JP5445006B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP5445006B2
JP5445006B2 JP2009231969A JP2009231969A JP5445006B2 JP 5445006 B2 JP5445006 B2 JP 5445006B2 JP 2009231969 A JP2009231969 A JP 2009231969A JP 2009231969 A JP2009231969 A JP 2009231969A JP 5445006 B2 JP5445006 B2 JP 5445006B2
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Japan
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priority
processing
substrate
unit
wafer
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JP2009231969A
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Japanese (ja)
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JP2011082276A5 (enExample
JP2011082276A (ja
Inventor
正寛 吉田
康司 詫間
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2009231969A priority Critical patent/JP5445006B2/ja
Priority to US12/896,236 priority patent/US8447422B2/en
Priority to KR1020100096958A priority patent/KR101449782B1/ko
Publication of JP2011082276A publication Critical patent/JP2011082276A/ja
Publication of JP2011082276A5 publication Critical patent/JP2011082276A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2009231969A 2009-10-05 2009-10-05 基板処理装置、基板処理方法及び記憶媒体 Active JP5445006B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009231969A JP5445006B2 (ja) 2009-10-05 2009-10-05 基板処理装置、基板処理方法及び記憶媒体
US12/896,236 US8447422B2 (en) 2009-10-05 2010-10-01 Substrate processing apparatus, substrate processing method, and storage medium
KR1020100096958A KR101449782B1 (ko) 2009-10-05 2010-10-05 기판 처리 장치, 기판 처리 방법 및 기억 매체

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009231969A JP5445006B2 (ja) 2009-10-05 2009-10-05 基板処理装置、基板処理方法及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2011082276A JP2011082276A (ja) 2011-04-21
JP2011082276A5 JP2011082276A5 (enExample) 2012-02-23
JP5445006B2 true JP5445006B2 (ja) 2014-03-19

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JP2009231969A Active JP5445006B2 (ja) 2009-10-05 2009-10-05 基板処理装置、基板処理方法及び記憶媒体

Country Status (3)

Country Link
US (1) US8447422B2 (enExample)
JP (1) JP5445006B2 (enExample)
KR (1) KR101449782B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11809158B2 (en) 2018-07-23 2023-11-07 Semes Co., Ltd. Apparatus and method for treating substrate based on defect values of transfer paths

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JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5847515B2 (ja) * 2011-09-27 2016-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のためのスケジュール作成方法およびスケジュール作成プログラム
KR101909099B1 (ko) * 2011-10-13 2018-10-17 세메스 주식회사 웨이퍼 처리 방법
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、プログラムおよび記録媒体
JP5981307B2 (ja) * 2012-11-07 2016-08-31 東京エレクトロン株式会社 処理方法及び処理装置
JP5977728B2 (ja) * 2013-11-14 2016-08-24 東京エレクトロン株式会社 基板処理システム
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US10520932B2 (en) 2014-07-03 2019-12-31 Taiwan Semiconductor Manufacturing Co., Ltd Transport system and method
JP6324246B2 (ja) * 2014-07-11 2018-05-16 キヤノン株式会社 リソグラフィ装置、および物品製造方法
JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR20200072060A (ko) 2018-12-12 2020-06-22 세메스 주식회사 기판 처리 장치 및 방법
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JP2025101331A (ja) * 2023-12-25 2025-07-07 株式会社Ｓｃｒｅｅｎホールディングス スケジュール作成プログラム生成方法、スケジュール作成プログラム生成装置、スケジュール作成装置、記録媒体、生成プログラム、スケジュール作成プログラム、基板処理装置、及び基板処理システム

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11809158B2 (en) 2018-07-23 2023-11-07 Semes Co., Ltd. Apparatus and method for treating substrate based on defect values of transfer paths

Also Published As

Publication number Publication date
JP2011082276A (ja) 2011-04-21
KR20110037896A (ko) 2011-04-13
US20110082579A1 (en) 2011-04-07
KR101449782B1 (ko) 2014-10-14
US8447422B2 (en) 2013-05-21

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