JP5449688B2 - 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 - Google Patents
光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 Download PDFInfo
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- JP5449688B2 JP5449688B2 JP2008080449A JP2008080449A JP5449688B2 JP 5449688 B2 JP5449688 B2 JP 5449688B2 JP 2008080449 A JP2008080449 A JP 2008080449A JP 2008080449 A JP2008080449 A JP 2008080449A JP 5449688 B2 JP5449688 B2 JP 5449688B2
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
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- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 description 1
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- LJFWQNJLLOFIJK-UHFFFAOYSA-N solvent violet 13 Chemical compound C1=CC(C)=CC=C1NC1=CC=C(O)C2=C1C(=O)C1=CC=CC=C1C2=O LJFWQNJLLOFIJK-UHFFFAOYSA-N 0.000 description 1
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- 239000002562 thickening agent Substances 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/08—Cellulose derivatives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008080449A JP5449688B2 (ja) | 2008-03-26 | 2008-03-26 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| KR1020090025314A KR101010103B1 (ko) | 2008-03-26 | 2009-03-25 | 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판 |
| CN2009101323080A CN101544784B (zh) | 2008-03-26 | 2009-03-25 | 光固化性树脂组合物、其干膜和固化物以及使用这些的印刷电路板 |
| TW098109930A TWI391782B (zh) | 2008-03-26 | 2009-03-26 | A photohardenable resin composition, a dry film and a cured product thereof, and a printed circuit board using them |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008080449A JP5449688B2 (ja) | 2008-03-26 | 2008-03-26 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009237057A JP2009237057A (ja) | 2009-10-15 |
| JP5449688B2 true JP5449688B2 (ja) | 2014-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2008080449A Active JP5449688B2 (ja) | 2008-03-26 | 2008-03-26 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Country Status (4)
| Country | Link |
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| JP (1) | JP5449688B2 (zh) |
| KR (1) | KR101010103B1 (zh) |
| CN (1) | CN101544784B (zh) |
| TW (1) | TWI391782B (zh) |
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| JP5449729B2 (ja) * | 2008-09-29 | 2014-03-19 | 三洋化成工業株式会社 | 感光性樹脂組成物 |
| KR20100099048A (ko) * | 2009-03-02 | 2010-09-10 | 주식회사 동진쎄미켐 | 감광성 수지 조성물 |
| JP5422427B2 (ja) * | 2010-02-08 | 2014-02-19 | 太陽ホールディングス株式会社 | 積層構造体及びそれに用いる感光性ドライフィルム |
| JP5661293B2 (ja) * | 2010-02-08 | 2015-01-28 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 |
| JP5308398B2 (ja) * | 2010-05-11 | 2013-10-09 | 日東電工株式会社 | 光導波路形成用樹脂組成物およびそれを用いた光導波路 |
| CN102375339B (zh) * | 2010-08-20 | 2013-06-12 | 太阳油墨（苏州）有限公司 | 碱显影型感光性树脂组合物 |
| KR20160003294A (ko) * | 2010-12-28 | 2016-01-08 | 다이요 잉키 세이조 가부시키가이샤 | 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판 |
| JP5854600B2 (ja) * | 2010-12-28 | 2016-02-09 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物 |
| CN104334604A (zh) * | 2012-05-17 | 2015-02-04 | 太阳油墨制造株式会社 | 碱显影型的热固化性树脂组合物、印刷电路板 |
| JP6078535B2 (ja) * | 2012-05-17 | 2017-02-08 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
| KR101388820B1 (ko) * | 2012-09-19 | 2014-04-23 | 삼성전기주식회사 | 절연용 에폭시 수지 조성물, 절연 필름, 프리프레그 및 인쇄회로기판 |
| JP2014141626A (ja) * | 2012-12-28 | 2014-08-07 | Konica Minolta Inc | 塗布液、反射膜、反射シート、太陽電池モジュール、ｌｅｄ照明装置および実装用基板 |
| CN104049457B (zh) * | 2013-03-11 | 2016-01-27 | 太阳油墨制造株式会社 | 光固化性树脂组合物、其干膜和固化物、以及具有使用它们形成的固化皮膜的印刷电路板 |
| KR20140123780A (ko) * | 2013-04-15 | 2014-10-23 | 동우 화인켐 주식회사 | 광경화 코팅 필름, 편광판 및 표시장치 |
| CN105144854B (zh) * | 2013-04-24 | 2019-02-05 | 太阳油墨制造株式会社 | 层叠树脂结构体、干膜、及柔性印刷电路板 |
| CN104141173B (zh) * | 2014-06-25 | 2016-08-24 | 广西科技大学 | 可光固化纤维素酯纳米纤维膜的制备方法 |
| CN105467753B (zh) * | 2014-07-31 | 2020-01-14 | 太阳油墨（苏州）有限公司 | 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板 |
| JP6424150B2 (ja) * | 2014-09-30 | 2018-11-14 | 富士フイルム株式会社 | 凹凸構造を有する物品の製造方法および凹凸構造を有する物品 |
| WO2016052026A1 (ja) * | 2014-09-30 | 2016-04-07 | 富士フイルム株式会社 | 凹凸構造を有する物品の製造方法及び凹凸構造を有する物品 |
| JP2016080803A (ja) * | 2014-10-14 | 2016-05-16 | 太陽インキ製造株式会社 | ドライフィルムおよびフレキシブルプリント配線板 |
| JP6934419B2 (ja) * | 2014-12-09 | 2021-09-15 | アーケマ・インコーポレイテッド | 大気酸素の存在下でおいてポリマーを架橋させるための組成物及び方法 |
| CN109532257B (zh) * | 2018-09-25 | 2020-12-18 | 宁波慎承印业有限公司 | 一种环保印刷工艺 |
| WO2022210945A1 (ja) * | 2021-03-31 | 2022-10-06 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、積層構造体、硬化物および電子部品 |
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| JP3449572B2 (ja) * | 1994-08-12 | 2003-09-22 | 東京応化工業株式会社 | 感光性樹脂組成物およびこれを用いた感光性ドライフィルム |
| CN1144096C (zh) * | 2000-03-03 | 2004-03-31 | 奇美实业股份有限公司 | 感光性树脂组成物 |
| JP2005024893A (ja) * | 2003-07-02 | 2005-01-27 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びその用途 |
| JP2005241801A (ja) * | 2004-02-25 | 2005-09-08 | Kri Inc | 感光性グリーンシート及びそれを用いた複合グリーンシート |
| JP2006145606A (ja) * | 2004-11-16 | 2006-06-08 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びこれを用いたサンドブラスト用感光性フィルム |
| JP2006199834A (ja) * | 2005-01-21 | 2006-08-03 | Mitsui Chemicals Inc | 光硬化性熱分解性組成物およびその用途 |
| JP2006253664A (ja) * | 2005-02-08 | 2006-09-21 | Showa Denko Kk | ソルダーレジスト用難燃組成物およびその用途 |
| JP4197177B2 (ja) * | 2005-03-18 | 2008-12-17 | 東京応化工業株式会社 | ブラックマトリックス形成用光硬化性樹脂組成物、これを用いた感光性フィルム、ブラックマトリックスの形成方法、ブラックマトリックス及びそのブラックマトリックスを有するプラズマディスプレイパネル |
| JP4566862B2 (ja) * | 2005-08-25 | 2010-10-20 | 富士通株式会社 | レジストパターン厚肉化材料、レジストパターンの形成方法、半導体装置及びその製造方法 |
| JP4849860B2 (ja) * | 2005-10-04 | 2012-01-11 | 太陽ホールディングス株式会社 | 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板 |
| JP4660826B2 (ja) * | 2006-08-18 | 2011-03-30 | 山栄化学株式会社 | レジストパターンの形成方法 |
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| KR20090102693A (ko) | 2009-09-30 |
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| KR101010103B1 (ko) | 2011-01-24 |
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| CN101544784A (zh) | 2009-09-30 |
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