JP5470690B2 - ベアチップの実装構造 - Google Patents
ベアチップの実装構造 Download PDFInfo
- Publication number
- JP5470690B2 JP5470690B2 JP2007229375A JP2007229375A JP5470690B2 JP 5470690 B2 JP5470690 B2 JP 5470690B2 JP 2007229375 A JP2007229375 A JP 2007229375A JP 2007229375 A JP2007229375 A JP 2007229375A JP 5470690 B2 JP5470690 B2 JP 5470690B2
- Authority
- JP
- Japan
- Prior art keywords
- bare chip
- mounting structure
- resin case
- bare
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Description
請求項3に記載のように、前記リブの上面と前記ベアチップの下面の間に存在する前記シリコーン系接着剤の厚さは、0.02mm以下であることが好ましい。これによって、上記したリブの上面に介在するシリコーン系接着剤の超音波振動が印加されたベアチップ
に対する揺れ抵抗力を、十分に高めることができる。
14,15 ベアチップ
P,Pc,Pe パッド
23〜26,23a,23b,24a 樹脂ケース
L,La〜Ld リブ
MT1〜MT4 シリコーン系接着剤の溜め込み溝
HP1,HP2 パッドの直下の平面
MS1,MS2 ベアチップの収容溝
KS1,KS2 ベアチップの収容壁
50,50s シリコーン系接着剤
51 接着剤
W ボンディングワイヤ
Claims (5)
- 半導体からなるベアチップが、シリコーン系接着剤を介して、樹脂ケース上に搭載され、
前記ベアチップの表面に露出するパッドに、ワイヤボンディングが施されてなるベアチップの実装構造であって、
前記樹脂ケース上に、前記ワイヤボンディングにおいて前記ベアチップの揺れを抑制する、揺れ制限機構が設けられ、
前記揺れ制限機構が、
前記樹脂ケース上における前記ベアチップの搭載位置において、前記パッドの直下に掛かるようにして、平面から突き出て形成されたリブからなり、
前記リブが、
一つの前記パッドの直下に、複数本掛かるように配置されてなり、
前記シリコーン系接着剤を、前記パッドの直下における前記ベアチップと前記樹脂ケースの間に介在させ、
前記ワイヤボンディング時において、前記複数本のリブの上面および複数本のリブの間に介在する前記シリコーン系接着剤の超音波振動が印加された前記ベアチップに対する揺れ抵抗力を高めるように構成されてなることを特徴とするベアチップの実装構造。 - 前記シリコーン系接着剤を、上面視において前記ベアチップの外周からはみ出るようにして、該ベアチップと前記樹脂ケースの間に介在させることを特徴とする請求項1に記載のベアチップの実装構造。
- 前記リブの上面と前記ベアチップの下面の間に存在する前記シリコーン系接着剤の厚さが、0.02mm以下であることを特徴とする請求項1又は請求項2に記載のベアチップの実装構造。
- 前記ベアチップが、磁気検出素子が形成されてなるベアチップであり、
前記樹脂ケースが、ケース本体における舌状保持部であり、
前記ベアチップの実装構造が、
回転体の回転に伴うバイアス磁界の変化を、前記ベアチップにより測定し、前記回転体の回転状態を検出する回転検出装置において、
前記ベアチップの前記舌状保持部への搭載に用いられることを特徴とする請求項1乃至3のいずれか一項に記載のベアチップの実装構造。 - 前記回転検出装置が、車載用であることを特徴とする請求項4に記載のベアチップの実装構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007229375A JP5470690B2 (ja) | 2007-09-04 | 2007-09-04 | ベアチップの実装構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007229375A JP5470690B2 (ja) | 2007-09-04 | 2007-09-04 | ベアチップの実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009064835A JP2009064835A (ja) | 2009-03-26 |
JP5470690B2 true JP5470690B2 (ja) | 2014-04-16 |
Family
ID=40559197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007229375A Expired - Fee Related JP5470690B2 (ja) | 2007-09-04 | 2007-09-04 | ベアチップの実装構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5470690B2 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02125628A (ja) * | 1988-11-04 | 1990-05-14 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH04123441A (ja) * | 1990-09-14 | 1992-04-23 | Hitachi Ltd | 半導体集積回路装置 |
JPH09264800A (ja) * | 1996-03-27 | 1997-10-07 | Omron Corp | 半導体式力学量センサ |
JP3811120B2 (ja) * | 2002-11-08 | 2006-08-16 | 株式会社巴川製紙所 | 半導体装置用接着テープ |
JP2005033496A (ja) * | 2003-07-11 | 2005-02-03 | Seiko Epson Corp | 圧電デバイス |
JP4232771B2 (ja) * | 2005-09-30 | 2009-03-04 | 株式会社デンソー | 回転検出装置 |
JP2007154099A (ja) * | 2005-12-07 | 2007-06-21 | Momentive Performance Materials Japan Kk | シリコーンゴム接着剤組成物及びそれを用いた半導体装置 |
JP2008192660A (ja) * | 2007-02-01 | 2008-08-21 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
-
2007
- 2007-09-04 JP JP2007229375A patent/JP5470690B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009064835A (ja) | 2009-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4988844B2 (ja) | 回路モジュール | |
KR101735579B1 (ko) | 자이로스코픽 센서 | |
JP4720528B2 (ja) | 角速度センサ装置 | |
JP4835058B2 (ja) | センサパッケージ | |
US7775708B2 (en) | Device for thermal coupling | |
JP2004361308A (ja) | 物理量検出装置および物理量検出手段格納ケース | |
JP6470311B2 (ja) | Sawデバイスおよびsawデバイスの製造方法 | |
JP2010071724A (ja) | 樹脂モールド半導体センサ及び製造方法 | |
JP5470690B2 (ja) | ベアチップの実装構造 | |
EP2004543A2 (en) | Mems device package with thermally compliant insert | |
US9123883B2 (en) | Vibration device | |
KR101133886B1 (ko) | 온도센서 조립체 | |
JP2013102410A (ja) | 超音波センサ | |
JP4497219B2 (ja) | 圧力センサおよびその製造方法 | |
TW201132259A (en) | Coupling device, assembly having a coupling device, and method for producing an assembly having a coupling device | |
CN106898588B (zh) | 半导体模块 | |
JP5428512B2 (ja) | 半導体装置 | |
JPH07249734A (ja) | 大電力用半導体装置 | |
JP5272778B2 (ja) | センサ部品 | |
JP7352797B2 (ja) | センサ装置及びセンサ | |
JPWO2007020700A1 (ja) | 加速度センサ装置およびセンサ装置 | |
JP5110567B2 (ja) | 樹脂製中空パッケージ | |
JP4003656B2 (ja) | 半導体装置 | |
JP3087307U (ja) | 加速度センサ | |
JP2008180603A (ja) | 回転検出装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090609 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100121 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120403 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120529 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130307 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140120 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 5470690 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |