JP5489855B2 - 固体撮像装置の製造方法 - Google Patents

固体撮像装置の製造方法 Download PDF

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Publication number
JP5489855B2
JP5489855B2 JP2010112667A JP2010112667A JP5489855B2 JP 5489855 B2 JP5489855 B2 JP 5489855B2 JP 2010112667 A JP2010112667 A JP 2010112667A JP 2010112667 A JP2010112667 A JP 2010112667A JP 5489855 B2 JP5489855 B2 JP 5489855B2
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Japan
Prior art keywords
ion implantation
implantation step
state imaging
manufacturing
solid
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Expired - Fee Related
Application number
JP2010112667A
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English (en)
Japanese (ja)
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JP2011243665A (ja
JP2011243665A5 (enExample
Inventor
高典 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010112667A priority Critical patent/JP5489855B2/ja
Priority to US13/088,465 priority patent/US8383497B2/en
Priority to CN201110119054.6A priority patent/CN102244084B/zh
Publication of JP2011243665A publication Critical patent/JP2011243665A/ja
Publication of JP2011243665A5 publication Critical patent/JP2011243665A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2010112667A 2010-05-14 2010-05-14 固体撮像装置の製造方法 Expired - Fee Related JP5489855B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010112667A JP5489855B2 (ja) 2010-05-14 2010-05-14 固体撮像装置の製造方法
US13/088,465 US8383497B2 (en) 2010-05-14 2011-04-18 Method for manufacturing solid-state image sensor
CN201110119054.6A CN102244084B (zh) 2010-05-14 2011-05-10 固态图像传感器的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010112667A JP5489855B2 (ja) 2010-05-14 2010-05-14 固体撮像装置の製造方法

Publications (3)

Publication Number Publication Date
JP2011243665A JP2011243665A (ja) 2011-12-01
JP2011243665A5 JP2011243665A5 (enExample) 2013-04-18
JP5489855B2 true JP5489855B2 (ja) 2014-05-14

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Family Applications (1)

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JP2010112667A Expired - Fee Related JP5489855B2 (ja) 2010-05-14 2010-05-14 固体撮像装置の製造方法

Country Status (3)

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US (1) US8383497B2 (enExample)
JP (1) JP5489855B2 (enExample)
CN (1) CN102244084B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010206174A (ja) 2009-02-06 2010-09-16 Canon Inc 光電変換装置およびその製造方法ならびにカメラ
JP6178975B2 (ja) * 2013-04-25 2017-08-16 パナソニックＩｐマネジメント株式会社 固体撮像装置
US20160071892A1 (en) * 2014-09-05 2016-03-10 Omnivision Technologies, Inc. Dopant configuration in image sensor pixels
JP6650668B2 (ja) * 2014-12-16 2020-02-19 キヤノン株式会社 固体撮像装置
US9391081B1 (en) 2015-09-08 2016-07-12 Sandisk Technologies Llc Metal indentation to increase inter-metal breakdown voltage
JP6915608B2 (ja) * 2016-03-29 2021-08-04 ソニーグループ株式会社 固体撮像装置、及び電子機器
JPWO2018034092A1 (ja) * 2016-08-18 2019-06-13 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、固体撮像素子の製造方法、及び、電子機器
JP7576928B2 (ja) * 2020-05-08 2024-11-01 浜松ホトニクス株式会社 光検出装置、及び光センサの駆動方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69312636T2 (de) 1992-11-09 1998-02-05 Canon Kk Anodisierungsapparat mit einer Trägervorrichtung für das zu behandelnde Substrat
JP4216935B2 (ja) 1998-11-20 2009-01-28 富士フイルム株式会社 半導体装置の製造方法
US6969631B2 (en) * 2003-06-16 2005-11-29 Micron Technology, Inc. Method of forming photodiode with self-aligned implants for high quantum efficiency
US7323731B2 (en) 2003-12-12 2008-01-29 Canon Kabushiki Kaisha Photoelectric conversion device, method of manufacturing photoelectric conversion device, and image pickup system
JP2005327835A (ja) 2004-05-13 2005-11-24 Sony Corp 固体撮像装置および固体撮像装置の製造方法
JP4313789B2 (ja) * 2005-07-29 2009-08-12 富士通マイクロエレクトロニクス株式会社 半導体撮像装置およびその製造方法
KR100703987B1 (ko) 2006-05-17 2007-04-09 삼성전자주식회사 이미지 센서의 제조 방법 및 그에 의해 제조된 이미지 센서
JP5215589B2 (ja) 2007-05-11 2013-06-19 キヤノン株式会社 絶縁ゲート型トランジスタ及び表示装置
JP5103118B2 (ja) * 2007-09-27 2012-12-19 オンセミコンダクター・トレーディング・リミテッド 半導体ウエハおよびその製造方法
JP5538922B2 (ja) 2009-02-06 2014-07-02 キヤノン株式会社 固体撮像装置の製造方法
JP5451098B2 (ja) 2009-02-06 2014-03-26 キヤノン株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2011243665A (ja) 2011-12-01
US8383497B2 (en) 2013-02-26
US20110281392A1 (en) 2011-11-17
CN102244084B (zh) 2014-02-05
CN102244084A (zh) 2011-11-16

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