JP2011211542A5 - - Google Patents

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Publication number
JP2011211542A5
JP2011211542A5 JP2010078019A JP2010078019A JP2011211542A5 JP 2011211542 A5 JP2011211542 A5 JP 2011211542A5 JP 2010078019 A JP2010078019 A JP 2010078019A JP 2010078019 A JP2010078019 A JP 2010078019A JP 2011211542 A5 JP2011211542 A5 JP 2011211542A5
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JP
Japan
Prior art keywords
heat
space
heat conducting
electronic component
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010078019A
Other languages
English (en)
Japanese (ja)
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JP2011211542A (ja
JP5441789B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2010078019A priority Critical patent/JP5441789B2/ja
Priority claimed from JP2010078019A external-priority patent/JP5441789B2/ja
Priority to US13/040,806 priority patent/US8681503B2/en
Priority to CN201110080872.XA priority patent/CN102243416B/zh
Publication of JP2011211542A publication Critical patent/JP2011211542A/ja
Publication of JP2011211542A5 publication Critical patent/JP2011211542A5/ja
Application granted granted Critical
Publication of JP5441789B2 publication Critical patent/JP5441789B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010078019A 2010-03-30 2010-03-30 電子機器 Expired - Fee Related JP5441789B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010078019A JP5441789B2 (ja) 2010-03-30 2010-03-30 電子機器
US13/040,806 US8681503B2 (en) 2010-03-30 2011-03-04 Electronic apparatus including electronic component serving as heat-generating source
CN201110080872.XA CN102243416B (zh) 2010-03-30 2011-03-25 包括作为发热源的电子部件的电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010078019A JP5441789B2 (ja) 2010-03-30 2010-03-30 電子機器

Publications (3)

Publication Number Publication Date
JP2011211542A JP2011211542A (ja) 2011-10-20
JP2011211542A5 true JP2011211542A5 (https=) 2013-05-16
JP5441789B2 JP5441789B2 (ja) 2014-03-12

Family

ID=44709451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010078019A Expired - Fee Related JP5441789B2 (ja) 2010-03-30 2010-03-30 電子機器

Country Status (3)

Country Link
US (1) US8681503B2 (https=)
JP (1) JP5441789B2 (https=)
CN (1) CN102243416B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013200966B4 (de) * 2012-02-10 2023-11-16 Robert Bosch Gmbh Modulvorrichtung für ein Kamerasystem und entsprechendes Kamerasystem
CN103425945B (zh) * 2012-05-16 2016-12-14 宏碁股份有限公司 具有防盗功能的模块化电子设备
CN102868851B (zh) * 2012-08-16 2015-05-06 浙江宇视科技有限公司 一种摄像机散热装置
JP6529276B2 (ja) * 2015-02-18 2019-06-12 キヤノン株式会社 撮像装置
CN206542527U (zh) * 2017-03-09 2017-10-03 中磊电子（苏州）有限公司 网络监视器
WO2020026661A1 (ja) * 2018-07-30 2020-02-06 ソニー株式会社 表示装置及び放熱方法
JP2020035885A (ja) * 2018-08-30 2020-03-05 レノボ・シンガポール・プライベート・リミテッド 電子機器
CN113163074A (zh) * 2020-01-22 2021-07-23 华为技术有限公司 摄像组件及电子设备
CN113703257B (zh) * 2021-07-14 2023-03-28 北京空间飞行器总体设计部 一种适用于超薄空间的相机ccd散热装置
JP2026000304A (ja) * 2024-06-17 2026-01-05 浜松ホトニクス株式会社 撮像装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234885U (https=) * 1985-08-19 1987-02-28
JP3284585B2 (ja) * 1992-04-10 2002-05-20 ソニー株式会社 電子機器の冷却装置
EP0608418B1 (en) * 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3557346B2 (ja) * 1998-05-22 2004-08-25 オリンパス株式会社 撮像装置
JP2001308569A (ja) * 2000-04-25 2001-11-02 Sony Corp 電子部品の放熱構造
JP2001313852A (ja) * 2000-04-28 2001-11-09 Sony Corp 撮像素子の冷却機構
JP2002247594A (ja) 2001-02-20 2002-08-30 Olympus Optical Co Ltd 撮像装置
JP3532871B2 (ja) * 2001-02-28 2004-05-31 株式会社東芝 冷却装置およびこの冷却装置を有する電子機器
US6653557B2 (en) * 2002-02-27 2003-11-25 Jds Uniphase Corporation Faraday cage and ceramic walls for shielding EMI
US20030161133A1 (en) * 2002-02-27 2003-08-28 Optronx Optical transmitter header having passive electrical component
JP2006191256A (ja) * 2005-01-05 2006-07-20 Matsushita Electric Ind Co Ltd 固体撮像装置
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
JP2008219704A (ja) 2007-03-07 2008-09-18 Olympus Imaging Corp 半導体装置
US8247699B2 (en) * 2008-09-30 2012-08-21 Hitachi Global Storage Technologies, Netherlands B.V. Flex circuit assembly with a dummy trace between two signal traces
JP5504683B2 (ja) * 2009-04-27 2014-05-28 セイコーエプソン株式会社 電気光学装置及び電子機器

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