JP5532743B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5532743B2
JP5532743B2 JP2009191093A JP2009191093A JP5532743B2 JP 5532743 B2 JP5532743 B2 JP 5532743B2 JP 2009191093 A JP2009191093 A JP 2009191093A JP 2009191093 A JP2009191093 A JP 2009191093A JP 5532743 B2 JP5532743 B2 JP 5532743B2
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JP
Japan
Prior art keywords
metal layer
layer
gaas substrate
main surface
hole
Prior art date
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Expired - Fee Related
Application number
JP2009191093A
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English (en)
Japanese (ja)
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JP2011044546A (ja
JP2011044546A5 (https=
Inventor
弘一郎 西沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2009191093A priority Critical patent/JP5532743B2/ja
Priority to TW099111380A priority patent/TWI419276B/zh
Priority to US12/766,966 priority patent/US8581411B2/en
Publication of JP2011044546A publication Critical patent/JP2011044546A/ja
Publication of JP2011044546A5 publication Critical patent/JP2011044546A5/ja
Priority to US14/050,412 priority patent/US20140035145A1/en
Application granted granted Critical
Publication of JP5532743B2 publication Critical patent/JP5532743B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4403—Conductive materials thereof based on metals, e.g. alloys, metal silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0116—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group III-V semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0234—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes that stop on pads or on electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0242—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias comprising etching via holes from the back sides of the chips, wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H10W20/0261—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias characterised by the filling method or the material of the conductive fill
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs

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  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2009191093A 2009-08-20 2009-08-20 半導体装置及びその製造方法 Expired - Fee Related JP5532743B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009191093A JP5532743B2 (ja) 2009-08-20 2009-08-20 半導体装置及びその製造方法
TW099111380A TWI419276B (zh) 2009-08-20 2010-04-13 Semiconductor device and manufacturing method thereof
US12/766,966 US8581411B2 (en) 2009-08-20 2010-04-26 Semiconductor device
US14/050,412 US20140035145A1 (en) 2009-08-20 2013-10-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009191093A JP5532743B2 (ja) 2009-08-20 2009-08-20 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011044546A JP2011044546A (ja) 2011-03-03
JP2011044546A5 JP2011044546A5 (https=) 2012-07-05
JP5532743B2 true JP5532743B2 (ja) 2014-06-25

Family

ID=43604671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009191093A Expired - Fee Related JP5532743B2 (ja) 2009-08-20 2009-08-20 半導体装置及びその製造方法

Country Status (3)

Country Link
US (2) US8581411B2 (https=)
JP (1) JP5532743B2 (https=)
TW (1) TWI419276B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9616379B2 (en) * 2013-07-25 2017-04-11 Korea Institute Of Energy Research Method for preparing hydrogen separation membrane and device for preparing hydrogen separation membrane
US9887131B2 (en) 2014-03-27 2018-02-06 Mitsubishi Electric Corporation Semiconductor device having a Pd-containing adhesion layer
WO2023079631A1 (ja) * 2021-11-04 2023-05-11 三菱電機株式会社 半導体装置及びその製造方法
JP7831687B2 (ja) * 2023-03-10 2026-03-17 三菱電機株式会社 半導体装置及びその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642528A (en) * 1968-06-05 1972-02-15 Matsushita Electronics Corp Semiconductor device and method of making same
US4179533A (en) * 1978-04-25 1979-12-18 The United States Of America As Represented By The Secretary Of The Navy Multi-refractory films for gallium arsenide devices
US5075763A (en) * 1988-09-28 1991-12-24 Kopin Corporation High temperature metallization system for contacting semiconductor materials
JPH03109725A (ja) * 1989-09-25 1991-05-09 Fujitsu Ltd 半導体装置の製造方法
JP2679320B2 (ja) * 1989-12-20 1997-11-19 富士電機株式会社 ショットキバリアダイオード
US5027189A (en) * 1990-01-10 1991-06-25 Hughes Aircraft Company Integrated circuit solder die-attach design and method
JPH07193214A (ja) 1993-12-27 1995-07-28 Mitsubishi Electric Corp バイアホール及びその形成方法
US5956362A (en) * 1996-02-27 1999-09-21 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device and method of etching
JP3724110B2 (ja) * 1997-04-24 2005-12-07 三菱電機株式会社 半導体装置の製造方法
CA2328907A1 (en) * 1999-02-18 2000-08-24 Naoki Tsukiji Electrode for semiconductor device and its manufacturing method
JP3462166B2 (ja) * 2000-09-08 2003-11-05 富士通カンタムデバイス株式会社 化合物半導体装置
US6787910B2 (en) * 2002-07-23 2004-09-07 National Chiao Tung University Schottky structure in GaAs semiconductor device
JP3715975B2 (ja) * 2003-04-24 2005-11-16 株式会社半導体理工学研究センター 多層配線構造の製造方法
JP2005109058A (ja) * 2003-09-30 2005-04-21 Sanyo Electric Co Ltd 半導体素子およびその製造方法
JP4637009B2 (ja) 2005-12-02 2011-02-23 三菱電機株式会社 半導体装置の製造方法
KR100761467B1 (ko) * 2006-06-28 2007-09-27 삼성전자주식회사 금속배선 및 그 형성 방법
JP2008251562A (ja) * 2007-03-29 2008-10-16 Sharp Corp 半導体レーザ素子およびその形成方法
JP2009064961A (ja) * 2007-09-06 2009-03-26 Sharp Corp 半導体レーザ装置およびその製造方法

Also Published As

Publication number Publication date
JP2011044546A (ja) 2011-03-03
TWI419276B (zh) 2013-12-11
US20110042822A1 (en) 2011-02-24
US8581411B2 (en) 2013-11-12
TW201108362A (en) 2011-03-01
US20140035145A1 (en) 2014-02-06

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