JP5466815B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5466815B2
JP5466815B2 JP2007086902A JP2007086902A JP5466815B2 JP 5466815 B2 JP5466815 B2 JP 5466815B2 JP 2007086902 A JP2007086902 A JP 2007086902A JP 2007086902 A JP2007086902 A JP 2007086902A JP 5466815 B2 JP5466815 B2 JP 5466815B2
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JP
Japan
Prior art keywords
layer
insulating layer
semiconductor
charge storage
insulating
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Expired - Fee Related
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JP2007086902A
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English (en)
Japanese (ja)
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JP2007294935A5 (https=
JP2007294935A (ja
Inventor
圭恵 高野
誠 古野
良信 浅見
舜平 山崎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2007086902A priority Critical patent/JP5466815B2/ja
Publication of JP2007294935A publication Critical patent/JP2007294935A/ja
Publication of JP2007294935A5 publication Critical patent/JP2007294935A5/ja
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Publication of JP5466815B2 publication Critical patent/JP5466815B2/ja
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JP2007086902A 2006-03-31 2007-03-29 半導体装置 Expired - Fee Related JP5466815B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007086902A JP5466815B2 (ja) 2006-03-31 2007-03-29 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006101052 2006-03-31
JP2006101052 2006-03-31
JP2007086902A JP5466815B2 (ja) 2006-03-31 2007-03-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2007294935A JP2007294935A (ja) 2007-11-08
JP2007294935A5 JP2007294935A5 (https=) 2010-04-22
JP5466815B2 true JP5466815B2 (ja) 2014-04-09

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ID=38765183

Family Applications (1)

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JP2007086902A Expired - Fee Related JP5466815B2 (ja) 2006-03-31 2007-03-29 半導体装置

Country Status (1)

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JP (1) JP5466815B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206355A (ja) * 2008-02-28 2009-09-10 Toshiba Corp 不揮発性半導体メモリ及び不揮発性半導体メモリの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2656986B2 (ja) * 1989-10-02 1997-09-24 松下電子工業株式会社 不揮発性半導体記憶装置の製造方法
JP4538693B2 (ja) * 1998-01-26 2010-09-08 ソニー株式会社 メモリ素子およびその製造方法
JP2001085545A (ja) * 1999-09-16 2001-03-30 Sony Corp メモリ素子の製造方法
JP3594550B2 (ja) * 2000-11-27 2004-12-02 シャープ株式会社 半導体装置の製造方法
JP4472934B2 (ja) * 2002-03-27 2010-06-02 イノテック株式会社 半導体装置および半導体メモリ
JP5046464B2 (ja) * 2002-12-18 2012-10-10 株式会社半導体エネルギー研究所 半導体記憶素子の作製方法
US20050095786A1 (en) * 2003-11-03 2005-05-05 Ting-Chang Chang Non-volatile memory and method of manufacturing floating gate
JP5072196B2 (ja) * 2004-06-14 2012-11-14 株式会社半導体エネルギー研究所 半導体装置の作製方法

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JP2007294935A (ja) 2007-11-08

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