JP5500073B2 - 金属膜付きフィルム - Google Patents

金属膜付きフィルム Download PDF

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Publication number
JP5500073B2
JP5500073B2 JP2010526775A JP2010526775A JP5500073B2 JP 5500073 B2 JP5500073 B2 JP 5500073B2 JP 2010526775 A JP2010526775 A JP 2010526775A JP 2010526775 A JP2010526775 A JP 2010526775A JP 5500073 B2 JP5500073 B2 JP 5500073B2
Authority
JP
Japan
Prior art keywords
layer
metal film
film
resin composition
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010526775A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2010024368A1 (ja
Inventor
弘久 奈良橋
茂雄 中村
栄一 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2010526775A priority Critical patent/JP5500073B2/ja
Publication of JPWO2010024368A1 publication Critical patent/JPWO2010024368A1/ja
Application granted granted Critical
Publication of JP5500073B2 publication Critical patent/JP5500073B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0358Resin coated copper [RCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2010526775A 2008-08-29 2009-08-28 金属膜付きフィルム Active JP5500073B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010526775A JP5500073B2 (ja) 2008-08-29 2009-08-28 金属膜付きフィルム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008222729 2008-08-29
JP2008222729 2008-08-29
JP2010526775A JP5500073B2 (ja) 2008-08-29 2009-08-28 金属膜付きフィルム
PCT/JP2009/065029 WO2010024368A1 (ja) 2008-08-29 2009-08-28 金属膜付きフィルム

Publications (2)

Publication Number Publication Date
JPWO2010024368A1 JPWO2010024368A1 (ja) 2012-01-26
JP5500073B2 true JP5500073B2 (ja) 2014-05-21

Family

ID=41721531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010526775A Active JP5500073B2 (ja) 2008-08-29 2009-08-28 金属膜付きフィルム

Country Status (3)

Country Link
JP (1) JP5500073B2 (zh)
TW (1) TWI468285B (zh)
WO (1) WO2010024368A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013140856A (ja) * 2011-12-28 2013-07-18 Jx Nippon Mining & Metals Corp キャリア付金属箔
JP6069749B2 (ja) * 2013-12-02 2017-02-01 東レKpフィルム株式会社 離型フィルム付銅箔

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001053420A (ja) * 1999-08-12 2001-02-23 Reiko Co Ltd プリント配線板用転写フイルムとそれを使用して得るプリント配線板及びその製造方法
JP2003234240A (ja) * 2002-02-06 2003-08-22 Toyo Metallizing Co Ltd 電子部品用金属膜転写フィルム
JP2004082511A (ja) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd 離型用フィルムを用いたプリント基板のプレス加工方法
JP2004230729A (ja) * 2003-01-30 2004-08-19 Mitsubishi Plastics Ind Ltd 金属薄膜転写用フィルム
JP2008001034A (ja) * 2006-06-23 2008-01-10 Panac Co Ltd 金属蒸着層転写フィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001053420A (ja) * 1999-08-12 2001-02-23 Reiko Co Ltd プリント配線板用転写フイルムとそれを使用して得るプリント配線板及びその製造方法
JP2003234240A (ja) * 2002-02-06 2003-08-22 Toyo Metallizing Co Ltd 電子部品用金属膜転写フィルム
JP2004082511A (ja) * 2002-08-27 2004-03-18 Mitsubishi Plastics Ind Ltd 離型用フィルムを用いたプリント基板のプレス加工方法
JP2004230729A (ja) * 2003-01-30 2004-08-19 Mitsubishi Plastics Ind Ltd 金属薄膜転写用フィルム
JP2008001034A (ja) * 2006-06-23 2008-01-10 Panac Co Ltd 金属蒸着層転写フィルム

Also Published As

Publication number Publication date
WO2010024368A1 (ja) 2010-03-04
TW201022027A (en) 2010-06-16
TWI468285B (zh) 2015-01-11
JPWO2010024368A1 (ja) 2012-01-26

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