JP5502788B2 - 浮上式塗布装置 - Google Patents

浮上式塗布装置 Download PDF

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Publication number
JP5502788B2
JP5502788B2 JP2011057627A JP2011057627A JP5502788B2 JP 5502788 B2 JP5502788 B2 JP 5502788B2 JP 2011057627 A JP2011057627 A JP 2011057627A JP 2011057627 A JP2011057627 A JP 2011057627A JP 5502788 B2 JP5502788 B2 JP 5502788B2
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JP
Japan
Prior art keywords
levitation
substrate
region
stage
height
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Active
Application number
JP2011057627A
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English (en)
Japanese (ja)
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JP2012195403A (ja
Inventor
寿史 稲益
文宏 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=46807336&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5502788(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011057627A priority Critical patent/JP5502788B2/ja
Priority to KR1020120026441A priority patent/KR101952444B1/ko
Priority to TW101108840A priority patent/TWI548465B/zh
Priority to CN201210071525.5A priority patent/CN102674699B/zh
Publication of JP2012195403A publication Critical patent/JP2012195403A/ja
Application granted granted Critical
Publication of JP5502788B2 publication Critical patent/JP5502788B2/ja
Active legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011057627A 2011-03-16 2011-03-16 浮上式塗布装置 Active JP5502788B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011057627A JP5502788B2 (ja) 2011-03-16 2011-03-16 浮上式塗布装置
KR1020120026441A KR101952444B1 (ko) 2011-03-16 2012-03-15 부상식 도포 장치
TW101108840A TWI548465B (zh) 2011-03-16 2012-03-15 浮上式塗佈裝置
CN201210071525.5A CN102674699B (zh) 2011-03-16 2012-03-16 浮起式涂敷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011057627A JP5502788B2 (ja) 2011-03-16 2011-03-16 浮上式塗布装置

Publications (2)

Publication Number Publication Date
JP2012195403A JP2012195403A (ja) 2012-10-11
JP5502788B2 true JP5502788B2 (ja) 2014-05-28

Family

ID=46807336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011057627A Active JP5502788B2 (ja) 2011-03-16 2011-03-16 浮上式塗布装置

Country Status (4)

Country Link
JP (1) JP5502788B2 (zh)
KR (1) KR101952444B1 (zh)
CN (1) CN102674699B (zh)
TW (1) TWI548465B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6518891B2 (ja) * 2014-08-01 2019-05-29 株式会社ブイ・テクノロジー 搬送装置
DE102018125682B4 (de) * 2018-10-16 2023-01-19 Asm Assembly Systems Gmbh & Co. Kg Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils
KR102689454B1 (ko) * 2018-11-28 2024-07-29 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6916833B2 (ja) * 2019-04-18 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
KR102268617B1 (ko) * 2019-10-16 2021-06-23 세메스 주식회사 기판 처리 장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4307872B2 (ja) * 2003-03-18 2009-08-05 オリンパス株式会社 基板検査装置
JP4305918B2 (ja) * 2004-01-30 2009-07-29 東京エレクトロン株式会社 浮上式基板搬送処理装置
JP4501713B2 (ja) * 2005-02-09 2010-07-14 シンフォニアテクノロジー株式会社 エア浮上搬送装置
JP2007008644A (ja) * 2005-06-29 2007-01-18 Ckd Corp 板状ワークの搬送装置
JP4673180B2 (ja) * 2005-10-13 2011-04-20 東京エレクトロン株式会社 塗布装置及び塗布方法
JP4318714B2 (ja) * 2006-11-28 2009-08-26 東京エレクトロン株式会社 塗布装置
JP2009018917A (ja) * 2007-07-12 2009-01-29 Tokyo Ohka Kogyo Co Ltd 塗布装置、基板の受け渡し方法及び塗布方法
JP4982292B2 (ja) * 2007-08-07 2012-07-25 東京応化工業株式会社 塗布装置及び塗布方法
JP4592787B2 (ja) * 2008-07-11 2010-12-08 東京エレクトロン株式会社 基板処理装置
JP4755233B2 (ja) * 2008-09-11 2011-08-24 東京エレクトロン株式会社 基板処理装置
JP4638931B2 (ja) * 2008-09-12 2011-02-23 東京エレクトロン株式会社 基板処理装置
JP4787872B2 (ja) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 基板搬送処理装置
JP5406852B2 (ja) * 2008-11-18 2014-02-05 オイレス工業株式会社 非接触搬送装置
JP2010232472A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板搬送装置および基板処理装置
JP5221508B2 (ja) * 2009-12-25 2013-06-26 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20120106612A (ko) 2012-09-26
TW201302320A (zh) 2013-01-16
KR101952444B9 (ko) 2022-06-24
CN102674699A (zh) 2012-09-19
CN102674699B (zh) 2015-07-29
TWI548465B (zh) 2016-09-11
JP2012195403A (ja) 2012-10-11
KR101952444B1 (ko) 2019-02-26

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