JP5496541B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5496541B2
JP5496541B2 JP2009102278A JP2009102278A JP5496541B2 JP 5496541 B2 JP5496541 B2 JP 5496541B2 JP 2009102278 A JP2009102278 A JP 2009102278A JP 2009102278 A JP2009102278 A JP 2009102278A JP 5496541 B2 JP5496541 B2 JP 5496541B2
Authority
JP
Japan
Prior art keywords
inductor
circuit
semiconductor device
wiring layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009102278A
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English (en)
Japanese (ja)
Other versions
JP2010251663A (ja
JP2010251663A5 (https=
Inventor
康隆 中柴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2009102278A priority Critical patent/JP5496541B2/ja
Priority to US12/662,442 priority patent/US8310025B2/en
Publication of JP2010251663A publication Critical patent/JP2010251663A/ja
Publication of JP2010251663A5 publication Critical patent/JP2010251663A5/ja
Priority to US13/667,955 priority patent/US8810042B2/en
Application granted granted Critical
Publication of JP5496541B2 publication Critical patent/JP5496541B2/ja
Priority to US14/328,458 priority patent/US9496220B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling

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  • Semiconductor Integrated Circuits (AREA)
JP2009102278A 2009-04-20 2009-04-20 半導体装置 Expired - Fee Related JP5496541B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009102278A JP5496541B2 (ja) 2009-04-20 2009-04-20 半導体装置
US12/662,442 US8310025B2 (en) 2009-04-20 2010-04-16 Semiconductor device
US13/667,955 US8810042B2 (en) 2009-04-20 2012-11-02 Semiconductor device
US14/328,458 US9496220B2 (en) 2009-04-20 2014-07-10 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009102278A JP5496541B2 (ja) 2009-04-20 2009-04-20 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014042515A Division JP5749366B2 (ja) 2014-03-05 2014-03-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2010251663A JP2010251663A (ja) 2010-11-04
JP2010251663A5 JP2010251663A5 (https=) 2012-06-07
JP5496541B2 true JP5496541B2 (ja) 2014-05-21

Family

ID=42980368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009102278A Expired - Fee Related JP5496541B2 (ja) 2009-04-20 2009-04-20 半導体装置

Country Status (2)

Country Link
US (3) US8310025B2 (https=)
JP (1) JP5496541B2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5578797B2 (ja) * 2009-03-13 2014-08-27 ルネサスエレクトロニクス株式会社 半導体装置
IT1404038B1 (it) * 2010-12-29 2013-11-08 St Microelectronics Srl Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio
US9337905B2 (en) 2013-07-01 2016-05-10 Texas Instruments Incorporated Inductive structures with reduced emissions and interference
US20150077208A1 (en) * 2013-09-16 2015-03-19 Ken Goldman High-q parallel-trace planar spiral coil for biomedical implants
JP6395304B2 (ja) * 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
JP6160712B2 (ja) * 2014-01-15 2017-07-12 株式会社村田製作所 電気回路
US9997495B2 (en) * 2014-12-19 2018-06-12 Elwha Llc Non-contacting inductive interconnects
JP6449439B2 (ja) * 2015-03-30 2019-01-09 株式会社ＰＥＺＹ Ｃｏｍｐｕｔｉｎｇ 半導体装置
CN107924869B (zh) 2015-07-16 2022-01-25 超极存储器股份有限公司 半导体元件及其制造方法
JP6390824B1 (ja) * 2016-12-02 2018-09-19 株式会社村田製作所 補助アンテナ、ｒｆｉｄシステム、及びｒｆｉｄタグの読み取り方法
US10438906B2 (en) * 2016-12-07 2019-10-08 Nxp Usa, Inc. Radio frequency (RF) inductive signal coupler and method therefor
JP7038570B2 (ja) * 2018-03-02 2022-03-18 ルネサスエレクトロニクス株式会社 半導体装置
JP7437275B2 (ja) 2020-09-09 2024-02-22 株式会社東芝 電子デバイス
JP7686394B2 (ja) * 2020-12-24 2025-06-02 ローム株式会社 ゲートドライバ
JP7638183B2 (ja) * 2021-09-02 2025-03-03 ルネサスエレクトロニクス株式会社 半導体装置
JP2023046880A (ja) * 2021-09-24 2023-04-05 株式会社東芝 半導体装置
JP7775167B2 (ja) * 2022-09-12 2025-11-25 株式会社東芝 アイソレータ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952849A (en) * 1997-02-21 1999-09-14 Analog Devices, Inc. Logic isolator with high transient immunity
US6201287B1 (en) * 1998-10-26 2001-03-13 Micron Technology, Inc. Monolithic inductance-enhancing integrated circuits, complementary metal oxide semiconductor (CMOS) inductance-enhancing integrated circuits, inductor assemblies, and inductance-multiplying methods
US6882239B2 (en) 2001-05-08 2005-04-19 Formfactor, Inc. Electromagnetically coupled interconnect system
JP2004039867A (ja) * 2002-07-03 2004-02-05 Sony Corp 多層配線回路モジュール及びその製造方法
JP2005327931A (ja) 2004-05-14 2005-11-24 Sony Corp 集積化インダクタおよびそれを用いた受信回路
JP2008502215A (ja) * 2004-06-03 2008-01-24 シリコン・ラボラトリーズ・インコーポレイテッド スペクトル拡散アイソレータ
JP4639857B2 (ja) 2005-03-07 2011-02-23 富士ゼロックス株式会社 Ｒｆｉｄタグが取り付けられた物品を収納する収納箱、その配置方法、通信方法、通信確認方法および包装構造。
JP4544181B2 (ja) * 2006-03-03 2010-09-15 セイコーエプソン株式会社 電子基板、半導体装置および電子機器
JP5070511B2 (ja) 2006-10-27 2012-11-14 シャープ株式会社 インダクタ対の磁気結合を利用したシリアルデータ伝送装置
JP5433199B2 (ja) 2008-10-21 2014-03-05 学校法人慶應義塾 電子回路

Also Published As

Publication number Publication date
US20100264515A1 (en) 2010-10-21
US9496220B2 (en) 2016-11-15
US20140319691A1 (en) 2014-10-30
US8810042B2 (en) 2014-08-19
US8310025B2 (en) 2012-11-13
JP2010251663A (ja) 2010-11-04
US20130056849A1 (en) 2013-03-07

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