JP5441789B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP5441789B2
JP5441789B2 JP2010078019A JP2010078019A JP5441789B2 JP 5441789 B2 JP5441789 B2 JP 5441789B2 JP 2010078019 A JP2010078019 A JP 2010078019A JP 2010078019 A JP2010078019 A JP 2010078019A JP 5441789 B2 JP5441789 B2 JP 5441789B2
Authority
JP
Japan
Prior art keywords
heat
heat conducting
space
substrate
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010078019A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011211542A (ja
JP2011211542A5 (https=
Inventor
誠一 加藤
豊 高瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010078019A priority Critical patent/JP5441789B2/ja
Priority to US13/040,806 priority patent/US8681503B2/en
Priority to CN201110080872.XA priority patent/CN102243416B/zh
Publication of JP2011211542A publication Critical patent/JP2011211542A/ja
Publication of JP2011211542A5 publication Critical patent/JP2011211542A5/ja
Application granted granted Critical
Publication of JP5441789B2 publication Critical patent/JP5441789B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2010078019A 2010-03-30 2010-03-30 電子機器 Expired - Fee Related JP5441789B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010078019A JP5441789B2 (ja) 2010-03-30 2010-03-30 電子機器
US13/040,806 US8681503B2 (en) 2010-03-30 2011-03-04 Electronic apparatus including electronic component serving as heat-generating source
CN201110080872.XA CN102243416B (zh) 2010-03-30 2011-03-25 包括作为发热源的电子部件的电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010078019A JP5441789B2 (ja) 2010-03-30 2010-03-30 電子機器

Publications (3)

Publication Number Publication Date
JP2011211542A JP2011211542A (ja) 2011-10-20
JP2011211542A5 JP2011211542A5 (https=) 2013-05-16
JP5441789B2 true JP5441789B2 (ja) 2014-03-12

Family

ID=44709451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010078019A Expired - Fee Related JP5441789B2 (ja) 2010-03-30 2010-03-30 電子機器

Country Status (3)

Country Link
US (1) US8681503B2 (https=)
JP (1) JP5441789B2 (https=)
CN (1) CN102243416B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013200966B4 (de) * 2012-02-10 2023-11-16 Robert Bosch Gmbh Modulvorrichtung für ein Kamerasystem und entsprechendes Kamerasystem
CN103425945B (zh) * 2012-05-16 2016-12-14 宏碁股份有限公司 具有防盗功能的模块化电子设备
CN102868851B (zh) * 2012-08-16 2015-05-06 浙江宇视科技有限公司 一种摄像机散热装置
JP6529276B2 (ja) * 2015-02-18 2019-06-12 キヤノン株式会社 撮像装置
CN206542527U (zh) * 2017-03-09 2017-10-03 中磊电子（苏州）有限公司 网络监视器
WO2020026661A1 (ja) * 2018-07-30 2020-02-06 ソニー株式会社 表示装置及び放熱方法
JP2020035885A (ja) * 2018-08-30 2020-03-05 レノボ・シンガポール・プライベート・リミテッド 電子機器
CN113163074A (zh) * 2020-01-22 2021-07-23 华为技术有限公司 摄像组件及电子设备
CN113703257B (zh) * 2021-07-14 2023-03-28 北京空间飞行器总体设计部 一种适用于超薄空间的相机ccd散热装置
JP2026000304A (ja) * 2024-06-17 2026-01-05 浜松ホトニクス株式会社 撮像装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234885U (https=) * 1985-08-19 1987-02-28
JP3284585B2 (ja) * 1992-04-10 2002-05-20 ソニー株式会社 電子機器の冷却装置
EP0608418B1 (en) * 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3557346B2 (ja) * 1998-05-22 2004-08-25 オリンパス株式会社 撮像装置
JP2001308569A (ja) * 2000-04-25 2001-11-02 Sony Corp 電子部品の放熱構造
JP2001313852A (ja) * 2000-04-28 2001-11-09 Sony Corp 撮像素子の冷却機構
JP2002247594A (ja) 2001-02-20 2002-08-30 Olympus Optical Co Ltd 撮像装置
JP3532871B2 (ja) * 2001-02-28 2004-05-31 株式会社東芝 冷却装置およびこの冷却装置を有する電子機器
US6653557B2 (en) * 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
US20030161133A1 (en) * 2002-02-27 2003-08-28 Optronx Optical transmitter header having passive electrical component
JP2006191256A (ja) * 2005-01-05 2006-07-20 Matsushita Electric Ind Co Ltd 固体撮像装置
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
JP2008219704A (ja) 2007-03-07 2008-09-18 Olympus Imaging Corp 半導体装置
US8247699B2 (en) * 2008-09-30 2012-08-21 Hitachi Global Storage Technologies, Netherlands B.V. Flex circuit assembly with a dummy trace between two signal traces
JP5504683B2 (ja) * 2009-04-27 2014-05-28 セイコーエプソン株式会社 電気光学装置及び電子機器

Also Published As

Publication number Publication date
US8681503B2 (en) 2014-03-25
JP2011211542A (ja) 2011-10-20
CN102243416A (zh) 2011-11-16
US20110242762A1 (en) 2011-10-06
CN102243416B (zh) 2014-05-07

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