JP5434781B2 - 処理液供給機構 - Google Patents
処理液供給機構 Download PDFInfo
- Publication number
- JP5434781B2 JP5434781B2 JP2010104519A JP2010104519A JP5434781B2 JP 5434781 B2 JP5434781 B2 JP 5434781B2 JP 2010104519 A JP2010104519 A JP 2010104519A JP 2010104519 A JP2010104519 A JP 2010104519A JP 5434781 B2 JP5434781 B2 JP 5434781B2
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- Prior art keywords
- supply pipe
- processing liquid
- resist
- liquid supply
- cylinder portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 title claims description 157
- 230000007246 mechanism Effects 0.000 title claims description 51
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000005086 pumping Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 29
- 210000000078 claw Anatomy 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 7
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/30—Dip tubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2931—Diverse fluid containing pressure systems
- Y10T137/3115—Gas pressure storage over or displacement of liquid
- Y10T137/3127—With gas maintenance or application
- Y10T137/314—Unitary mounting for gas pressure inlet and liquid outlet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/86292—System with plural openings, one a gas vent or access opening
- Y10T137/86324—Tank with gas vent and inlet or outlet
- Y10T137/86332—Vent and inlet or outlet in unitary mounting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Closures For Containers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Description
前記蓋部から容器本体の上方へ突出し、周面にねじが切られた固定筒部と、
この固定筒部と同軸に当該固定筒部の内側または外側に螺合して設けられた移動筒部と、
前記固定筒部と前記移動筒部と前記蓋部とを、当該固定筒部及び前記蓋部に対して軸方向に移動自在に貫通し、その下端は前記容器本体の底面に対して近接すると共に移動筒部に対して軸方向の位置が固定された処理液供給管と、
前記移動筒部と同軸に設けられた環状部分を有する回転操作部と、
前記移動筒部及び前記環状部分に夫々設けられ、前記回転操作部を回転させたときに互いに係合して移動筒部が回転し、また移動筒部に加わるトルクが大きくなると係合が解除されるように構成された係合部及び被係合部と、
を備え、
回転操作部を回転させて処理液供給管の下端が容器本体の底面に当接することにより係合部と被係合部との係合が解除されて回転操作部が空回りすることを特徴とすることを特徴とする。
(a)固定筒部は、移動筒部の内側に位置する。
(b)前記環状部分は、移動筒部の外側に当該移動筒部を囲むように設けられている。
(c)前記処理液供給管には、処理液の流路とは区画された前記加圧用ガスの供給路が設けられる。
(d)前記処理液供給管の軸は、前記容器本体の縦軸に対して傾斜し、前記処理液供給管の下端が容器本体の底面の周縁部に当接することにより、前記係合が解除される。
2 加圧式レジスト供給容器
3 レジスト供給管
5 ボトルキャップ
12 レジスト塗布装置
20 レジスト
21 液ボトル
22 開口部
51 下側キャップ
52 キャップ本体部
53 内筒部
54 支持部
71 上側キャップ
72 ハンドル
73 外筒部
75 アーム
76 爪部
83 歯部
Claims (5)
- 容器本体とこの容器本体の上面開口部を塞ぐ蓋部とからなる容器の内部に貯留された処理液を、加圧用ガスにより圧送するための処理液供給装置において、
前記蓋部から容器本体の上方へ突出し、周面にねじが切られた固定筒部と、
この固定筒部と同軸に当該固定筒部の内側または外側に螺合して設けられた移動筒部と、
前記固定筒部と前記移動筒部と前記蓋部とを、当該固定筒部及び前記蓋部に対して軸方向に移動自在に貫通し、その下端は前記容器本体の底面に対して近接すると共に移動筒部に対して軸方向の位置が固定された処理液供給管と、
前記移動筒部と同軸に設けられた環状部分を有する回転操作部と、
前記移動筒部及び前記環状部分に夫々設けられ、前記回転操作部を回転させたときに互いに係合して移動筒部が回転し、また移動筒部に加わるトルクが大きくなると係合が解除されるように構成された係合部及び被係合部と、
を備え、
回転操作部を回転させて処理液供給管の下端が容器本体の底面に当接することにより係合部と被係合部との係合が解除されて回転操作部が空回りすることを特徴とすることを特徴とする処理液供給機構。 - 前記処理液供給管の軸は、前記容器本体の縦軸に対して傾斜し、前記処理液供給管の下端が前記容器本体の底面の周縁部に当接することにより、前記係合が解除されることを特徴とする請求項1記載の処理液供給機構。
- 固定筒部は、移動筒部の内側に位置することを特徴とする請求項1または2記載の処理液供給機構。
- 前記環状部分は、移動筒部の外側に当該移動筒部を囲むように設けられていることを特徴とする請求項1ないし3のいずれか一つに記載の処理液供給機構。
- 前記処理液供給管には、処理液の流路とは区画された前記加圧用ガスの供給路が設けられることを特徴とする請求項1ないし4のいずれか一つに記載の処理液供給機構。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010104519A JP5434781B2 (ja) | 2010-04-28 | 2010-04-28 | 処理液供給機構 |
KR1020110016967A KR101705376B1 (ko) | 2010-04-28 | 2011-02-25 | 처리액 공급 기구 |
TW100106399A TWI449577B (zh) | 2010-04-28 | 2011-02-25 | Processing solution supply mechanism |
CN201110079737.3A CN102233989B (zh) | 2010-04-28 | 2011-03-30 | 处理液供给机构 |
US13/094,390 US8511331B2 (en) | 2010-04-28 | 2011-04-26 | Process liquid feed mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010104519A JP5434781B2 (ja) | 2010-04-28 | 2010-04-28 | 処理液供給機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011233789A JP2011233789A (ja) | 2011-11-17 |
JP5434781B2 true JP5434781B2 (ja) | 2014-03-05 |
Family
ID=44857323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010104519A Active JP5434781B2 (ja) | 2010-04-28 | 2010-04-28 | 処理液供給機構 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8511331B2 (ja) |
JP (1) | JP5434781B2 (ja) |
KR (1) | KR101705376B1 (ja) |
CN (1) | CN102233989B (ja) |
TW (1) | TWI449577B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10000331B2 (en) | 2013-08-08 | 2018-06-19 | Tokyo Electron Limited | Bottle change apparatus, substrate treatment apparatus, bottle change method, bottle cap, bottle cap change apparatus and bottle cap change method |
US9458002B2 (en) * | 2014-04-11 | 2016-10-04 | Suss Microtec Lithography Gmbh | Bottle supply system and bottle cap adapter |
JP6192595B2 (ja) * | 2014-06-02 | 2017-09-06 | 東京エレクトロン株式会社 | 半導体製造用処理液配管継手 |
KR20190066813A (ko) | 2017-12-06 | 2019-06-14 | 세메스 주식회사 | 잔류 약액 이용을 위한 약액 공급 장치 |
US11360019B2 (en) * | 2017-12-28 | 2022-06-14 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and computer-readable recording medium using color information of processing liquid of substrate |
NL2026157B1 (en) * | 2020-07-29 | 2022-03-29 | Suss Microtec Lithography Gmbh | Adapter, Connection Device and Supply System |
KR102708944B1 (ko) * | 2021-12-28 | 2024-09-25 | 세메스 주식회사 | 처리액 공급 장치 및 기판 처리 장치 |
KR102621654B1 (ko) * | 2023-04-28 | 2024-01-09 | (주)에스티글로벌 | 포토레지스트 수용용기의 커버장치 |
KR102621656B1 (ko) * | 2023-04-28 | 2024-01-09 | (주)에스티글로벌 | 배출모듈의 삽입 깊이가 조절되는 수용용기의 커버장치 |
KR102614235B1 (ko) * | 2023-06-29 | 2023-12-20 | (주)에스티글로벌 | 유체이동모듈의 보강이 가능한 보강모듈 및 이를 포함하는 수용용기의 커버장치 |
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-
2010
- 2010-04-28 JP JP2010104519A patent/JP5434781B2/ja active Active
-
2011
- 2011-02-25 KR KR1020110016967A patent/KR101705376B1/ko active IP Right Grant
- 2011-02-25 TW TW100106399A patent/TWI449577B/zh active
- 2011-03-30 CN CN201110079737.3A patent/CN102233989B/zh active Active
- 2011-04-26 US US13/094,390 patent/US8511331B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20110120205A (ko) | 2011-11-03 |
CN102233989A (zh) | 2011-11-09 |
KR101705376B1 (ko) | 2017-02-09 |
CN102233989B (zh) | 2014-07-23 |
US8511331B2 (en) | 2013-08-20 |
US20110265896A1 (en) | 2011-11-03 |
TW201201914A (en) | 2012-01-16 |
TWI449577B (zh) | 2014-08-21 |
JP2011233789A (ja) | 2011-11-17 |
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