JP5428512B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5428512B2 JP5428512B2 JP2009116755A JP2009116755A JP5428512B2 JP 5428512 B2 JP5428512 B2 JP 5428512B2 JP 2009116755 A JP2009116755 A JP 2009116755A JP 2009116755 A JP2009116755 A JP 2009116755A JP 5428512 B2 JP5428512 B2 JP 5428512B2
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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Description
図1は実施形態1の半導体装置の全体斜視図、図2は図1の半導体装置において、ケースと蓋を分離した状態の半導体装置の全体斜視図、図3は図1のA−A線断面図、図4は図1の半導体装置において、ケース内に設けられた半導体素子と導体を接続するボンディングワイヤの配索方向を示す図である。
図5はワイヤ配索高さの低いボンディングワイヤのワイヤ径を太くした実施形態2のボンディングワイヤの斜視図である。
図6はゲル状充填材中央領域に相当する部位に配索されたボンディングワイヤのワイヤ径を太くした実施形態3を示す図、図7は図6のB−B線断面図である。
図8はゲル状充填材のうち略中央領域に相当する部位を除いてボンディングワイヤを配索した実施形態4を示す図である。
2…回路基板
3…半導体素子
4…絶縁体
5…導体
6(6a,6b,6c)…ボンディングワイヤ
7…ケース
8…ゲル状充填材
9…放熱板
10…蓋
Claims (4)
- 回路基板上に搭載された半導体素子と、
前記回路基板上に絶縁体を介して積層された導体と、
前記半導体素子と前記導体とを電気的に繋ぐボンディングワイヤと、
前記回路基板を内部に収容するように該回路基板の周囲に取り付けられたケースと、
前記ケース内に充填されて少なくとも前記半導体素子と前記ボンディングワイヤを保護するゲル状充填材と、を備えた半導体装置であって、
前記半導体装置に発生する振動方向と前記ゲル状充填材の短手方向を一致させて前記ゲル状充填材を前記ケース内に充填すると共に、前記ゲル状充填材の長手方向を前記ボンディングワイヤの配索方向に一致させた
ことを特徴とする半導体装置。 - 請求項1に記載の半導体装置であって、
前記ボンディングワイヤは複数あり、複数のボンディングワイヤの配索高さが異なり、配索高さの高い側のボンディングワイヤのワイヤ径に比べて配索高さの低い側のボンディングワイヤのワイヤ径を太くした
ことを特徴とする半導体装置。 - 請求項1又は請求項2に記載の半導体装置であって、
前記ゲル状充填材のうち略中央領域に相当する部位に配索された前記ボンディングワイヤのワイヤ径を、それ以外の領域に相当する部位に配索されたボンディングワイヤのワイヤ径よりも太くした
ことを特徴とする半導体装置。 - 請求項1又は請求項2に記載の半導体装置であって、
前記ゲル状充填材のうち略中央領域に相当する部位を除く領域に前記ボンディングワイヤを配索した
ことを特徴とする半導体装置。
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JP2009116755A JP5428512B2 (ja) | 2009-05-13 | 2009-05-13 | 半導体装置 |
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JP2009116755A JP5428512B2 (ja) | 2009-05-13 | 2009-05-13 | 半導体装置 |
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JP2010267727A JP2010267727A (ja) | 2010-11-25 |
JP5428512B2 true JP5428512B2 (ja) | 2014-02-26 |
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Families Citing this family (2)
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WO2014097798A1 (ja) * | 2012-12-18 | 2014-06-26 | 富士電機株式会社 | 半導体装置 |
JP6468984B2 (ja) | 2015-10-22 | 2019-02-13 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2645852B2 (ja) * | 1988-04-15 | 1997-08-25 | 株式会社日立製作所 | 電子装置 |
JPH07263621A (ja) * | 1994-03-18 | 1995-10-13 | Toshiba Corp | 半導体装置 |
JP3660854B2 (ja) * | 2000-04-13 | 2005-06-15 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
JP5131812B2 (ja) * | 2007-02-07 | 2013-01-30 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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