraviolet rays so that the curing rate is about 50%. And a glass joint for measuring the adhesive strength was prepared. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "A".

実施例3
実施例1の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約70%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“A”評価であった。
Example 3
In the step (B) (temporary curing step) of Example 1, the liquid crystal display device is the same as in Example 1 except that the temporary curing resin layer on the light-shielding layer is irradiated with ultraviolet rays so that the curing rate is about 70%. And a glass joint for measuring the adhesive strength was prepared. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "A".

実施例4
実施例1の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約80%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“B”評価であった。
Example 4
In the step (B) (temporary curing step) of Example 1, the liquid crystal display device is the same as that of Example 1 except that the temporary curing resin layer on the light-shielding layer is irradiated with ultraviolet rays so that the curing rate is about 80%. And a glass joint for measuring the adhesive strength was prepared. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "B".

比較例1
実施例1の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約90%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。但し、接着状態は“C”評価であった。
Comparative Example 1
In the step (B) (temporary curing step) of Example 1, the liquid crystal display device is the same as in Example 1 except that the temporary curing resin layer on the light-shielding layer is irradiated with ultraviolet rays so that the curing rate is about 90%. And a glass joint for measuring the adhesive strength was prepared. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. However, the adhesive state was evaluated as "C".

比較例2
実施例1の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約10%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約80%であり、本硬化工程(工程(D))において光硬化性樹脂組成物の排除が観察された。また、接着状態は“A”評価であった。
Comparative Example 2
In the step (B) (temporary curing step) of Example 1, the liquid crystal display device is the same as that of Example 1 except that the temporary curing resin layer on the light-shielding layer is irradiated with ultraviolet rays so that the curing rate is about 10%. And a glass joint for measuring the adhesive strength was prepared. As a result, the curing rate of the light-transmitting cured resin layer on the light-shielding layer was about 80%, and the elimination of the photo-curable resin composition was observed in the main curing step (step (D)). Moreover, the adhesive state was evaluated as "A".

Figure 0006975834
Figure 0006975834

表1の比較例1に示すように、工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率を約90%とした場合、遮光層上の硬化樹脂層において界面剥離が生じてしまい、接着状態は“C”評価であった。 As shown in Comparative Example 1 of Table 1, when the curing rate of the temporarily cured resin layer on the light-shielding layer is about 90% in the step (B) (temporary curing step), the interface in the cured resin layer on the light-shielding layer Peeling occurred, and the adhesive state was evaluated as "C".

比較例2に示すように、工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率を約10%とした場合、工程(D)(本硬化工程)において、遮光層上及び光透過性カバー部材上の全面で、硬化率90%以上の完全硬化を得ることができなかった。また、遮光層と画像表示部材との間からの光硬化性樹脂組成物の排除が確認された。 As shown in Comparative Example 2, when the curing rate of the temporarily cured resin layer on the light-shielding layer is about 10% in the step (B) (temporary curing step), the light-shielding is performed in the step (D) (main curing step). It was not possible to obtain complete curing with a curing rate of 90% or more on the entire surface of the layer and the light transmissive cover member. Further, it was confirmed that the photocurable resin composition was excluded from between the light-shielding layer and the image display member.

一方、実施例1〜4に示すように、工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率を30〜80%とすることで、工程(D)(本硬化工程)において、遮光層上及び光透過性カバー部材上の全面で、硬化率90%以上の完全硬化を得ることができた。また、遮光層と画像表示部材との間からの光硬化性樹脂組成物の排除も確認されなかった。また、接着状態も実施例4を除き、全て“A”評価であった。 On the other hand, as shown in Examples 1 to 4, in the step (B) (temporary curing step), the curing rate of the temporarily cured resin layer on the light-shielding layer is set to 30 to 80%, so that the step (D) (the present). In the curing step), complete curing with a curing rate of 90% or more could be obtained on the entire surface of the light-shielding layer and the light-transmitting cover member. In addition, the exclusion of the photocurable resin composition from between the light-shielding layer and the image display member was not confirmed. In addition, the adhesive state was also evaluated as "A" except for Example 4.

<実験例2>
実施例5
実施例1の工程(B)(仮硬化工程)において、表面に凹凸が形成されている石英製の減衰板を紫外線光源と光硬化性樹脂組成物との間に設置し、紫外線の入射に対し、保護パネル周縁部を露出し、パネル主面部を減衰板によって制限した。そして、遮光層上の仮硬化樹脂層の硬化率が約70%、光透過性カバー部材表面上の仮硬化樹脂層の硬化率が約20%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“A”評価であった。
<Experimental Example 2>
Example 5
In the step (B) (temporary curing step) of Example 1, a quartz attenuation plate having irregularities formed on the surface is installed between the ultraviolet light source and the photocurable resin composition, and the incident of ultraviolet rays is prevented. , The peripheral edge of the protective panel was exposed, and the main surface of the panel was restricted by the damping plate. Examples of Examples except that the temporary curing resin layer on the light-shielding layer was irradiated with ultraviolet rays so that the curing rate was about 70% and the curing rate of the temporary curing resin layer on the surface of the light-transmitting cover member was about 20%. A liquid crystal display device and a glass joint for measuring adhesive strength were prepared in the same manner as in 1. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "A".

実施例6
実施例5の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約70%、光透過性カバー部材表面上の仮硬化樹脂層の硬化率が約40%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“A”評価であった。
Example 6
In the step (B) (temporary curing step) of Example 5, the curing rate of the temporarily cured resin layer on the light-shielding layer is about 70%, and the curing rate of the temporarily cured resin layer on the surface of the light-transmitting cover member is about 40%. A liquid crystal display device and a glass joint for measuring adhesive strength were produced in the same manner as in Example 1 except that the ultraviolet rays were irradiated so as to be. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "A".

実施例7
実施例5の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約70%、光透過性カバー部材表面上の仮硬化樹脂層の硬化率が約60%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“B”評価であった。
Example 7
In the step (B) (temporary curing step) of Example 5, the curing rate of the temporarily cured resin layer on the light-shielding layer is about 70%, and the curing rate of the temporarily cured resin layer on the surface of the light-transmitting cover member is about 60%. A liquid crystal display device and a glass joint for measuring adhesive strength were produced in the same manner as in Example 1 except that the ultraviolet rays were irradiated so as to be. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "B".

実施例8
実施例5の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約70%、光透過性カバー部材表面上の仮硬化樹脂層の硬化率が約80%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“B”評価であった。
Example 8
In the step (B) (temporary curing step) of Example 5, the curing rate of the temporarily cured resin layer on the light-shielding layer is about 70%, and the curing rate of the temporarily cured resin layer on the surface of the light-transmitting cover member is about 80%. A liquid crystal display device and a glass joint for measuring adhesive strength were produced in the same manner as in Example 1 except that the ultraviolet rays were irradiated so as to be. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "B".

比較例3
実施例5の工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率が約70%、光透過性カバー部材表面上の仮硬化樹脂層の硬化率が約90%となるように紫外線を照射した以外は、実施例1と同様に液晶表示装置及び接着強度測定用のガラス接合体を作成した。その結果、遮光層上の光透過性硬化樹脂層の硬化率は約95%であり、各工程のいずれの工程の結果物並びに最終的な液晶表示装置にも光硬化性樹脂組成物の排除は観察されなかった。また、接着状態は“C”評価であった。
Comparative Example 3
In the step (B) (temporary curing step) of Example 5, the curing rate of the temporarily cured resin layer on the light-shielding layer is about 70%, and the curing rate of the temporarily cured resin layer on the surface of the light-transmitting cover member is about 90%. A liquid crystal display device and a glass joint for measuring adhesive strength were produced in the same manner as in Example 1 except that the ultraviolet rays were irradiated so as to be. As a result, the curing rate of the light-transmitting curable resin layer on the light-shielding layer is about 95%, and the photo-curable resin composition is eliminated from the result of any step of each step and the final liquid crystal display device. Not observed. Moreover, the adhesive state was evaluated as "C".

Figure 0006975834
Figure 0006975834

表2の比較例3に示すように、工程(B)(仮硬化工程)において、光透過性カバー部材上の仮硬化樹脂層の硬化率が約90%の場合、光透過性カバー部材上の硬化樹脂層において、界面剥離が生じてしまい、接着状態が“C”であった。 As shown in Comparative Example 3 of Table 2, when the curing rate of the temporarily cured resin layer on the light-transmitting cover member is about 90% in the step (B) (temporary curing step), it is on the light-transmitting cover member. In the cured resin layer, interfacial peeling occurred, and the adhesive state was "C".

一方、実施例5〜8に示すように、工程(B)(仮硬化工程)において、遮光層上の仮硬化樹脂層の硬化率を光透過性カバー部材上の仮硬化樹脂層の硬化率よりも高くすることで、工程(D)(本硬化工程)において、遮光層上及び光透過性カバー部材上の全面で、硬化率90%以上の完全硬化を得ることができた。また、遮光層と画像表示部材との間からの光硬化性樹脂組成物の排除も確認されなかった。また、接着状態も実施例8を除き、全て“A”評価であった。 On the other hand, as shown in Examples 5 to 8, in the step (B) (temporary curing step), the curing rate of the temporarily cured resin layer on the light-shielding layer is based on the curing rate of the temporarily cured resin layer on the light-transmitting cover member. In the step (D) (main curing step), complete curing with a curing rate of 90% or more could be obtained on the entire surface of the light-shielding layer and the light-transmitting cover member. In addition, the exclusion of the photocurable resin composition from between the light-shielding layer and the image display member was not confirmed. In addition, the adhesive state was also evaluated as "A" except for Example 8.

本発明の画像表示装置の製造方法によれば、遮光層と画像表示部材との間の光透過性硬化樹脂層をその間から排除することなく十分に光硬化させ且つ光透過性カバー部材の遮光層形成側表面とで形成される段差をキャンセルできる。従って、本発明の製造方法は、タッチパネルを備えたスマートフォーンやタッチパッド等の情報端末の工業的製造に有用である。 According to the method for manufacturing an image display device of the present invention, the light-transmitting cured resin layer between the light-shielding layer and the image display member is sufficiently photo-cured without being removed from the space, and the light-shielding layer of the light-transmitting cover member is sufficiently light-cured. It is possible to cancel the step formed by the surface on the forming side. Therefore, the manufacturing method of the present invention is useful for industrial manufacturing of information terminals such as smart phones and touch pads equipped with a touch panel.

1 遮光層
2 光透過性カバー部材
2a 光透過性カバー部材の遮光層形成側表面
3、3a、3b 光硬化性樹脂組成物
4 段差
5 仮硬化樹脂層
6 画像表示部材
7 光透過性硬化樹脂層
10 画像表示装置
20 減衰板
30 ガラスベース
31 ガラス板
1 Light-shielding layer 2 Light-transmitting cover member 2a Light-transmitting layer-forming side surface 3, 3a, 3b Photo-curable resin composition 4 Step 5 Temporary curing resin layer 6 Image display member 7 Light-transmitting cured resin layer 10 Image display device 20 Attenuation plate 30 Glass base 31 Glass plate

Claims (5)

画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、液状の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示装置の製造方法において、
以下の工程(A)〜(D):
<工程(A)>
液状の光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面又は画像表示部材の表面に、遮光層と光透過性カバー部材の遮光層形成側表面とで形成される段差がキャンセルされるように、遮光層の厚さより厚く、且つ平坦に塗布する工程;
<工程(B)>
光層上に位置する光硬化性樹脂組成物と、光透過性カバー部材表面に対向する光硬化性樹脂組成物に対し紫外線を照射して仮硬化させ、遮光層上の仮硬化樹脂層の硬化率を30〜80%とし、遮光層上の仮硬化樹脂層の硬化率は光透過性カバー部材表面の硬化率よりも高くする工程;
<工程(C)>
画像表示部材に、遮光層と仮硬化樹脂層とが内側となるように光透過性カバー部材を貼り合わせる工程;
<工程(D)>
画像表示部材と光透過性カバー部材との間に挟持されている仮硬化樹脂層に対し紫外線を照射して本硬化させることにより、画像表示部材と光透過性カバー部材とをその硬化率が90%以上の光透過性硬化樹脂層を介して積層して画像表示装置を得る工程
を有する画像表示装置の製造方法。
The image display member and the light-transmitting cover member having a light-shielding layer formed on the peripheral portion are shielded from light-shielding by the light-transmitting curable resin layer formed from the liquid photo-curable resin composition. In a method of manufacturing an image display device laminated so that a layer forming surface is arranged on the image display member side.
The following steps (A) to (D):
<Process (A)>
The liquid photocurable resin composition has a step formed on the surface of the light-transmitting cover member on the light-shielding layer forming side or the surface of the image display member between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side. as it is canceled, rather thick than the thickness of the light-shielding layer, the step of and flatly applied;
<Process (B)>
A photocurable resin composition which is located shielding light layer, the light-curable resin composition which is opposed to the light transmitting cover member surface to an ultraviolet ray was temporarily curing, the temporarily cured resin layer on the light shielding layer A step of setting the curing rate to 30 to 80% and making the curing rate of the temporarily cured resin layer on the light-shielding layer higher than the curing rate of the surface of the light-transmitting cover member ;
<Process (C)>
A process of attaching a light-transmitting cover member to an image display member so that the light-shielding layer and the temporarily cured resin layer are on the inside;
<Process (D)>
By irradiating the temporarily cured resin layer sandwiched between the image display member and the light transmissive cover member with ultraviolet rays to perform main curing, the curing rate of the image display member and the light transmissive cover member is 90. A method for manufacturing an image display device, which comprises a step of laminating through a light transmissive cured resin layer of% or more to obtain an image display device.
画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、液状の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示装置の製造方法において、The image display member and the light-transmitting cover member having a light-shielding layer formed on the peripheral portion are shielded from light-shielding by the light-transmitting curable resin layer formed from the liquid photo-curable resin composition. In a method of manufacturing an image display device laminated so that a layer forming surface is arranged on the image display member side.
以下の工程(A)〜(D):The following steps (A) to (D):
<工程(A)><Process (A)>
液状の光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面又は画像表示部材の表面に、遮光層と光透過性カバー部材の遮光層形成側表面とで形成される段差がキャンセルされるように、遮光層の厚さより厚く、且つ平坦に塗布する工程;The liquid photocurable resin composition has a step formed on the surface of the light-transmitting cover member on the light-shielding layer forming side or the surface of the image display member between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side. The process of applying thicker and flatter than the thickness of the light-shielding layer so as to be canceled;
<工程(B)><Process (B)>
遮光層上に位置する光硬化性樹脂組成物と、光透過性カバー部材表面に対向する光硬化性樹脂組成物に対し紫外線を照射して仮硬化させ、光透過性カバー部材表面上の仮硬化樹脂層の硬化率を20〜70%とし、遮光層上の仮硬化樹脂層の硬化率は光透過性カバー部材表面の硬化率よりも高くする工程;The photo-curable resin composition located on the light-shielding layer and the photo-curable resin composition facing the surface of the light-transmitting cover member are temporarily cured by irradiating them with ultraviolet rays to temporarily cure them on the surface of the light-transmitting cover member. A step in which the curing rate of the resin layer is 20 to 70%, and the curing rate of the temporarily cured resin layer on the light-shielding layer is higher than the curing rate of the surface of the light-transmitting cover member;
<工程(C)><Process (C)>
画像表示部材に、遮光層と仮硬化樹脂層とが内側となるように光透過性カバー部材を貼り合わせる工程;A process of attaching a light-transmitting cover member to an image display member so that the light-shielding layer and the temporarily cured resin layer are on the inside;
<工程(D)><Process (D)>
画像表示部材と光透過性カバー部材との間に挟持されている仮硬化樹脂層に対し紫外線を照射して本硬化させることにより、画像表示部材と光透過性カバー部材とをその硬化率が90%以上の光透過性硬化樹脂層を介して積層して画像表示装置を得る工程By irradiating the temporarily cured resin layer sandwiched between the image display member and the light transmissive cover member with ultraviolet rays to perform main curing, the curing rate of the image display member and the light transmissive cover member is 90. % Or more, a process of laminating through a light-transmitting cured resin layer to obtain an image display device.
を有する画像表示装置の製造方法。A method of manufacturing an image display device having the above.
画像表示部材と、周縁部に遮光層が形成された光透過性カバー部材とが、液状の光硬化性樹脂組成物から形成された光透過性硬化樹脂層を介し、光透過性カバー部材の遮光層形成面が画像表示部材側に配置されるように積層された画像表示装置の製造方法において、The image display member and the light-transmitting cover member having a light-shielding layer formed on the peripheral portion are shielded from light-shielding by the light-transmitting curable resin layer formed from the liquid photo-curable resin composition. In a method of manufacturing an image display device laminated so that a layer forming surface is arranged on the image display member side.
以下の工程(A)〜(D):The following steps (A) to (D):
<工程(A)><Process (A)>
液状の光硬化性樹脂組成物を、光透過性カバー部材の遮光層形成側表面又は画像表示部材の表面に、遮光層と光透過性カバー部材の遮光層形成側表面とで形成される段差がキャンセルされるように、遮光層の厚さより厚く塗布する工程;The liquid photocurable resin composition has a step formed on the surface of the light-transmitting cover member on the light-shielding layer forming side or the surface of the image display member between the light-shielding layer and the surface of the light-transmitting cover member on the light-shielding layer forming side. The process of applying thicker than the thickness of the light-shielding layer so that it is canceled;
<工程(B)><Process (B)>
遮光層上に位置する光硬化性樹脂組成物と、光透過性カバー部材表面に対向する光硬化性樹脂組成物に対し紫外線を照射して仮硬化させ、遮光層上の仮硬化樹脂層の硬化率を30〜80%とし、光透過性カバー部材表面上の仮硬化樹脂層の硬化率を20〜70%とし、遮光層上の仮硬化樹脂層の硬化率は光透過性カバー部材表面の硬化率よりも高くする工程;The photocurable resin composition located on the light-shielding layer and the photo-curable resin composition facing the surface of the light-transmitting cover member are temporarily cured by irradiating them with ultraviolet rays to cure the temporarily-cured resin layer on the light-shielding layer. The rate is 30 to 80%, the curing rate of the temporarily cured resin layer on the surface of the light-transmitting cover member is 20 to 70%, and the curing rate of the temporarily cured resin layer on the light-shielding layer is the curing of the surface of the light-transmitting cover member. The process of making it higher than the rate;
<工程(C)><Process (C)>
画像表示部材に、遮光層と仮硬化樹脂層とが内側となるように光透過性カバー部材を貼り合わせる工程;A process of attaching a light-transmitting cover member to an image display member so that the light-shielding layer and the temporarily cured resin layer are on the inside;
<工程(D)><Process (D)>
画像表示部材と光透過性カバー部材との間に挟持されている仮硬化樹脂層に対し紫外線を照射して本硬化させることにより、画像表示部材と光透過性カバー部材とをその硬化率が90%以上の光透過性硬化樹脂層を介して積層して画像表示装置を得る工程By irradiating the temporarily cured resin layer sandwiched between the image display member and the light transmissive cover member with ultraviolet rays to perform main curing, the curing rate of the image display member and the light transmissive cover member is 90. % Or more, a process of laminating through a light-transmitting cured resin layer to obtain an image display device.
を有する画像表示装置の製造方法。A method of manufacturing an image display device having the above.
前記工程(B)において、紫外線を遮蔽する遮蔽板又は紫外線を減衰させる減衰板を紫外線光源と光硬化性樹脂組成物との間に設置する請求項1乃至3のいずれか1項に記載の画像表示装置の製造方法。 The image according to any one of claims 1 to 3, wherein in the step (B), a shielding plate that shields ultraviolet rays or an attenuation plate that attenuates ultraviolet rays is installed between the ultraviolet light source and the photocurable resin composition. How to manufacture the display device. 光硬化性樹脂組成物は、アクリレート系オリゴマー成分、アクリル系モノマー成分、可塑剤成分及び光重合開始剤成分を含有し、可塑剤成分が、固形の粘着付与剤と液状オイル成分とを含有する請求項1乃至4のいずれか1項に記載の画像表示装置の製造方法。 The photocurable resin composition contains an acrylate-based oligomer component, an acrylic monomer component, a plasticizer component, and a photopolymerization initiator component, and the plasticizer component contains a solid tackifier and a liquid oil component. Item 6. The method for manufacturing an image display device according to any one of Items 1 to 4.
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