KR101233691B1 - 칩렛을 사용하는 전자 디바이스의 제어 - Google Patents

칩렛을 사용하는 전자 디바이스의 제어 Download PDF

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Publication number
KR101233691B1
KR101233691B1 KR1020127006551A KR20127006551A KR101233691B1 KR 101233691 B1 KR101233691 B1 KR 101233691B1 KR 1020127006551 A KR1020127006551 A KR 1020127006551A KR 20127006551 A KR20127006551 A KR 20127006551A KR 101233691 B1 KR101233691 B1 KR 101233691B1
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South Korea
Prior art keywords
chiplet
common substrate
substrate
chiplets
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Korean (ko)
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KR20120052392A (ko
Inventor
로널드 에스 코크
존 더블유 해머
Original Assignee
글로벌 오엘이디 테크놀러지 엘엘씨
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
KR1020127006551A 2009-08-24 2010-08-04 칩렛을 사용하는 전자 디바이스의 제어 Active KR101233691B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/546,118 US8183765B2 (en) 2009-08-24 2009-08-24 Controlling an electronic device using chiplets
US12/546,118 2009-08-24
PCT/US2010/044361 WO2011028354A2 (en) 2009-08-24 2010-08-04 Controlling an electronic device using chiplets

Publications (2)

Publication Number Publication Date
KR20120052392A KR20120052392A (ko) 2012-05-23
KR101233691B1 true KR101233691B1 (ko) 2013-02-15

Family

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KR1020127006551A Active KR101233691B1 (ko) 2009-08-24 2010-08-04 칩렛을 사용하는 전자 디바이스의 제어

Country Status (7)

Country Link
US (1) US8183765B2 (https=)
EP (1) EP2471099A2 (https=)
JP (1) JP5437489B2 (https=)
KR (1) KR101233691B1 (https=)
CN (1) CN102484120A (https=)
TW (1) TWI383479B (https=)
WO (1) WO2011028354A2 (https=)

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JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
US9165989B2 (en) * 2009-09-16 2015-10-20 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8391018B2 (en) * 2009-09-28 2013-03-05 Qualcomm Incorporated Semiconductor die-based packaging interconnect
KR101943718B1 (ko) * 2013-10-29 2019-01-29 삼성에스디아이 주식회사 이방성 도전 필름 및 이를 이용한 접속물
JPWO2015145886A1 (ja) * 2014-03-25 2017-04-13 パナソニックＩｐマネジメント株式会社 電極パターンの形成方法及び太陽電池の製造方法
JP6424610B2 (ja) * 2014-04-23 2018-11-21 ソニー株式会社 半導体装置、および製造方法
US9198236B1 (en) * 2014-05-07 2015-11-24 Grote Industries, Llc System and method for controlling a multiple-color lighting device
KR102446131B1 (ko) * 2015-11-06 2022-09-23 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
JP6594246B2 (ja) 2016-03-31 2019-10-23 株式会社ジャパンディスプレイ 表示装置
US10107860B2 (en) 2016-06-21 2018-10-23 International Business Machines Corporation Bitwise rotating scan section for microelectronic chip testing and diagnostics
AU2017391778B2 (en) * 2017-01-04 2022-09-29 Shih-Hsien Tseng Pixel unit structure and manufacturing method thereof
TWI688802B (zh) * 2017-11-03 2020-03-21 曾世憲 畫素陣列及其製造方法
US10930631B2 (en) 2017-11-03 2021-02-23 Shih-Hsien Tseng Display apparatus, pixel array and manufacturing method thereof
JP2022545952A (ja) * 2019-08-26 2022-11-01 エクス－セルプリント リミテッド 可変剛性モジュール
CN114556552A (zh) * 2019-10-14 2022-05-27 零能耗股份公司 集成电子结构及结构部件间的数据通信
JP2020155417A (ja) * 2020-06-24 2020-09-24 パイオニア株式会社 発光装置
WO2024228757A2 (en) * 2023-01-30 2024-11-07 University Of Iowa Research Foundation Cascaded superlattice narrowband led

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Also Published As

Publication number Publication date
US8183765B2 (en) 2012-05-22
WO2011028354A3 (en) 2011-06-30
WO2011028354A2 (en) 2011-03-10
US20110043105A1 (en) 2011-02-24
TW201117333A (en) 2011-05-16
CN102484120A (zh) 2012-05-30
JP2013502620A (ja) 2013-01-24
TWI383479B (zh) 2013-01-21
KR20120052392A (ko) 2012-05-23
EP2471099A2 (en) 2012-07-04
JP5437489B2 (ja) 2014-03-12

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