JP5534672B2 - 化学機械的研磨のスペクトルに基づく監視のための装置および方法 - Google Patents

化学機械的研磨のスペクトルに基づく監視のための装置および方法 Download PDF

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Publication number
JP5534672B2
JP5534672B2 JP2008528048A JP2008528048A JP5534672B2 JP 5534672 B2 JP5534672 B2 JP 5534672B2 JP 2008528048 A JP2008528048 A JP 2008528048A JP 2008528048 A JP2008528048 A JP 2008528048A JP 5534672 B2 JP5534672 B2 JP 5534672B2
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Japan
Prior art keywords
spectrum
polishing
substrate
current
spectra
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Active
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JP2008528048A
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English (en)
Japanese (ja)
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JP2009505847A (ja
JP2009505847A5 (https=
Inventor
ドミニーク， ジェイ． ベンヴェグニュ，
ジェフリー， ドゥリュー デイヴィッド，
ボグダン スウェデック，
ハリー， キュー． リー，
ラクシュマナン カルッピアー，
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Priority claimed from US11/213,344 external-priority patent/US7764377B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2009505847A publication Critical patent/JP2009505847A/ja
Publication of JP2009505847A5 publication Critical patent/JP2009505847A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2008528048A 2005-08-22 2006-08-21 化学機械的研磨のスペクトルに基づく監視のための装置および方法 Active JP5534672B2 (ja)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US60/710,682 2005-08-22
US11/213,344 2005-08-26
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,674 2005-08-26
US11/213,675 2005-08-26
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US11/261,742 2005-10-28
US74776806P 2006-05-19 2006-05-19
US60/747,768 2006-05-19
PCT/US2006/032659 WO2007024807A2 (en) 2005-08-22 2006-08-21 Apparatus and methods for spectrum based monitoring of chemical mechanical polishing

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP2012168681A Division JP5622806B2 (ja) 2005-08-22 2012-07-30 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP2012168680A Division JP6047327B2 (ja) 2005-08-22 2012-07-30 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP2012168682A Division JP5622807B2 (ja) 2005-08-22 2012-07-30 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP2012220364A Division JP5624099B2 (ja) 2005-08-22 2012-10-02 化学機械的研磨のスペクトルに基づく監視のための装置および方法

Publications (3)

Publication Number Publication Date
JP2009505847A JP2009505847A (ja) 2009-02-12
JP2009505847A5 JP2009505847A5 (https=) 2009-10-01
JP5534672B2 true JP5534672B2 (ja) 2014-07-02

Family

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Family Applications (1)

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JP2008528048A Active JP5534672B2 (ja) 2005-08-22 2006-08-21 化学機械的研磨のスペクトルに基づく監視のための装置および方法

Country Status (4)

Country Link
JP (1) JP5534672B2 (https=)
KR (1) KR101324644B1 (https=)
TW (1) TWI366872B (https=)
WO (1) WO2007024807A2 (https=)

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TWI496661B (zh) * 2010-04-28 2015-08-21 應用材料股份有限公司 用於光學監測之參考光譜的自動產生
KR101774031B1 (ko) * 2010-05-05 2017-09-01 어플라이드 머티어리얼스, 인코포레이티드 종료점 검출을 위한 스펙트럼 피쳐들의 동적 또는 적응 트랙킹
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
JP2012019114A (ja) * 2010-07-08 2012-01-26 Tokyo Seimitsu Co Ltd 研磨終点検出装置、及び研磨終点検出方法
JP5612945B2 (ja) 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
TWI478259B (zh) * 2010-07-23 2015-03-21 應用材料股份有限公司 用於終點偵測之二維光譜特徵追蹤
US8954186B2 (en) * 2010-07-30 2015-02-10 Applied Materials, Inc. Selecting reference libraries for monitoring of multiple zones on a substrate
JP5918254B2 (ja) * 2010-11-18 2016-05-18 キャボット マイクロエレクトロニクス コーポレイション 透過性領域を含む研磨パッド
JP5980476B2 (ja) 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
JP6030636B2 (ja) * 2011-04-28 2016-11-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ モデルに基づく、研磨のためのスペクトルライブラリの生成
JP5715034B2 (ja) * 2011-11-30 2015-05-07 株式会社東京精密 研磨装置による研磨方法
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US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
JP7197999B2 (ja) 2018-05-11 2022-12-28 キオクシア株式会社 研磨装置および研磨パッド
KR102586252B1 (ko) * 2018-07-06 2023-10-11 주식회사 케이씨텍 기판의 실리콘 산화막 두께 검출 장치 및 방법
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Also Published As

Publication number Publication date
KR20080042895A (ko) 2008-05-15
TW201103085A (en) 2011-01-16
KR101324644B1 (ko) 2013-11-01
WO2007024807A9 (en) 2009-09-03
TWI366872B (en) 2012-06-21
JP2009505847A (ja) 2009-02-12
WO2007024807A3 (en) 2007-07-12
WO2007024807A2 (en) 2007-03-01

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