JP5537920B2 - 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、及び、パターン形成方法 - Google Patents

感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、及び、パターン形成方法 Download PDF

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Publication number
JP5537920B2
JP5537920B2 JP2009288255A JP2009288255A JP5537920B2 JP 5537920 B2 JP5537920 B2 JP 5537920B2 JP 2009288255 A JP2009288255 A JP 2009288255A JP 2009288255 A JP2009288255 A JP 2009288255A JP 5537920 B2 JP5537920 B2 JP 5537920B2
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sensitive
group
radiation
actinic ray
formula
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Expired - Fee Related
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JP2009288255A
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Japanese (ja)
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JP2010250271A (ja
JP2010250271A5 (https=
Inventor
佳奈 藤井
修史 平野
真己 山田
亨 藤森
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Fujifilm Corp
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Fujifilm Corp
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Priority to JP2009288255A priority Critical patent/JP5537920B2/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to EP10756267.0A priority patent/EP2411873A4/en
Priority to PCT/JP2010/055495 priority patent/WO2010110472A1/en
Priority to KR1020117022143A priority patent/KR20110137782A/ko
Priority to US13/257,069 priority patent/US8541161B2/en
Priority to TW099108815A priority patent/TWI476515B/zh
Publication of JP2010250271A publication Critical patent/JP2010250271A/ja
Publication of JP2010250271A5 publication Critical patent/JP2010250271A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
    • C08F212/22—Oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/281—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/12—Hydrolysis
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2009288255A 2009-03-26 2009-12-18 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、及び、パターン形成方法 Expired - Fee Related JP5537920B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009288255A JP5537920B2 (ja) 2009-03-26 2009-12-18 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、及び、パターン形成方法
PCT/JP2010/055495 WO2010110472A1 (en) 2009-03-26 2010-03-23 Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same and pattern forming method
KR1020117022143A KR20110137782A (ko) 2009-03-26 2010-03-23 감활성광선성 또는 감방사선성 수지 조성물, 이것을 사용한 레지스트막 및 패턴 형성 방법
US13/257,069 US8541161B2 (en) 2009-03-26 2010-03-23 Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same and pattern forming method
EP10756267.0A EP2411873A4 (en) 2009-03-26 2010-03-23 AGAINST ACTIVE RADIATION SENSITIVE OR BZW. RADIATION-SENSITIVE RESIN COMPOSITION, RESISTIVE FILM THEREFOR AND STRUCTURE-FORMING PROCESS THEREFOR
TW099108815A TWI476515B (zh) 2009-03-26 2010-03-25 感光化射線或感放射線樹脂組成物、使用它之光阻膜及圖案形成方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009077760 2009-03-26
JP2009077760 2009-03-26
JP2009288255A JP5537920B2 (ja) 2009-03-26 2009-12-18 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、及び、パターン形成方法

Publications (3)

Publication Number Publication Date
JP2010250271A JP2010250271A (ja) 2010-11-04
JP2010250271A5 JP2010250271A5 (https=) 2012-08-23
JP5537920B2 true JP5537920B2 (ja) 2014-07-02

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JP2009288255A Expired - Fee Related JP5537920B2 (ja) 2009-03-26 2009-12-18 感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、及び、パターン形成方法

Country Status (6)

Country Link
US (1) US8541161B2 (https=)
EP (1) EP2411873A4 (https=)
JP (1) JP5537920B2 (https=)
KR (1) KR20110137782A (https=)
TW (1) TWI476515B (https=)
WO (1) WO2010110472A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9260554B2 (en) 2012-07-12 2016-02-16 Showa Denko K.K. Copolymer, monomer composition, resin solution, and resin film
JP7283374B2 (ja) * 2019-01-29 2023-05-30 信越化学工業株式会社 化学増幅レジスト材料及びパターン形成方法
JP2022038216A (ja) 2020-08-26 2022-03-10 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 化学増幅型レジスト組成物およびそれを用いたレジスト膜の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491628A (en) 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
JP3030672B2 (ja) 1991-06-18 2000-04-10 和光純薬工業株式会社 新規なレジスト材料及びパタ−ン形成方法
JP3239772B2 (ja) 1995-10-09 2001-12-17 信越化学工業株式会社 化学増幅ポジ型レジスト材料
JP3894260B2 (ja) 1999-06-11 2007-03-14 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP4190138B2 (ja) 2000-08-02 2008-12-03 富士フイルム株式会社 ポジ型フォトレジスト組成物
JP4092083B2 (ja) * 2001-03-21 2008-05-28 富士フイルム株式会社 電子線又はｘ線用ネガ型レジスト組成物
JP4025074B2 (ja) 2001-09-19 2007-12-19 富士フイルム株式会社 ポジ型レジスト組成物
JP4414721B2 (ja) 2002-11-22 2010-02-10 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
KR20080032098A (ko) * 2005-08-12 2008-04-14 라이온 가부시키가이샤 나노 평활성과 에칭 내성을 가지는 포토레지스트 폴리머 및레지스트 조성물
US8182975B2 (en) 2007-03-28 2012-05-22 Fujifilm Corporation Positive resist composition and pattern forming method using the same
JP5039581B2 (ja) * 2007-03-28 2012-10-03 富士フイルム株式会社 ポジ型レジスト組成物及びこれを用いたパターン形成方法
JP5046834B2 (ja) * 2007-09-28 2012-10-10 富士フイルム株式会社 ポジ型レジスト組成物およびこれを用いたパターン形成方法
JP2009235132A (ja) * 2008-03-25 2009-10-15 Fujifilm Corp アルケニルフェノール系重合体の製造方法、この製造方法によって製造されたアルケニルフェノール系重合体、このアルケニルフェノール系重合体を含有するポジ型レジスト組成物及びこのポジ型レジスト組成物を用いたパターン形成方法
JP2009235131A (ja) * 2008-03-25 2009-10-15 Fujifilm Corp アルケニルフェノール系重合体の製造方法、この製造方法によって製造されたアルケニルフェノール系重合体、このアルケニルフェノール系重合体を含有するポジ型レジスト組成物及びこのポジ型レジスト組成物を用いたパターン形成方法
JP2009244805A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp ポジ型レジスト組成物及びそれを用いたパターン形成方法
TW201106101A (en) * 2009-06-01 2011-02-16 Fujifilm Electronic Materials Chemically amplified positive photoresist composition

Also Published As

Publication number Publication date
US20120003586A1 (en) 2012-01-05
EP2411873A1 (en) 2012-02-01
WO2010110472A1 (en) 2010-09-30
JP2010250271A (ja) 2010-11-04
US8541161B2 (en) 2013-09-24
KR20110137782A (ko) 2011-12-23
TW201042375A (en) 2010-12-01
TWI476515B (zh) 2015-03-11
EP2411873A4 (en) 2013-12-04

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