JP5437489B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
- Publication number
- JP5437489B2 JP5437489B2 JP2012526800A JP2012526800A JP5437489B2 JP 5437489 B2 JP5437489 B2 JP 5437489B2 JP 2012526800 A JP2012526800 A JP 2012526800A JP 2012526800 A JP2012526800 A JP 2012526800A JP 5437489 B2 JP5437489 B2 JP 5437489B2
- Authority
- JP
- Japan
- Prior art keywords
- chiplet
- substrate
- common substrate
- electrode
- chiplets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/129—Chiplets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/861—Repairing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Facsimile Heads (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/546,118 US8183765B2 (en) | 2009-08-24 | 2009-08-24 | Controlling an electronic device using chiplets |
| US12/546,118 | 2009-08-24 | ||
| PCT/US2010/044361 WO2011028354A2 (en) | 2009-08-24 | 2010-08-04 | Controlling an electronic device using chiplets |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013502620A JP2013502620A (ja) | 2013-01-24 |
| JP2013502620A5 JP2013502620A5 (https=) | 2013-03-07 |
| JP5437489B2 true JP5437489B2 (ja) | 2014-03-12 |
Family
ID=43027602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012526800A Active JP5437489B2 (ja) | 2009-08-24 | 2010-08-04 | 電子装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8183765B2 (https=) |
| EP (1) | EP2471099A2 (https=) |
| JP (1) | JP5437489B2 (https=) |
| KR (1) | KR101233691B1 (https=) |
| CN (1) | CN102484120A (https=) |
| TW (1) | TWI383479B (https=) |
| WO (1) | WO2011028354A2 (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4107417B2 (ja) * | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
| US9165989B2 (en) * | 2009-09-16 | 2015-10-20 | Semprius, Inc. | High-yield fabrication of large-format substrates with distributed, independent control elements |
| US8391018B2 (en) * | 2009-09-28 | 2013-03-05 | Qualcomm Incorporated | Semiconductor die-based packaging interconnect |
| KR101943718B1 (ko) * | 2013-10-29 | 2019-01-29 | 삼성에스디아이 주식회사 | 이방성 도전 필름 및 이를 이용한 접속물 |
| JPWO2015145886A1 (ja) * | 2014-03-25 | 2017-04-13 | パナソニックIpマネジメント株式会社 | 電極パターンの形成方法及び太陽電池の製造方法 |
| JP6424610B2 (ja) * | 2014-04-23 | 2018-11-21 | ソニー株式会社 | 半導体装置、および製造方法 |
| US9198236B1 (en) * | 2014-05-07 | 2015-11-24 | Grote Industries, Llc | System and method for controlling a multiple-color lighting device |
| KR102446131B1 (ko) * | 2015-11-06 | 2022-09-23 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조 방법 |
| JP6594246B2 (ja) | 2016-03-31 | 2019-10-23 | 株式会社ジャパンディスプレイ | 表示装置 |
| US10107860B2 (en) | 2016-06-21 | 2018-10-23 | International Business Machines Corporation | Bitwise rotating scan section for microelectronic chip testing and diagnostics |
| AU2017391778B2 (en) * | 2017-01-04 | 2022-09-29 | Shih-Hsien Tseng | Pixel unit structure and manufacturing method thereof |
| TWI688802B (zh) * | 2017-11-03 | 2020-03-21 | 曾世憲 | 畫素陣列及其製造方法 |
| US10930631B2 (en) | 2017-11-03 | 2021-02-23 | Shih-Hsien Tseng | Display apparatus, pixel array and manufacturing method thereof |
| JP2022545952A (ja) * | 2019-08-26 | 2022-11-01 | エクス-セルプリント リミテッド | 可変剛性モジュール |
| CN114556552A (zh) * | 2019-10-14 | 2022-05-27 | 零能耗股份公司 | 集成电子结构及结构部件间的数据通信 |
| JP2020155417A (ja) * | 2020-06-24 | 2020-09-24 | パイオニア株式会社 | 発光装置 |
| WO2024228757A2 (en) * | 2023-01-30 | 2024-11-07 | University Of Iowa Research Foundation | Cascaded superlattice narrowband led |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5982784A (ja) * | 1982-11-04 | 1984-05-12 | 沖電気工業株式会社 | Icケ−ス等の実装方法 |
| US4769292A (en) | 1987-03-02 | 1988-09-06 | Eastman Kodak Company | Electroluminescent device with modified thin film luminescent zone |
| JPH01123379U (https=) * | 1988-02-17 | 1989-08-22 | ||
| JPH0345651U (https=) * | 1989-09-12 | 1991-04-26 | ||
| US5061569A (en) | 1990-07-26 | 1991-10-29 | Eastman Kodak Company | Electroluminescent device with organic electroluminescent medium |
| US5340978A (en) | 1992-09-30 | 1994-08-23 | Lsi Logic Corporation | Image-sensing display panels with LCD display panel and photosensitive element array |
| JP4619462B2 (ja) * | 1996-08-27 | 2011-01-26 | セイコーエプソン株式会社 | 薄膜素子の転写方法 |
| US6384529B2 (en) | 1998-11-18 | 2002-05-07 | Eastman Kodak Company | Full color active matrix organic electroluminescent display panel having an integrated shadow mask |
| KR100634077B1 (ko) * | 1998-12-15 | 2006-10-16 | 이 잉크 코포레이션 | 마이크로캡슐 전자표시장치의 조립방법 |
| US6606079B1 (en) | 1999-02-16 | 2003-08-12 | Alien Technology Corporation | Pixel integrated circuit |
| JP2001217245A (ja) * | 2000-02-04 | 2001-08-10 | Sharp Corp | 電子部品およびその製造方法 |
| JP4360015B2 (ja) * | 2000-03-17 | 2009-11-11 | セイコーエプソン株式会社 | 有機el表示体の製造方法、半導体素子の配置方法、半導体装置の製造方法 |
| JP3976114B2 (ja) * | 2000-05-24 | 2007-09-12 | 洋太郎 畑村 | 装置の製造方法、および素子基板の製造方法 |
| JP2002015866A (ja) * | 2000-06-30 | 2002-01-18 | Seiko Epson Corp | 有機el表示体の製造方法 |
| US6698077B2 (en) * | 2000-12-27 | 2004-03-02 | International Business Machines Corporation | Display fabrication using modular active devices |
| GB0112395D0 (en) | 2001-05-22 | 2001-07-11 | Koninkl Philips Electronics Nv | Display devices and driving method therefor |
| CN1582461A (zh) * | 2001-09-07 | 2005-02-16 | 松下电器产业株式会社 | 显示装置及其制造方法 |
| JP3980918B2 (ja) * | 2002-03-28 | 2007-09-26 | 株式会社東芝 | アクティブマトリクス基板及びその製造方法、表示装置 |
| JP2003298006A (ja) * | 2002-03-29 | 2003-10-17 | Seiko Epson Corp | 半導体装置および電気光学装置 |
| JP4410456B2 (ja) | 2002-04-24 | 2010-02-03 | 株式会社リコー | 薄膜デバイス装置の製造方法、およびアクティブマトリクス基板の製造方法 |
| US7183582B2 (en) * | 2002-05-29 | 2007-02-27 | Seiko Epson Coporation | Electro-optical device and method of manufacturing the same, element driving device and method of manufacturing the same, element substrate, and electronic apparatus |
| JP5022552B2 (ja) | 2002-09-26 | 2012-09-12 | セイコーエプソン株式会社 | 電気光学装置の製造方法及び電気光学装置 |
| US7585703B2 (en) | 2002-11-19 | 2009-09-08 | Ishikawa Seisakusho, Ltd. | Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate |
| US7230594B2 (en) | 2002-12-16 | 2007-06-12 | Eastman Kodak Company | Color OLED display with improved power efficiency |
| US6919681B2 (en) | 2003-04-30 | 2005-07-19 | Eastman Kodak Company | Color OLED display with improved power efficiency |
| US6987355B2 (en) | 2003-06-11 | 2006-01-17 | Eastman Kodak Company | Stacked OLED display having improved efficiency |
| US7139060B2 (en) * | 2004-01-27 | 2006-11-21 | Au Optronics Corporation | Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film |
| JP2005292566A (ja) * | 2004-04-01 | 2005-10-20 | Seiko Epson Corp | 電気光学装置及び電子機器 |
| US7615800B2 (en) | 2005-09-14 | 2009-11-10 | Eastman Kodak Company | Quantum dot light emitting layer |
| CN100536117C (zh) * | 2006-12-07 | 2009-09-02 | 广富群光电股份有限公司 | 薄膜晶体管面板的制造方法 |
-
2009
- 2009-08-24 US US12/546,118 patent/US8183765B2/en active Active
-
2010
- 2010-08-04 CN CN2010800378049A patent/CN102484120A/zh active Pending
- 2010-08-04 KR KR1020127006551A patent/KR101233691B1/ko active Active
- 2010-08-04 JP JP2012526800A patent/JP5437489B2/ja active Active
- 2010-08-04 WO PCT/US2010/044361 patent/WO2011028354A2/en not_active Ceased
- 2010-08-04 EP EP10740490A patent/EP2471099A2/en not_active Withdrawn
- 2010-08-12 TW TW099126934A patent/TWI383479B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US8183765B2 (en) | 2012-05-22 |
| WO2011028354A3 (en) | 2011-06-30 |
| WO2011028354A2 (en) | 2011-03-10 |
| US20110043105A1 (en) | 2011-02-24 |
| TW201117333A (en) | 2011-05-16 |
| CN102484120A (zh) | 2012-05-30 |
| KR101233691B1 (ko) | 2013-02-15 |
| JP2013502620A (ja) | 2013-01-24 |
| TWI383479B (zh) | 2013-01-21 |
| KR20120052392A (ko) | 2012-05-23 |
| EP2471099A2 (en) | 2012-07-04 |
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