JP5540254B2 - コンデンサ保持具 - Google Patents
コンデンサ保持具 Download PDFInfo
- Publication number
- JP5540254B2 JP5540254B2 JP2010188509A JP2010188509A JP5540254B2 JP 5540254 B2 JP5540254 B2 JP 5540254B2 JP 2010188509 A JP2010188509 A JP 2010188509A JP 2010188509 A JP2010188509 A JP 2010188509A JP 5540254 B2 JP5540254 B2 JP 5540254B2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- main body
- holder
- lead
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/12—Vents or other means allowing expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10606—Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188509A JP5540254B2 (ja) | 2010-08-25 | 2010-08-25 | コンデンサ保持具 |
| US13/817,964 US9064634B2 (en) | 2010-08-25 | 2011-08-23 | Capacitor holder |
| CN201180040555.3A CN103098156B (zh) | 2010-08-25 | 2011-08-23 | 电容器保持件 |
| PCT/JP2011/068943 WO2012026454A1 (ja) | 2010-08-25 | 2011-08-23 | コンデンサ保持具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188509A JP5540254B2 (ja) | 2010-08-25 | 2010-08-25 | コンデンサ保持具 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012049253A JP2012049253A (ja) | 2012-03-08 |
| JP2012049253A5 JP2012049253A5 (https=) | 2013-06-20 |
| JP5540254B2 true JP5540254B2 (ja) | 2014-07-02 |
Family
ID=45723448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010188509A Active JP5540254B2 (ja) | 2010-08-25 | 2010-08-25 | コンデンサ保持具 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9064634B2 (https=) |
| JP (1) | JP5540254B2 (https=) |
| CN (1) | CN103098156B (https=) |
| WO (1) | WO2012026454A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6123093B2 (ja) * | 2012-11-12 | 2017-05-10 | 北川工業株式会社 | コンデンサホルダ及びコンデンサ保持構造 |
| JP6142508B2 (ja) * | 2012-11-12 | 2017-06-07 | 北川工業株式会社 | コンデンサホルダ |
| JP2015007391A (ja) * | 2013-06-25 | 2015-01-15 | 株式会社豊田自動織機 | 電動圧縮機 |
| JP5949681B2 (ja) * | 2013-06-25 | 2016-07-13 | 株式会社豊田自動織機 | 電動圧縮機 |
| JP2015216238A (ja) * | 2014-05-11 | 2015-12-03 | 山洋電気株式会社 | 電子部品の実装構造および実装方法 |
| US9585255B2 (en) | 2015-03-11 | 2017-02-28 | Raytheon Company | Component support for dense circuit board |
| CN105208793B (zh) * | 2015-08-18 | 2017-12-19 | 浪潮电子信息产业股份有限公司 | 一种不同类型电容相互替换的焊接装置 |
| DE102015119844B4 (de) * | 2015-11-17 | 2025-01-02 | Tdk Electronics Ag | Elektrolytischer Kondensator mit Sicherheitsentlüftung |
| KR102581272B1 (ko) * | 2017-02-03 | 2023-09-21 | 삼성전자주식회사 | 방폭 장치 |
| EP3720259B1 (en) * | 2019-04-03 | 2023-05-31 | ABB Schweiz AG | Switch module assembly, and method for manufacturing the same |
| JP2022146048A (ja) * | 2021-03-22 | 2022-10-05 | キオクシア株式会社 | 半導体記憶装置および放熱用部品 |
| DE102021208614A1 (de) * | 2021-08-06 | 2023-02-09 | Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg | Kondensatorvorrichtung zur Befestigung an einer Leiterplatte |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3111612A (en) * | 1959-10-29 | 1963-11-19 | Erie Resistor Corp | Capacitor |
| JPS58147232U (ja) * | 1982-03-26 | 1983-10-03 | マルコン電子株式会社 | コンデンサの取付具 |
| JPS60121324A (ja) | 1983-12-01 | 1985-06-28 | Yanmar Diesel Engine Co Ltd | 舶用減速逆転機の油圧回路 |
| US5016139A (en) * | 1989-09-06 | 1991-05-14 | Whelen Technologies, Inc. | Electronic power supply with enhanced heat transfer characteristics |
| JPH0552660A (ja) | 1991-08-28 | 1993-03-02 | Mitsubishi Heavy Ind Ltd | 温度センサ |
| WO1997001263A1 (fr) * | 1995-06-20 | 1997-01-09 | Matsushita Electric Industrial Co., Ltd. | Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication |
| JPH09270358A (ja) | 1996-03-29 | 1997-10-14 | Elna Co Ltd | 電子部品 |
| MY128095A (en) * | 1996-04-03 | 2007-01-31 | Matsushita Electric Industrial Co Ltd | Electronic part and method for manufacturing the same |
| JP2874129B2 (ja) | 1996-08-23 | 1999-03-24 | 文化シヤッター株式会社 | 配線基板カバー構造 |
| DE69724932T2 (de) * | 1996-09-24 | 2004-09-02 | Bc Components Holdings B.V. | Passives bauelement |
| JPH10208984A (ja) | 1997-01-27 | 1998-08-07 | Hitachi Aic Inc | 取付脚つき電子部品 |
| JPH1116009A (ja) | 1997-06-23 | 1999-01-22 | Oki Electric Ind Co Ltd | 搭乗情報記録装置 |
| JP2000277366A (ja) | 1999-03-24 | 2000-10-06 | Japan Aviation Electronics Industry Ltd | 基板実装用電子部品保持金具及び電子部品基板実装構造 |
| JP2004221182A (ja) * | 2003-01-10 | 2004-08-05 | Matsushita Electric Ind Co Ltd | コンデンサ装置およびその製造方法 |
| JP4816416B2 (ja) * | 2006-11-13 | 2011-11-16 | パナソニック株式会社 | 電子部品及びそれを用いた電子制御装置 |
| DE112007000056T5 (de) | 2006-09-29 | 2008-08-07 | Matsushita Electric Industrial Co., Ltd., Kadoma | Elektronisches Bauteil und elektronische Steuervorrichtung, die dieses verwendet |
| US7857668B2 (en) | 2008-04-11 | 2010-12-28 | Avx Corporation | Connector module for ruggedized applications |
| JP2010177348A (ja) | 2009-01-28 | 2010-08-12 | Kitagawa Ind Co Ltd | コンデンサホルダ |
| JP2011187627A (ja) | 2010-03-08 | 2011-09-22 | Kitagawa Ind Co Ltd | 保持具 |
| US8149589B2 (en) * | 2010-08-19 | 2012-04-03 | Lien Chang Electronic Enterprise Co., Ltd. | Capacitor holder |
-
2010
- 2010-08-25 JP JP2010188509A patent/JP5540254B2/ja active Active
-
2011
- 2011-08-23 WO PCT/JP2011/068943 patent/WO2012026454A1/ja not_active Ceased
- 2011-08-23 US US13/817,964 patent/US9064634B2/en active Active
- 2011-08-23 CN CN201180040555.3A patent/CN103098156B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012049253A (ja) | 2012-03-08 |
| WO2012026454A1 (ja) | 2012-03-01 |
| US20130140079A1 (en) | 2013-06-06 |
| CN103098156B (zh) | 2016-03-16 |
| CN103098156A (zh) | 2013-05-08 |
| US9064634B2 (en) | 2015-06-23 |
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