JP5501375B2 - ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 - Google Patents

ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 Download PDF

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Publication number
JP5501375B2
JP5501375B2 JP2011545461A JP2011545461A JP5501375B2 JP 5501375 B2 JP5501375 B2 JP 5501375B2 JP 2011545461 A JP2011545461 A JP 2011545461A JP 2011545461 A JP2011545461 A JP 2011545461A JP 5501375 B2 JP5501375 B2 JP 5501375B2
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Prior art keywords
electrical
end effector
shaft
support
robot
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Japanese (ja)
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JP2012514544A (ja
JP2012514544A5 (https=
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ウィリアム， ピー． レスキー，
イザ クレーマーマン，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0025—Means for supplying energy to the end effector
    • B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20311—Robotic arm including power cable or connector

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011545461A 2009-01-11 2010-01-08 ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 Active JP5501375B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14380909P 2009-01-11 2009-01-11
US61/143,809 2009-01-11
PCT/US2010/020510 WO2010081009A2 (en) 2009-01-11 2010-01-08 Systems, apparatus and methods for making an electrical connection to a robot and electrical end effector thereof

Publications (3)

Publication Number Publication Date
JP2012514544A JP2012514544A (ja) 2012-06-28
JP2012514544A5 JP2012514544A5 (https=) 2013-09-12
JP5501375B2 true JP5501375B2 (ja) 2014-05-21

Family

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Family Applications (1)

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JP2011545461A Active JP5501375B2 (ja) 2009-01-11 2010-01-08 ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法

Country Status (6)

Country Link
US (2) US8264187B2 (https=)
JP (1) JP5501375B2 (https=)
KR (1) KR101287000B1 (https=)
CN (1) CN102349146B (https=)
TW (1) TWI405649B (https=)
WO (1) WO2010081009A2 (https=)

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TWI824515B (zh) * 2021-06-25 2023-12-01 南韓商Ｔ Ｒｏｂｏｔｉｃｓ股份有限公司 用於使基板傳送機器人在真空室內部移動的行走機器人

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Publication number Publication date
US8692500B2 (en) 2014-04-08
TW201032971A (en) 2010-09-16
US20100178135A1 (en) 2010-07-15
WO2010081009A3 (en) 2010-10-14
JP2012514544A (ja) 2012-06-28
CN102349146B (zh) 2013-09-18
US20120321434A1 (en) 2012-12-20
TWI405649B (zh) 2013-08-21
WO2010081009A2 (en) 2010-07-15
US8264187B2 (en) 2012-09-11
KR101287000B1 (ko) 2013-07-23
CN102349146A (zh) 2012-02-08
KR20110104991A (ko) 2011-09-23

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