JP5538007B2 - 洗浄用スポンジ体及び洗浄方法 - Google Patents
洗浄用スポンジ体及び洗浄方法 Download PDFInfo
- Publication number
- JP5538007B2 JP5538007B2 JP2010058700A JP2010058700A JP5538007B2 JP 5538007 B2 JP5538007 B2 JP 5538007B2 JP 2010058700 A JP2010058700 A JP 2010058700A JP 2010058700 A JP2010058700 A JP 2010058700A JP 5538007 B2 JP5538007 B2 JP 5538007B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- zeta potential
- sponge body
- anionic
- sponge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims description 138
- 238000000034 method Methods 0.000 title claims description 19
- 125000000129 anionic group Chemical group 0.000 claims description 97
- 125000002091 cationic group Chemical group 0.000 claims description 79
- 239000011148 porous material Substances 0.000 claims description 46
- 125000000524 functional group Chemical group 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 27
- 229920002554 vinyl polymer Polymers 0.000 claims description 27
- 239000011354 acetal resin Substances 0.000 claims description 21
- 229920006324 polyoxymethylene Polymers 0.000 claims description 21
- 238000001179 sorption measurement Methods 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 230000002378 acidificating effect Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- 239000003513 alkali Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 150000001241 acetals Chemical class 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 150000004283 biguanides Chemical group 0.000 claims description 3
- 125000002795 guanidino group Chemical group C(N)(=N)N* 0.000 claims description 3
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000006061 abrasive grain Substances 0.000 description 59
- 229920002451 polyvinyl alcohol Polymers 0.000 description 19
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 19
- 239000004372 Polyvinyl alcohol Substances 0.000 description 18
- 239000007788 liquid Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000006116 polymerization reaction Methods 0.000 description 9
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 238000005201 scrubbing Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 229910020203 CeO Inorganic materials 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 230000000274 adsorptive effect Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011707 mineral Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning Implements For Floors, Carpets, Furniture, Walls, And The Like (AREA)
- Cleaning In General (AREA)
Description
Claims (10)
- 湿潤状態で弾性を有するポリビニルアセタール系樹脂多孔質素材によって構成され、被洗浄面に摺接させて該被洗浄面を洗浄する洗浄用スポンジ体であって、
前記ポリビニルアセタール系樹脂多孔質素材は、ポリビニルアセタール系樹脂がアニオン性官能基を有することによって、pH値が同じ条件下において、ポリビニルアセタール系樹脂がアニオン性官能基を有しない非アニオン性のポリビニルアセタール系樹脂多孔質素材のゼータ電位とは異なるゼータ電位を有する
ことを特徴とする洗浄用スポンジ体。 - 前記アニオン性官能基が、カルボキシル基、スルホ基、チオール基、硫酸エステル基、又は燐酸エステル基の中から選ばれた少なくとも1つである請求項1に記載の洗浄用スポンジ体。
- 前記ポリビニルアセタール系樹脂多孔質素材が、pH7の条件下において−30mV以下(絶対値として30mV以上)であり、且つpH7未満の条件下において前記非アニオン性のポリビニルアセタール系多孔質素材のゼータ電位よりも低いゼータ電位を有する請求項1又は請求項2に記載の洗浄用スポンジ体。
- 湿潤状態で弾性を有するポリビニルアセタール系樹脂多孔質素材によって構成され、被洗浄面に摺接させて該被洗浄面を洗浄する洗浄用スポンジ体であって、
前記ポリビニルアセタール系樹脂多孔質素材は、ポリビニルアセタール系樹脂がカチオン性官能基を有することによって、pH値が同じ条件下において、ポリビニルアセタール系樹脂がカチオン性官能基を有しない非カチオン性のポリビニルアセタール系樹脂多孔質素材のゼータ電位とは異なるゼータ電位を有する
ことを特徴とする洗浄用スポンジ体。 - 前記カチオン性官能基が、アミノ基、イミノ基、グアニジノ基、又はビグアニド基の中から選ばれた少なくとも1つである請求項4に記載の洗浄用スポンジ体。
- 前記ポリビニルアセタール系樹脂多孔質素材が、pH8以下の条件下においてプラスのゼータ電位を有する請求項4又は請求項5に記載の洗浄用スポンジ体。
- 略円筒形状のロール体と該ロール体の外周面上に一体形成された複数の突起とを有するローラ形状であり、前記突起を被洗浄面に回転接触させて該被洗浄面を洗浄する請求項1〜請求項6の何れかに記載の洗浄用スポンジ体。
- 請求項1〜請求項7の何れか一項に記載の洗浄用スポンジ体を使用し、電気的及び化学的な吸着或いは反発を利用してスクラブ洗浄を行う洗浄方法。
- 請求項1〜請求項3の何れか一項に記載の洗浄用スポンジ体を使用し、pH7未満の環境下(酸性サイドの条件下)にてスクラブ洗浄を行う洗浄方法。
- 請求項4〜請求項6の何れか一項に記載の洗浄用スポンジ体を使用し、pH8以下の環境下(弱アルカリから酸性サイドの条件下)にてスクラブ洗浄を行う洗浄方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010058700A JP5538007B2 (ja) | 2009-08-20 | 2010-03-16 | 洗浄用スポンジ体及び洗浄方法 |
PCT/JP2010/063718 WO2011021572A1 (ja) | 2009-08-20 | 2010-08-12 | 洗浄用スポンジ体及び洗浄方法 |
KR1020127003600A KR101628900B1 (ko) | 2009-08-20 | 2010-08-12 | 세정용 스폰지체 및 세정방법 |
TW099127777A TWI520793B (zh) | 2009-08-20 | 2010-08-19 | 清洗用海綿體以及清洗方法 |
US15/000,434 US20160193631A1 (en) | 2009-08-20 | 2016-01-19 | Cleaning sponge and cleaning method |
US15/689,751 US10870132B2 (en) | 2009-08-20 | 2017-08-29 | Cleaning sponge and cleaning method |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009191422 | 2009-08-20 | ||
JP2009191422 | 2009-08-20 | ||
JP2010058700A JP5538007B2 (ja) | 2009-08-20 | 2010-03-16 | 洗浄用スポンジ体及び洗浄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011066386A JP2011066386A (ja) | 2011-03-31 |
JP5538007B2 true JP5538007B2 (ja) | 2014-07-02 |
Family
ID=43607027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010058700A Active JP5538007B2 (ja) | 2009-08-20 | 2010-03-16 | 洗浄用スポンジ体及び洗浄方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US20160193631A1 (ja) |
JP (1) | JP5538007B2 (ja) |
KR (1) | KR101628900B1 (ja) |
TW (1) | TWI520793B (ja) |
WO (1) | WO2011021572A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5538007B2 (ja) * | 2009-08-20 | 2014-07-02 | アイオン株式会社 | 洗浄用スポンジ体及び洗浄方法 |
JP5902002B2 (ja) * | 2012-03-06 | 2016-04-13 | 関西ペイント株式会社 | 電気化学測定用プローブを使用した塗膜評価方法 |
JP5897959B2 (ja) * | 2012-03-30 | 2016-04-06 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法 |
JP6200273B2 (ja) | 2013-10-17 | 2017-09-20 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
EP3493244B1 (en) * | 2016-07-29 | 2023-11-01 | Kuraray Co., Ltd. | Polishing pad and polishing method using same |
JP7180098B2 (ja) * | 2018-03-30 | 2022-11-30 | 東洋紡株式会社 | 感光性樹脂凸版印刷用自動現像装置 |
CN112296011B (zh) * | 2019-07-30 | 2022-06-17 | 赤壁市万皇智能设备有限公司 | 一种视窗玻璃擦片机 |
JP2022030618A (ja) * | 2020-08-07 | 2022-02-18 | アイオン株式会社 | 洗浄用スポンジローラ |
CN115093126A (zh) * | 2022-07-21 | 2022-09-23 | 徐杰 | 一种立体碳纤维增强泡沫玻璃及其制备方法 |
CN116080220B (zh) * | 2022-09-23 | 2024-07-26 | 春语科技(广东)有限公司 | 一种三层复合聚乙烯醇缩丁醛海绵清洁滚筒及其制备方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1213113B (de) * | 1960-03-17 | 1966-03-24 | Kalle Ag | Verfahren zur Herstellung von Kunstschwaemmen |
US6080092A (en) * | 1994-10-06 | 2000-06-27 | Xomed Surgical Products, Inc. | Industrial cleaning sponge |
JP2994982B2 (ja) * | 1995-02-27 | 1999-12-27 | 鐘紡株式会社 | ポリビニルアセタール系スポンジの製造方法 |
JPH08306650A (ja) * | 1995-05-09 | 1996-11-22 | Mitsubishi Chem Corp | 基板の洗浄方法及びそれに用いるアルカリ性洗浄組成物 |
US5844030A (en) * | 1996-07-09 | 1998-12-01 | Andros; Nicholas | Charged ion cleaning devices and cleaning system |
JP3378015B2 (ja) | 1996-11-08 | 2003-02-17 | アイオン株式会社 | 洗浄用スポンジローラ |
US6502273B1 (en) * | 1996-11-08 | 2003-01-07 | Kanebo, Ltd. | Cleaning sponge roller |
JP3403108B2 (ja) * | 1999-02-26 | 2003-05-06 | アイオン株式会社 | 洗浄用スポンジローラ |
JP3306432B2 (ja) | 1997-02-21 | 2002-07-24 | アイオン株式会社 | スポンジシート |
JP3200036B2 (ja) * | 1998-05-22 | 2001-08-20 | アイオン株式会社 | 洗浄用回転ブラシ |
JP3633790B2 (ja) * | 1998-07-15 | 2005-03-30 | 日本カーバイド工業株式会社 | 金型清掃用樹脂組成物 |
US6523210B1 (en) * | 2000-04-05 | 2003-02-25 | Nicholas Andros | Surface charge controlling apparatus for wafer cleaning |
JP3844635B2 (ja) * | 2000-04-12 | 2006-11-15 | 株式会社荏原製作所 | ロールスポンジ、ロールスポンジの製造方法、ロールスポンジの製造具及びロールスポンジを軸に取り付ける方法 |
JP2002299300A (ja) * | 2001-03-30 | 2002-10-11 | Kaijo Corp | 基板処理方法 |
US20030046783A1 (en) * | 2001-09-10 | 2003-03-13 | Guangshun Chen | Polyvinyl acetate sponge and method for producing same |
US6818604B2 (en) * | 2001-10-04 | 2004-11-16 | Speedfam-Ipec Corporation | System and method for cleaning workpieces |
JP4261931B2 (ja) * | 2002-07-05 | 2009-05-13 | 株式会社荏原製作所 | 無電解めっき装置および無電解めっき後の洗浄方法 |
JP2006278392A (ja) * | 2005-03-28 | 2006-10-12 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置および基板洗浄方法 |
JP2008270360A (ja) * | 2007-04-17 | 2008-11-06 | Toshiba Corp | 半導体装置の製造方法 |
WO2010001761A1 (ja) * | 2008-06-30 | 2010-01-07 | アイオン株式会社 | 洗浄用スポンジローラ |
CH699799B1 (de) * | 2008-10-28 | 2018-06-29 | Geobrugg Ag | Netz, insbesondere für einen Korb für Fischzucht, für Abbremsvorgänge im Naturgefahrenbereich, als Abdeckung in der Sicherheitstechnik und/oder für Splitterschutz sowie ein Verfahren zu dessen Herstellung. |
JP5538007B2 (ja) * | 2009-08-20 | 2014-07-02 | アイオン株式会社 | 洗浄用スポンジ体及び洗浄方法 |
-
2010
- 2010-03-16 JP JP2010058700A patent/JP5538007B2/ja active Active
- 2010-08-12 WO PCT/JP2010/063718 patent/WO2011021572A1/ja active Application Filing
- 2010-08-12 KR KR1020127003600A patent/KR101628900B1/ko active IP Right Grant
- 2010-08-19 TW TW099127777A patent/TWI520793B/zh active
-
2016
- 2016-01-19 US US15/000,434 patent/US20160193631A1/en not_active Abandoned
-
2017
- 2017-08-29 US US15/689,751 patent/US10870132B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2011066386A (ja) | 2011-03-31 |
US20160193631A1 (en) | 2016-07-07 |
KR101628900B1 (ko) | 2016-06-09 |
TW201113103A (en) | 2011-04-16 |
WO2011021572A1 (ja) | 2011-02-24 |
KR20120056820A (ko) | 2012-06-04 |
TWI520793B (zh) | 2016-02-11 |
US20170354995A1 (en) | 2017-12-14 |
US10870132B2 (en) | 2020-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5538007B2 (ja) | 洗浄用スポンジ体及び洗浄方法 | |
JP5155394B2 (ja) | 洗浄用スポンジローラ | |
KR100571640B1 (ko) | 세정용 스펀지 롤러 | |
US6502273B1 (en) | Cleaning sponge roller | |
TWI500480B (zh) | 具有粒子於聚合基質內之cmp多孔墊及藉其拋光基板之方法 | |
JP7224128B2 (ja) | 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法 | |
US20200027760A1 (en) | Brush cleaning apparatus, chemical-mechanical polishing (cmp) system and wafer processing method | |
JP2009117765A (ja) | 洗浄用スポンジローラ | |
WO2012077592A1 (ja) | 化学機械研磨パッドおよびそれを用いた化学機械研磨方法 | |
JP6163081B2 (ja) | ブラシローラ | |
CN116171121A (zh) | 清洗用海绵辊 | |
WO2010125663A1 (ja) | 洗浄用スポンジローラ | |
US20030046783A1 (en) | Polyvinyl acetate sponge and method for producing same | |
JP6088153B2 (ja) | ブラシローラ | |
JP7511466B2 (ja) | 洗浄部材の洗浄装置、基板洗浄装置及び洗浄部材アセンブリ | |
JPH1034091A (ja) | 洗浄用ローラ | |
JP2013052368A (ja) | 被洗浄体の洗浄方法、洗浄装置、これらの洗浄方法又は洗浄装置に用いられる1対のブラシローラ | |
US20040151890A1 (en) | Polyvinyl acetal composition skinless roller brush | |
JP2015069662A (ja) | Hdd用ガラス基板の製造方法 | |
JP2004298767A (ja) | 洗浄用多孔質ロール体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130219 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131101 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140404 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5538007 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140428 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |