TWI505523B - Thermoelectric conversion of composite materials, the use of its thermoelectric conversion material slurry, and the use of its thermoelectric conversion module - Google Patents

Thermoelectric conversion of composite materials, the use of its thermoelectric conversion material slurry, and the use of its thermoelectric conversion module Download PDF

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Publication number
TWI505523B
TWI505523B TW101136663A TW101136663A TWI505523B TW I505523 B TWI505523 B TW I505523B TW 101136663 A TW101136663 A TW 101136663A TW 101136663 A TW101136663 A TW 101136663A TW I505523 B TWI505523 B TW I505523B
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TW
Taiwan
Prior art keywords
thermoelectric conversion
semiconductor
glass
oxide
type
Prior art date
Application number
TW101136663A
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English (en)
Chinese (zh)
Other versions
TW201332170A (zh
Inventor
Tadashi Fujieda
Yuichi Sawai
Takashi Naito
Takuya Aoyagi
Hiroki Yamamoto
Hideaki Takano
Original Assignee
Hitachi Ltd
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Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW201332170A publication Critical patent/TW201332170A/zh
Application granted granted Critical
Publication of TWI505523B publication Critical patent/TWI505523B/zh

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40Thermal components
    • H02S40/44Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/122Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/16Silica-free oxide glass compositions containing phosphorus
    • C03C3/21Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/08Frit compositions, i.e. in a powdered or comminuted form containing phosphorus
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/852Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/855Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/60Thermal-PV hybrids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
TW101136663A 2011-10-25 2012-10-04 Thermoelectric conversion of composite materials, the use of its thermoelectric conversion material slurry, and the use of its thermoelectric conversion module TWI505523B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011233584A JP5526104B2 (ja) 2011-10-25 2011-10-25 熱電変換複合材料、それを用いた熱電変換材料ペースト、およびそれを用いた熱電変換モジュール

Publications (2)

Publication Number Publication Date
TW201332170A TW201332170A (zh) 2013-08-01
TWI505523B true TWI505523B (zh) 2015-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101136663A TWI505523B (zh) 2011-10-25 2012-10-04 Thermoelectric conversion of composite materials, the use of its thermoelectric conversion material slurry, and the use of its thermoelectric conversion module

Country Status (3)

Country Link
JP (1) JP5526104B2 (cg-RX-API-DMAC7.html)
TW (1) TWI505523B (cg-RX-API-DMAC7.html)
WO (1) WO2013061739A1 (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101998697B1 (ko) * 2012-06-28 2019-07-10 엘지이노텍 주식회사 열전냉각모듈 및 이의 제조 방법
EP2884550B1 (en) * 2013-08-09 2016-11-16 LINTEC Corporation Thermoelectric conversion material and production method therefor
JP6347025B2 (ja) * 2013-12-25 2018-06-27 株式会社小松プロセス 熱電変換材料、回路作製方法、及び、熱電変換モジュール
JP2015164393A (ja) * 2014-01-28 2015-09-10 学校法人日本大学 ヒートシンク及び複合型太陽エネルギー変換装置
US9595652B2 (en) * 2014-01-29 2017-03-14 Lg Innotek Co., Ltd. Thermoelectric material and thermoelectric element including the same
US10490724B2 (en) 2014-12-26 2019-11-26 Lintec Corporation Peltier cooling element and method for manufacturing same
JP6791544B2 (ja) * 2015-06-24 2020-11-25 リンテック株式会社 熱電半導体組成物、並びに熱電変換材料及びその製造方法
CN105256161B (zh) * 2015-11-04 2017-09-29 武汉理工大学 一种Ag2Se块体热电材料的免烧致密化制备工艺
KR102088009B1 (ko) * 2016-12-27 2020-03-11 주식회사 엘지화학 열전 변환 복합재 및 이의 제조 방법
JPWO2018230031A1 (ja) * 2017-06-16 2019-06-27 三菱電機株式会社 太陽光発電パネル及びその製造方法
JP7196432B2 (ja) * 2017-06-29 2022-12-27 三菱マテリアル株式会社 熱電変換モジュール、及び、熱電変換モジュールの製造方法
JP2019153664A (ja) * 2018-03-02 2019-09-12 株式会社ミクニ 熱電変換モジュールの製造方法
CN111710775A (zh) * 2020-07-22 2020-09-25 中国科学院宁波材料技术与工程研究所 一种硒化锡基热电材料、其制备方法及应用
JP7627940B2 (ja) * 2021-03-18 2025-02-07 国立研究開発法人産業技術総合研究所 熱電変換層を有する積層体とその製造方法、及び発電モジュール
CN113161470A (zh) * 2021-04-09 2021-07-23 河南鸿昌电子有限公司 制造半导体致冷件所用的材料、半导体晶粒和致冷件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832123A (ja) * 1994-07-19 1996-02-02 Matsushita Electric Works Ltd 熱電変換素子の製造方法
JPH11251647A (ja) * 1998-02-27 1999-09-17 Ueki Corporation:Kk 熱電変換素子および熱電変換装置と、これらの製造方法
US20100154856A1 (en) * 2007-03-13 2010-06-24 Sumitomo Chemical Company, Limited Substrate for Thermoelectric Conversion Module, and Thermoelectric Conversion Module
US20100180934A1 (en) * 2009-01-16 2010-07-22 Hitachi Powdered Metals Co., Ltd. Low softening point glass composition, bonding material using same and electronic parts
JP2011129832A (ja) * 2009-12-21 2011-06-30 Denso Corp 熱電変換素子及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4696289B2 (ja) * 2006-10-11 2011-06-08 財団法人北九州産業学術推進機構 熱電対式温度センサ及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832123A (ja) * 1994-07-19 1996-02-02 Matsushita Electric Works Ltd 熱電変換素子の製造方法
JPH11251647A (ja) * 1998-02-27 1999-09-17 Ueki Corporation:Kk 熱電変換素子および熱電変換装置と、これらの製造方法
US20100154856A1 (en) * 2007-03-13 2010-06-24 Sumitomo Chemical Company, Limited Substrate for Thermoelectric Conversion Module, and Thermoelectric Conversion Module
US20100180934A1 (en) * 2009-01-16 2010-07-22 Hitachi Powdered Metals Co., Ltd. Low softening point glass composition, bonding material using same and electronic parts
JP2011129832A (ja) * 2009-12-21 2011-06-30 Denso Corp 熱電変換素子及びその製造方法

Also Published As

Publication number Publication date
JP2013093397A (ja) 2013-05-16
TW201332170A (zh) 2013-08-01
WO2013061739A1 (ja) 2013-05-02
JP5526104B2 (ja) 2014-06-18

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