JP5556488B2 - 対向電極接続用接着剤 - Google Patents

対向電極接続用接着剤 Download PDF

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Publication number
JP5556488B2
JP5556488B2 JP2010177267A JP2010177267A JP5556488B2 JP 5556488 B2 JP5556488 B2 JP 5556488B2 JP 2010177267 A JP2010177267 A JP 2010177267A JP 2010177267 A JP2010177267 A JP 2010177267A JP 5556488 B2 JP5556488 B2 JP 5556488B2
Authority
JP
Japan
Prior art keywords
adhesive
meth
counter electrode
connection terminal
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010177267A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010280896A (ja
Inventor
博之 熊倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2010177267A priority Critical patent/JP5556488B2/ja
Publication of JP2010280896A publication Critical patent/JP2010280896A/ja
Priority to KR1020110077959A priority patent/KR101899594B1/ko
Application granted granted Critical
Publication of JP5556488B2 publication Critical patent/JP5556488B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
JP2010177267A 2010-08-06 2010-08-06 対向電極接続用接着剤 Expired - Fee Related JP5556488B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010177267A JP5556488B2 (ja) 2010-08-06 2010-08-06 対向電極接続用接着剤
KR1020110077959A KR101899594B1 (ko) 2010-08-06 2011-08-05 대향 전극 접속용 접착제

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010177267A JP5556488B2 (ja) 2010-08-06 2010-08-06 対向電極接続用接着剤

Publications (2)

Publication Number Publication Date
JP2010280896A JP2010280896A (ja) 2010-12-16
JP5556488B2 true JP5556488B2 (ja) 2014-07-23

Family

ID=43537904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010177267A Expired - Fee Related JP5556488B2 (ja) 2010-08-06 2010-08-06 対向電極接続用接着剤

Country Status (2)

Country Link
JP (1) JP5556488B2 (ko)
KR (1) KR101899594B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5916376B2 (ja) * 2011-09-13 2016-05-11 株式会社タムラ製作所 接着剤組成物およびそれを用いた太陽電池セルと配線基板との接続方法
WO2013042203A1 (ja) * 2011-09-20 2013-03-28 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体及び回路部材の接続方法
JP6123547B2 (ja) * 2013-07-26 2017-05-10 日立化成株式会社 回路接続材料、回路接続構造体、回路接続構造体の製造方法、接着剤組成物、及び接着剤シート
KR102475431B1 (ko) * 2016-10-14 2022-12-08 덴카 주식회사 조성물
JP2018104653A (ja) * 2016-12-28 2018-07-05 日立化成株式会社 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
EP3943563A4 (en) * 2019-03-18 2022-04-20 ThreeBond Co., Ltd. ADHESIVE COMPOSITION, CURED MATERIAL AND COMPOSITE

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
JP3506185B2 (ja) * 1994-02-28 2004-03-15 日立化成工業株式会社 接着剤及び半導体装置
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP4165065B2 (ja) * 2001-12-27 2008-10-15 日立化成工業株式会社 接着剤、接着剤の製造方法及びそれを用いた回路接続構造体の製造方法
JP4534716B2 (ja) * 2004-10-26 2010-09-01 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造体及び接続方法
JP2007224228A (ja) * 2006-02-27 2007-09-06 Hitachi Chem Co Ltd 回路接続材料並びに回路端子の接続構造体及び接続方法
JP2008111092A (ja) 2006-10-06 2008-05-15 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた接続構造体
JP5833809B2 (ja) * 2010-02-01 2015-12-16 デクセリアルズ株式会社 異方性導電フィルム、接合体及び接続方法

Also Published As

Publication number Publication date
KR20120023554A (ko) 2012-03-13
KR101899594B1 (ko) 2018-09-17
JP2010280896A (ja) 2010-12-16

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