CN103098156B - 电容器保持件 - Google Patents

电容器保持件 Download PDF

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Publication number
CN103098156B
CN103098156B CN201180040555.3A CN201180040555A CN103098156B CN 103098156 B CN103098156 B CN 103098156B CN 201180040555 A CN201180040555 A CN 201180040555A CN 103098156 B CN103098156 B CN 103098156B
Authority
CN
China
Prior art keywords
capacitor
body portion
main body
top end
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180040555.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103098156A (zh
Inventor
中村达哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Publication of CN103098156A publication Critical patent/CN103098156A/zh
Application granted granted Critical
Publication of CN103098156B publication Critical patent/CN103098156B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/08Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/08Housing; Encapsulation
    • H01G9/12Vents or other means allowing expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10462Flat component oriented parallel to the PCB surface
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10583Cylindrically shaped component; Fixing means therefore
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10606Permanent holder for component or auxiliary printed circuits mounted on a printed circuit board [PCB]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10651Component having two leads, e.g. resistor, capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201180040555.3A 2010-08-25 2011-08-23 电容器保持件 Active CN103098156B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-188509 2010-08-25
JP2010188509A JP5540254B2 (ja) 2010-08-25 2010-08-25 コンデンサ保持具
PCT/JP2011/068943 WO2012026454A1 (ja) 2010-08-25 2011-08-23 コンデンサ保持具

Publications (2)

Publication Number Publication Date
CN103098156A CN103098156A (zh) 2013-05-08
CN103098156B true CN103098156B (zh) 2016-03-16

Family

ID=45723448

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180040555.3A Active CN103098156B (zh) 2010-08-25 2011-08-23 电容器保持件

Country Status (4)

Country Link
US (1) US9064634B2 (https=)
JP (1) JP5540254B2 (https=)
CN (1) CN103098156B (https=)
WO (1) WO2012026454A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6123093B2 (ja) * 2012-11-12 2017-05-10 北川工業株式会社 コンデンサホルダ及びコンデンサ保持構造
JP6142508B2 (ja) * 2012-11-12 2017-06-07 北川工業株式会社 コンデンサホルダ
JP2015007391A (ja) * 2013-06-25 2015-01-15 株式会社豊田自動織機 電動圧縮機
JP5949681B2 (ja) * 2013-06-25 2016-07-13 株式会社豊田自動織機 電動圧縮機
JP2015216238A (ja) * 2014-05-11 2015-12-03 山洋電気株式会社 電子部品の実装構造および実装方法
US9585255B2 (en) 2015-03-11 2017-02-28 Raytheon Company Component support for dense circuit board
CN105208793B (zh) * 2015-08-18 2017-12-19 浪潮电子信息产业股份有限公司 一种不同类型电容相互替换的焊接装置
DE102015119844B4 (de) * 2015-11-17 2025-01-02 Tdk Electronics Ag Elektrolytischer Kondensator mit Sicherheitsentlüftung
KR102581272B1 (ko) * 2017-02-03 2023-09-21 삼성전자주식회사 방폭 장치
EP3720259B1 (en) * 2019-04-03 2023-05-31 ABB Schweiz AG Switch module assembly, and method for manufacturing the same
JP2022146048A (ja) * 2021-03-22 2022-10-05 キオクシア株式会社 半導体記憶装置および放熱用部品
DE102021208614A1 (de) * 2021-08-06 2023-02-09 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg Kondensatorvorrichtung zur Befestigung an einer Leiterplatte

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124244A (ja) * 2006-11-13 2008-05-29 Matsushita Electric Ind Co Ltd 電子部品及びそれを用いた電子制御装置
CN101557063A (zh) * 2008-04-11 2009-10-14 阿维科斯公司 用于加固应用的连接器模块
JP2010177348A (ja) * 2009-01-28 2010-08-12 Kitagawa Ind Co Ltd コンデンサホルダ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3111612A (en) * 1959-10-29 1963-11-19 Erie Resistor Corp Capacitor
JPS58147232U (ja) * 1982-03-26 1983-10-03 マルコン電子株式会社 コンデンサの取付具
JPS60121324A (ja) 1983-12-01 1985-06-28 Yanmar Diesel Engine Co Ltd 舶用減速逆転機の油圧回路
US5016139A (en) * 1989-09-06 1991-05-14 Whelen Technologies, Inc. Electronic power supply with enhanced heat transfer characteristics
JPH0552660A (ja) 1991-08-28 1993-03-02 Mitsubishi Heavy Ind Ltd 温度センサ
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
JPH09270358A (ja) 1996-03-29 1997-10-14 Elna Co Ltd 電子部品
MY128095A (en) * 1996-04-03 2007-01-31 Matsushita Electric Industrial Co Ltd Electronic part and method for manufacturing the same
JP2874129B2 (ja) 1996-08-23 1999-03-24 文化シヤッター株式会社 配線基板カバー構造
DE69724932T2 (de) * 1996-09-24 2004-09-02 Bc Components Holdings B.V. Passives bauelement
JPH10208984A (ja) 1997-01-27 1998-08-07 Hitachi Aic Inc 取付脚つき電子部品
JPH1116009A (ja) 1997-06-23 1999-01-22 Oki Electric Ind Co Ltd 搭乗情報記録装置
JP2000277366A (ja) 1999-03-24 2000-10-06 Japan Aviation Electronics Industry Ltd 基板実装用電子部品保持金具及び電子部品基板実装構造
JP2004221182A (ja) * 2003-01-10 2004-08-05 Matsushita Electric Ind Co Ltd コンデンサ装置およびその製造方法
DE112007000056T5 (de) 2006-09-29 2008-08-07 Matsushita Electric Industrial Co., Ltd., Kadoma Elektronisches Bauteil und elektronische Steuervorrichtung, die dieses verwendet
JP2011187627A (ja) 2010-03-08 2011-09-22 Kitagawa Ind Co Ltd 保持具
US8149589B2 (en) * 2010-08-19 2012-04-03 Lien Chang Electronic Enterprise Co., Ltd. Capacitor holder

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124244A (ja) * 2006-11-13 2008-05-29 Matsushita Electric Ind Co Ltd 電子部品及びそれを用いた電子制御装置
CN101557063A (zh) * 2008-04-11 2009-10-14 阿维科斯公司 用于加固应用的连接器模块
JP2010177348A (ja) * 2009-01-28 2010-08-12 Kitagawa Ind Co Ltd コンデンサホルダ

Also Published As

Publication number Publication date
JP2012049253A (ja) 2012-03-08
WO2012026454A1 (ja) 2012-03-01
JP5540254B2 (ja) 2014-07-02
US20130140079A1 (en) 2013-06-06
CN103098156A (zh) 2013-05-08
US9064634B2 (en) 2015-06-23

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