JP5506073B2 - 差動電流駆動方式の送受信機、及び送信システム - Google Patents

差動電流駆動方式の送受信機、及び送信システム Download PDF

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Publication number
JP5506073B2
JP5506073B2 JP2006120683A JP2006120683A JP5506073B2 JP 5506073 B2 JP5506073 B2 JP 5506073B2 JP 2006120683 A JP2006120683 A JP 2006120683A JP 2006120683 A JP2006120683 A JP 2006120683A JP 5506073 B2 JP5506073 B2 JP 5506073B2
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JP2006120683A
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Japanese (ja)
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JP2006311551A5 (enExample
JP2006311551A (ja
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ウン テク オ
ジョン ギ キム
ユ チャン ソン
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MagnaChip Semiconductor Ltd
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MagnaChip Semiconductor Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
    • B07B1/18—Drum screens
    • B07B1/22—Revolving drums
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0272—Arrangements for coupling to multiple lines, e.g. for differential transmission
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
    • B07B1/28—Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
    • B07B1/42—Drive mechanisms, regulating or controlling devices, or balancing devices, specially adapted for screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B13/00—Grading or sorting solid materials by dry methods, not otherwise provided for; Sorting articles otherwise than by indirectly controlled devices
    • B07B13/14—Details or accessories
    • B07B13/16—Feed or discharge arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/028—Arrangements specific to the transmitter end
    • H04L25/0282—Provision for current-mode coupling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0292—Arrangements specific to the receiver end
    • H04L25/0294—Provision for current-mode coupling
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/03—Shaping networks in transmitter or receiver, e.g. adaptive shaping networks
    • H04L25/03878—Line equalisers; line build-out devices

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Dc Digital Transmission (AREA)
  • Logic Circuits (AREA)
  • Amplifiers (AREA)
JP2006120683A 2005-04-26 2006-04-25 差動電流駆動方式の送受信機、及び送信システム Expired - Lifetime JP5506073B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050034614A KR100588752B1 (ko) 2005-04-26 2005-04-26 차동 전류 구동 방식의 전송 시스템
KR10-2005-0034614 2005-04-26

Publications (3)

Publication Number Publication Date
JP2006311551A JP2006311551A (ja) 2006-11-09
JP2006311551A5 JP2006311551A5 (enExample) 2009-06-18
JP5506073B2 true JP5506073B2 (ja) 2014-05-28

Family

ID=37182635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006120683A Expired - Lifetime JP5506073B2 (ja) 2005-04-26 2006-04-25 差動電流駆動方式の送受信機、及び送信システム

Country Status (5)

Country Link
US (1) US7605610B2 (enExample)
JP (1) JP5506073B2 (enExample)
KR (1) KR100588752B1 (enExample)
CN (1) CN100471185C (enExample)
TW (1) TWI363493B (enExample)

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* Cited by examiner, † Cited by third party
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KR100863127B1 (ko) * 2006-12-22 2008-10-15 매그나칩 반도체 유한회사 차동 전류 구동 방식의 데이터 전송 시스템
KR100971216B1 (ko) 2008-08-25 2010-07-20 주식회사 동부하이텍 디스플레이
KR100913528B1 (ko) * 2008-08-26 2009-08-21 주식회사 실리콘웍스 차동전류구동방식의 송신부, 차동전류구동방식의 수신부 및상기 송신부와 상기 수신부를 구비하는 차동전류구동방식의 인터페이스 시스템
US7800414B2 (en) 2008-09-12 2010-09-21 Magnachip Semiconductor Ltd. Differential current driving type data transmission system
KR101030957B1 (ko) 2008-12-29 2011-04-28 주식회사 실리콘웍스 차동전류 구동 방식의 인터페이스 시스템
KR101000289B1 (ko) 2008-12-29 2010-12-13 주식회사 실리콘웍스 차동전압구동방식의 송신부 및 차동전류구동방식과 차동전압구동방식을 선택적으로 적용할 수 있는 송신부와 수신부 및 인터페이스 시스템
US20120013361A1 (en) * 2009-02-24 2012-01-19 Rambus Inc Synthetic Pulse Generator for Reducing Supply Noise
CN101827043B (zh) * 2009-03-04 2013-11-06 联咏科技股份有限公司 最小化传输差分信号传输系统的信号检测方法及其装置
KR101642833B1 (ko) * 2010-02-05 2016-07-26 삼성전자주식회사 클럭 임베디드 인터페이스 방법, 그 방법을 이용하는 송수신기 및 디스플레이 장치
FR2984610A1 (fr) * 2011-12-16 2013-06-21 St Microelectronics Grenoble 2 Montage de photodiode a avalanche pour la detection de photons uniques
US8639193B2 (en) * 2011-12-29 2014-01-28 Qualcomm Incorporated Tri-state control for a line driver
JP2014039214A (ja) * 2012-08-20 2014-02-27 Lapis Semiconductor Co Ltd データ受信回路及び半導体装置
US8648640B1 (en) * 2012-10-22 2014-02-11 Realtek Semiconductor Corp. Method and apparatus for clock transmission
US10277268B2 (en) * 2017-06-02 2019-04-30 Psemi Corporation Method and apparatus for switching of shunt and through switches of a transceiver
WO2020056200A1 (en) * 2018-09-12 2020-03-19 Synaptics Incorporated Low-power differential data transmission systems and methods
US11757431B2 (en) 2021-12-29 2023-09-12 International Business Machines Corporation Current-mode signal path of an integrated radio frequency pulse generator

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JPH06197047A (ja) * 1992-12-25 1994-07-15 Hitachi Denshi Ltd 等化方式
US5493657A (en) 1993-06-21 1996-02-20 Apple Computer, Inc. High speed dominant mode bus for differential signals
US5444410A (en) 1993-06-30 1995-08-22 National Semiconductor Corporation Controlled-transitioni-time line driver
JPH0918329A (ja) 1995-07-03 1997-01-17 Oki Electric Ind Co Ltd 可変レベルシフタ及びマルチプライヤ
US5929659A (en) 1997-03-12 1999-07-27 Motorola, Inc. Circuit and process for sensing data
US5874837A (en) * 1997-04-28 1999-02-23 Pericom Semiconductor Corp. CMOS PECL driver with programmable current for varying voltage swings and termination types
US5977796A (en) 1997-06-26 1999-11-02 Lucent Technologies, Inc. Low voltage differential swing interconnect buffer circuit
JP2000031810A (ja) * 1998-07-10 2000-01-28 Fujitsu Ltd ドライバ回路
JP3587347B2 (ja) 1998-08-07 2004-11-10 松下電器産業株式会社 無線通信装置および無線通信装置における送信電力制御方法
JP3420735B2 (ja) * 1999-04-06 2003-06-30 松下電器産業株式会社 定電流出力回路
US6396329B1 (en) * 1999-10-19 2002-05-28 Rambus, Inc Method and apparatus for receiving high speed signals with low latency
DE20122739U1 (de) * 2000-01-06 2007-08-23 Rambus Inc., Los Altos Kommunikationsschnittstelle mit mehrstufiger niedriger Verzögerung
JP2004504771A (ja) * 2000-07-18 2004-02-12 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 消費電力が少ないディジタルインタフェース
KR100639202B1 (ko) * 2000-11-01 2006-10-31 주식회사 하이닉스반도체 씨모스 센스 앰프
TW545016B (en) 2001-03-21 2003-08-01 Realtek Semiconductor Corp Receiving device and method with the function of correcting baseline wander
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JP4026593B2 (ja) * 2003-12-25 2007-12-26 セイコーエプソン株式会社 受信装置
US7471110B2 (en) * 2005-03-23 2008-12-30 Qualcomm Incorporated Current mode interface for off-chip high speed communication
US20070096777A1 (en) * 2005-11-01 2007-05-03 Dacheng Zhou Differential driver

Also Published As

Publication number Publication date
US20060238037A1 (en) 2006-10-26
JP2006311551A (ja) 2006-11-09
TWI363493B (en) 2012-05-01
CN1855165A (zh) 2006-11-01
KR100588752B1 (ko) 2006-06-12
CN100471185C (zh) 2009-03-18
TW200642274A (en) 2006-12-01
US7605610B2 (en) 2009-10-20

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