JP5526104B2 - 熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール - Google Patents

熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール Download PDF

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JP5526104B2
JP5526104B2 JP2011233584A JP2011233584A JP5526104B2 JP 5526104 B2 JP5526104 B2 JP 5526104B2 JP 2011233584 A JP2011233584 A JP 2011233584A JP 2011233584 A JP2011233584 A JP 2011233584A JP 5526104 B2 JP5526104 B2 JP 5526104B2
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thermoelectric conversion
semiconductor
glass
composite material
type
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Expired - Fee Related
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Japanese (ja)
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JP2013093397A (ja
JP2013093397A5 (cg-RX-API-DMAC7.html
Inventor
藤枝　　正
裕一 沢井
内藤　　孝
拓也 青柳
浩貴 山本
秀明 鷹野
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2011233584A priority Critical patent/JP5526104B2/ja
Priority to PCT/JP2012/075593 priority patent/WO2013061739A1/ja
Priority to TW101136663A priority patent/TWI505523B/zh
Publication of JP2013093397A publication Critical patent/JP2013093397A/ja
Publication of JP2013093397A5 publication Critical patent/JP2013093397A5/ja
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/44—Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08—Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/60—Thermal-PV hybrids

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
JP2011233584A 2011-10-25 2011-10-25 熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール Expired - Fee Related JP5526104B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011233584A JP5526104B2 (ja) 2011-10-25 2011-10-25 熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール
PCT/JP2012/075593 WO2013061739A1 (ja) 2011-10-25 2012-10-03 熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール
TW101136663A TWI505523B (zh) 2011-10-25 2012-10-04 Thermoelectric conversion of composite materials, the use of its thermoelectric conversion material slurry, and the use of its thermoelectric conversion module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011233584A JP5526104B2 (ja) 2011-10-25 2011-10-25 熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール

Publications (3)

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JP2013093397A JP2013093397A (ja) 2013-05-16
JP2013093397A5 JP2013093397A5 (cg-RX-API-DMAC7.html) 2013-10-17
JP5526104B2 true JP5526104B2 (ja) 2014-06-18

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JP (1) JP5526104B2 (cg-RX-API-DMAC7.html)
TW (1) TWI505523B (cg-RX-API-DMAC7.html)
WO (1) WO2013061739A1 (cg-RX-API-DMAC7.html)

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Publication number Priority date Publication date Assignee Title
KR101998697B1 (ko) * 2012-06-28 2019-07-10 엘지이노텍 주식회사 열전냉각모듈 및 이의 제조 방법
EP2884550B1 (en) * 2013-08-09 2016-11-16 LINTEC Corporation Thermoelectric conversion material and production method therefor
JP6347025B2 (ja) * 2013-12-25 2018-06-27 株式会社小松プロセス 熱電変換材料、回路作製方法、及び、熱電変換モジュール
JP2015164393A (ja) * 2014-01-28 2015-09-10 学校法人日本大学 ヒートシンク及び複合型太陽エネルギー変換装置
US9595652B2 (en) * 2014-01-29 2017-03-14 Lg Innotek Co., Ltd. Thermoelectric material and thermoelectric element including the same
US10490724B2 (en) 2014-12-26 2019-11-26 Lintec Corporation Peltier cooling element and method for manufacturing same
JP6791544B2 (ja) * 2015-06-24 2020-11-25 リンテック株式会社 熱電半導体組成物、並びに熱電変換材料及びその製造方法
CN105256161B (zh) * 2015-11-04 2017-09-29 武汉理工大学 一种Ag2Se块体热电材料的免烧致密化制备工艺
KR102088009B1 (ko) * 2016-12-27 2020-03-11 주식회사 엘지화학 열전 변환 복합재 및 이의 제조 방법
JPWO2018230031A1 (ja) * 2017-06-16 2019-06-27 三菱電機株式会社 太陽光発電パネル及びその製造方法
JP7196432B2 (ja) * 2017-06-29 2022-12-27 三菱マテリアル株式会社 熱電変換モジュール、及び、熱電変換モジュールの製造方法
JP2019153664A (ja) * 2018-03-02 2019-09-12 株式会社ミクニ 熱電変換モジュールの製造方法
CN111710775A (zh) * 2020-07-22 2020-09-25 中国科学院宁波材料技术与工程研究所 一种硒化锡基热电材料、其制备方法及应用
JP7627940B2 (ja) * 2021-03-18 2025-02-07 国立研究開発法人産業技術総合研究所 熱電変換層を有する積層体とその製造方法、及び発電モジュール
CN113161470A (zh) * 2021-04-09 2021-07-23 河南鸿昌电子有限公司 制造半导体致冷件所用的材料、半导体晶粒和致冷件

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Publication number Priority date Publication date Assignee Title
JPH0832123A (ja) * 1994-07-19 1996-02-02 Matsushita Electric Works Ltd 熱電変換素子の製造方法
JPH11251647A (ja) * 1998-02-27 1999-09-17 Ueki Corporation:Kk 熱電変換素子および熱電変換装置と、これらの製造方法
JP4696289B2 (ja) * 2006-10-11 2011-06-08 財団法人北九州産業学術推進機構 熱電対式温度センサ及びその製造方法
JP2008227178A (ja) * 2007-03-13 2008-09-25 Sumitomo Chemical Co Ltd 熱電変換モジュール用基板及び熱電変換モジュール
JP5414409B2 (ja) * 2009-01-16 2014-02-12 日立粉末冶金株式会社 低融点ガラス組成物、それを用いた低温封着材料及び電子部品
JP2011129832A (ja) * 2009-12-21 2011-06-30 Denso Corp 熱電変換素子及びその製造方法

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JP2013093397A (ja) 2013-05-16
TW201332170A (zh) 2013-08-01
TWI505523B (zh) 2015-10-21
WO2013061739A1 (ja) 2013-05-02

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