TWI405649B - 用於製造至機器人及其電端效器的電連接之系統、設備及方法 - Google Patents

用於製造至機器人及其電端效器的電連接之系統、設備及方法 Download PDF

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Publication number
TWI405649B
TWI405649B TW099100593A TW99100593A TWI405649B TW I405649 B TWI405649 B TW I405649B TW 099100593 A TW099100593 A TW 099100593A TW 99100593 A TW99100593 A TW 99100593A TW I405649 B TWI405649 B TW I405649B
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TW
Taiwan
Prior art keywords
electrical
end effector
contacts
substrate
robot
Prior art date
Application number
TW099100593A
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English (en)
Chinese (zh)
Other versions
TW201032971A (en
Inventor
萊斯基威廉Ｐ
克瑞摩曼易茲亞
Original Assignee
應用材料股份有限公司
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Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201032971A publication Critical patent/TW201032971A/zh
Application granted granted Critical
Publication of TWI405649B publication Critical patent/TWI405649B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/0025—Means for supplying energy to the end effector
    • B25J19/0029—Means for supplying energy to the end effector arranged within the different robot elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20311—Robotic arm including power cable or connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099100593A 2009-01-11 2010-01-11 用於製造至機器人及其電端效器的電連接之系統、設備及方法 TWI405649B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14380909P 2009-01-11 2009-01-11

Publications (2)

Publication Number Publication Date
TW201032971A TW201032971A (en) 2010-09-16
TWI405649B true TWI405649B (zh) 2013-08-21

Family

ID=42317166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099100593A TWI405649B (zh) 2009-01-11 2010-01-11 用於製造至機器人及其電端效器的電連接之系統、設備及方法

Country Status (6)

Country Link
US (2) US8264187B2 (https=)
JP (1) JP5501375B2 (https=)
KR (1) KR101287000B1 (https=)
CN (1) CN102349146B (https=)
TW (1) TWI405649B (https=)
WO (1) WO2010081009A2 (https=)

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CN103547089A (zh) * 2012-07-09 2014-01-29 鸿富锦精密工业（深圳）有限公司 机柜

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Also Published As

Publication number Publication date
US8692500B2 (en) 2014-04-08
JP5501375B2 (ja) 2014-05-21
TW201032971A (en) 2010-09-16
US20100178135A1 (en) 2010-07-15
WO2010081009A3 (en) 2010-10-14
JP2012514544A (ja) 2012-06-28
CN102349146B (zh) 2013-09-18
US20120321434A1 (en) 2012-12-20
WO2010081009A2 (en) 2010-07-15
US8264187B2 (en) 2012-09-11
KR101287000B1 (ko) 2013-07-23
CN102349146A (zh) 2012-02-08
KR20110104991A (ko) 2011-09-23

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