JP5520453B2 - 拡散バリアフィルムを含む半導体素子の形成方法 - Google Patents
拡散バリアフィルムを含む半導体素子の形成方法 Download PDFInfo
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- JP5520453B2 JP5520453B2 JP2008121624A JP2008121624A JP5520453B2 JP 5520453 B2 JP5520453 B2 JP 5520453B2 JP 2008121624 A JP2008121624 A JP 2008121624A JP 2008121624 A JP2008121624 A JP 2008121624A JP 5520453 B2 JP5520453 B2 JP 5520453B2
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- film
- metal nitride
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- diffusion barrier
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- 230000004888 barrier function Effects 0.000 title claims description 169
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- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 3
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- 238000003860 storage Methods 0.000 description 3
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 2
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- 239000013078 crystal Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
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- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BEHSQFZSTNVEGP-UHFFFAOYSA-N [Ag].[Ir] Chemical compound [Ag].[Ir] BEHSQFZSTNVEGP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000005516 deep trap Effects 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- 239000002159 nanocrystal Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
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Description
図1〜図4は、本発明の一実施の形態による半導体素子の形成方法を説明するための断面図である。
本実施の形態では、本発明による拡散バリアフィルムを含むNAND型不揮発性記憶素子の形成方法を開示する。
108 補助拡散バリア膜
113 金属窒化膜
110 プラズマ未処理層
111 プラズマ処理層
120 拡散バリアフィルム
Claims (17)
- 下部導電体を含む基板上に層間絶縁膜を形成するステップと、
前記層間絶縁膜を貫通して、前記下部導電体を露出させる開口部を形成するステップと、
前記開口部を有する基板上に金属有機化学気相蒸着法により金属窒化膜を蒸着した後に前記蒸着された金属窒化膜の上部をプラズマ処理し、前記金属窒化膜の上部に形成されたプラズマ処理層及び前記金属窒化膜の下部に形成されたプラズマ未処理層を含む拡散バリアフィルムを形成するステップと、
少なくとも前記開口部の底面上に位置した前記拡散バリアフィルム上を除き、かつ前記層間絶縁膜の上部面上に位置した前記拡散バリアフィルム上に物理気相成長法により導電性成長抑制層を形成するステップと、
前記拡散バリアフィルム上に前記開口部を満たす上部導電体を形成するステップと、
前記プラズマ処理された金属窒化膜の上部にシリコン浸漬工程(silicon soaking process)を行うステップとを含むものの、
前記導電性成長抑制層は、前記拡散バリアフィルムに比べて窒素濃度の高い金属窒化物で形成され、
前記拡散バリアフィルムは、金属有機化学気相蒸着法による窒化金属で形成された、
半導体素子の形成方法。 - 前記拡散バリアフィルムは、積層された複数の副金属窒化膜を含むものの、前記副金属窒化膜は、各々金属有機化学気相蒸着法により形成される請求項1に記載の半導体素子の形成方法。
- 前記拡散バリアフィルムを形成するステップは、
前記開口部を有する基板上に前記複数の副金属窒化膜を蒸着するステップと、
前記複数の副金属窒化膜の中から選択された少なくとも一つの副金属窒化膜を蒸着した直後に、前記選択された副金属窒化膜をプラズマ処理するステップと、を含むものの、
前記複数の副金属窒化膜のうち、少なくとも一つの少なくとも下部は、前記プラズマ未処理層に含まれる請求項1に記載の半導体素子の形成方法。 - 少なくとも前記選択された副金属窒化膜の前記開口部の底面上に位置した部分の全体がプラズマ処理されるものの、前記複数の副金属窒化膜のうち、少なくとも一つは、非選択の副金属窒化膜であり、前記非選択の副金属窒化膜のうち、少なくとも一部は、前記プラズマ未処理層に含まれる請求項3に記載の半導体素子の形成方法。
- 前記選択された副金属窒化膜の上部が前記プラズマ処理される請求項3に記載の半導体素子の形成方法。
- 前記選択された副金属窒化膜のうち、少なくとも一つの第1選択された副金属窒化膜を蒸着した直後に、第1プラズマ処理が行われ、
前記選択された副金属窒化膜のうち、少なくとも一つの第2選択された副金属窒化膜を蒸着した直後に、第2プラズマ処理が行われるものの、
前記第1選択された副金属窒化膜の上部が前記第1プラズマ処理され、
前記第2選択された副金属窒化膜の少なくとも前記開口部の底面上に位置した部分の全体が前記第2プラズマ処理され、
前記第1選択された副金属窒化膜の下部は、前記第1プラズマ処理されない請求項3に記載の半導体素子の形成方法。 - 前記選択された副金属窒化膜をプラズマ処理した後に、前記プラズマ処理された副金属窒化膜にシリコン浸漬工程を行うステップをさらに含む請求項3に記載の半導体素子の形成方法。
- 前記拡散バリアフィルムは、少なくとも一つの耐火金属を含む窒化物で形成された請求項1に記載の半導体素子の形成方法。
- 前記プラズマ処理層は、酸素、窒素及び水素の中から選択された少なくとも一つを含む工程ガスを使用するプラズマ処理工程により処理される請求項1に記載の半導体素子の形成方法。
- 前記下部導電体は、銅及び貴金属の中から選択された少なくとも一つを含む請求項1に記載の半導体素子の形成方法。
- 前記拡散バリアフィルムを形成する前に、
前記開口部を有する基板上に補助拡散バリア膜を形成するステップをさらに含む請求項1に記載の半導体素子の形成方法。 - 前記補助拡散バリア膜は、チタニウム(titanium)、タンタル(tantalum)、窒化チタニウム(titanium nitride)、窒化タンタル、チタニウム−ジルコニウム(titanium−zirconium)及び窒化チタニウム−ジルコニウムの中から選択された少なくとも一つを含む請求項11に記載の半導体素子の形成方法。
- 前記上部導電体は、アルミニウムを含む請求項1に記載の半導体素子の形成方法。
- 前記上部導電体を形成するステップは、
前記拡散バリアフィルム上に化学気相蒸着法により第1アルミニウム膜を形成するステップと、
前記第1アルミニウム膜上に物理気相成長法により第2アルミニウム膜を形成するステップと、を含む請求項13に記載の半導体素子の形成方法。 - 前記第1アルミニウム膜を形成する前に、
前記層間絶縁膜の上部面上に位置した前記拡散バリアフィルムに成長抑制プラズマ処理を行うステップをさらに含むものの、
前記成長抑制プラズマ処理は、窒素を含む工程ガスを使用し、
前記層間絶縁膜の上部面上に位置した前記拡散バリアフィルムの窒素濃度は、前記開口部内に位置した前記拡散バリアフィルムの窒素濃度に比べて高い請求項14に記載の半導体素子の形成方法。 - 前記導電性成長抑制層を形成する前に、
前記拡散バリアフィルム上に粘着金属層を形成するステップをさらに含む請求項14に記載の半導体素子の形成方法。 - 少なくとも前記第2アルミニウム膜をリフローするステップをさらに含む請求項14に記載の半導体素子の形成方法。
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