JP5420240B2 - 円筒状マグネトロンの適応性のある固定 - Google Patents

円筒状マグネトロンの適応性のある固定 Download PDF

Info

Publication number
JP5420240B2
JP5420240B2 JP2008515718A JP2008515718A JP5420240B2 JP 5420240 B2 JP5420240 B2 JP 5420240B2 JP 2008515718 A JP2008515718 A JP 2008515718A JP 2008515718 A JP2008515718 A JP 2008515718A JP 5420240 B2 JP5420240 B2 JP 5420240B2
Authority
JP
Japan
Prior art keywords
target
ring
spindle
flange
flange ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008515718A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009512777A (ja
JP2009512777A5 (https=
Inventor
マラシュウスキー，レスゼック
ゲーテ ガワー，オラフ
Original Assignee
アプライド マテリアルズ，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アプライド マテリアルズ，インコーポレイテッド filed Critical アプライド マテリアルズ，インコーポレイテッド
Publication of JP2009512777A publication Critical patent/JP2009512777A/ja
Publication of JP2009512777A5 publication Critical patent/JP2009512777A5/ja
Application granted granted Critical
Publication of JP5420240B2 publication Critical patent/JP5420240B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2008515718A 2005-06-10 2006-05-15 円筒状マグネトロンの適応性のある固定 Expired - Fee Related JP5420240B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/150,337 US20060278519A1 (en) 2005-06-10 2005-06-10 Adaptable fixation for cylindrical magnetrons
US11/150,337 2005-06-10
PCT/US2006/018854 WO2006135528A2 (en) 2005-06-10 2006-05-15 Adaptable fixation for cylindrical magnetrons

Publications (3)

Publication Number Publication Date
JP2009512777A JP2009512777A (ja) 2009-03-26
JP2009512777A5 JP2009512777A5 (https=) 2009-07-02
JP5420240B2 true JP5420240B2 (ja) 2014-02-19

Family

ID=37523145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008515718A Expired - Fee Related JP5420240B2 (ja) 2005-06-10 2006-05-15 円筒状マグネトロンの適応性のある固定

Country Status (8)

Country Link
US (1) US20060278519A1 (https=)
EP (1) EP1896628A4 (https=)
JP (1) JP5420240B2 (https=)
KR (1) KR20080042042A (https=)
CN (1) CN101374971A (https=)
RU (1) RU2007148905A (https=)
TW (1) TWI427174B (https=)
WO (1) WO2006135528A2 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1018645A5 (fr) * 2007-09-24 2011-06-07 Ardenne Anlagentech Gmbh Systeme de magnetron avec support de cible blinde.
WO2009100985A1 (en) * 2008-02-15 2009-08-20 Bekaert Advanced Coatings Nv Multiple grooved vacuum coupling
US8500972B2 (en) * 2008-04-14 2013-08-06 Angstrom Sciences, Inc. Cylindrical magnetron
US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
US20100101946A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
US20100101948A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
EP2180501A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
EP2180502A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
EP2180500A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
CN102265376A (zh) * 2008-10-24 2011-11-30 应用材料股份有限公司 可旋转溅射靶材座、可旋转溅射靶材、涂覆设备、制造可旋转溅射靶材的方法、靶材座连接装置、以及将用于溅射设备的可旋转溅射靶材座装置连接至靶材座支撑件的方法
US20120037503A1 (en) * 2008-10-24 2012-02-16 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
US8951394B2 (en) * 2010-01-29 2015-02-10 Angstrom Sciences, Inc. Cylindrical magnetron having a shunt
EP2365515A1 (en) * 2010-03-09 2011-09-14 Applied Materials, Inc. Rotatable target, backing tube, sputtering installation and method for producing a rotatable target
JP5572710B2 (ja) * 2010-06-28 2014-08-13 アルバックテクノ株式会社 ターゲット取付機構
DE102010040267B4 (de) * 2010-09-03 2014-07-17 Von Ardenne Anlagentechnik Gmbh Sputtereinrichtung mit rohrförmigem Target
US9765726B2 (en) * 2013-03-13 2017-09-19 Federal-Mogul Cylinder liners with adhesive metallic layers and methods of forming the cylinder liners
DE102013103472B4 (de) 2013-04-08 2018-08-09 VON ARDENNE Asset GmbH & Co. KG Vakuumbetriebskomponente und Vakuumprozessanordnung
EP3310941B1 (de) * 2015-06-16 2020-12-30 Schneider GmbH & Co. KG Vorrichtung und verfahren zur beschichtung von linsen
SE1650144A1 (en) * 2016-02-05 2017-08-06 Impact Coatings Ab Device for a physical vapor deposition (pvd) process
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
US10580627B2 (en) 2018-04-26 2020-03-03 Keihin Ramtech Co., Ltd. Sputtering cathode, sputtering cathode assembly, and sputtering apparatus
CN113463044B (zh) * 2021-06-10 2023-02-03 芜湖映日科技股份有限公司 一种真空绑定靶材的设备
CN115691853B (zh) * 2022-09-26 2024-01-23 中国核动力研究设计院 一种用于研究堆同位素辐照生产的辐照靶件及组装方法

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3455583A (en) * 1967-08-30 1969-07-15 High Voltage Engineering Corp Vacuum type union
US4169031A (en) * 1978-01-13 1979-09-25 Polyohm, Inc. Magnetron sputter cathode assembly
ATE13561T1 (de) * 1980-08-08 1985-06-15 Battelle Development Corp Zylindrische magnetron-zerstaeuberkathode.
US4448448A (en) * 1982-03-22 1984-05-15 Raphael Theresa Pollia Coupling system
ZA884511B (en) * 1987-07-15 1989-03-29 Boc Group Inc Method of plasma enhanced silicon oxide deposition
US5798027A (en) * 1988-02-08 1998-08-25 Optical Coating Laboratory, Inc. Process for depositing optical thin films on both planar and non-planar substrates
US5225057A (en) * 1988-02-08 1993-07-06 Optical Coating Laboratory, Inc. Process for depositing optical films on both planar and non-planar substrates
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5047131A (en) * 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds
US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
EP0543931A4 (en) * 1990-08-10 1993-09-08 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
US5100527A (en) * 1990-10-18 1992-03-31 Viratec Thin Films, Inc. Rotating magnetron incorporating a removable cathode
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
BR9205911A (pt) * 1991-04-19 1994-12-27 Surface Solutions Inc Aparelho de sublimação catódica, e processo para depositar película delgada sobre superfície de objeto dentro de um aparelho de sublimação catódica
US5171411A (en) * 1991-05-21 1992-12-15 The Boc Group, Inc. Rotating cylindrical magnetron structure with self supporting zinc alloy target
US5364518A (en) * 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
US5262032A (en) * 1991-05-28 1993-11-16 Leybold Aktiengesellschaft Sputtering apparatus with rotating target and target cooling
DE4117518C2 (de) * 1991-05-29 2000-06-21 Leybold Ag Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target
GB9121665D0 (en) * 1991-10-11 1991-11-27 Boc Group Plc Sputtering processes and apparatus
US5922176A (en) * 1992-06-12 1999-07-13 Donnelly Corporation Spark eliminating sputtering target and method for using and making same
BE1007067A3 (nl) * 1992-07-15 1995-03-07 Emiel Vanderstraeten Besloten Sputterkathode en werkwijze voor het vervaardigen van deze kathode.
US5338422A (en) * 1992-09-29 1994-08-16 The Boc Group, Inc. Device and method for depositing metal oxide films
AU678213B2 (en) * 1993-01-15 1997-05-22 Boc Group, Inc., The Cylindrical magnetron shield structure
CA2123479C (en) * 1993-07-01 1999-07-06 Peter A. Sieck Anode structure for magnetron sputtering systems
CA2126731A1 (en) * 1993-07-12 1995-01-13 Frank Jansen Hollow cathode array and method of cleaning sheet stock therewith
US5616225A (en) * 1994-03-23 1997-04-01 The Boc Group, Inc. Use of multiple anodes in a magnetron for improving the uniformity of its plasma
US5445721A (en) * 1994-08-25 1995-08-29 The Boc Group, Inc. Rotatable magnetron including a replacement target structure
US5518592A (en) * 1994-08-25 1996-05-21 The Boc Group, Inc. Seal cartridge for a rotatable magnetron
ZA956811B (en) * 1994-09-06 1996-05-14 Boc Group Inc Dual cylindrical target magnetron with multiple anodes
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
EP0822996B1 (en) * 1995-04-25 2003-07-02 VON ARDENNE ANLAGENTECHNIK GmbH Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
GB9511492D0 (en) * 1995-06-07 1995-08-02 Boc Group Plc Thin film deposition
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US6565717B1 (en) * 1997-09-15 2003-05-20 Applied Materials, Inc. Apparatus for sputtering ionized material in a medium to high density plasma
CN1196169C (zh) * 1998-04-16 2005-04-06 贝克尔特Vds股份有限公司 磁控管中用于控制目标冲蚀和溅射的装置
EP0969238A1 (en) * 1998-06-29 2000-01-05 Sinvaco N.V. Vacuum tight coupling for tube sections
US6149776A (en) * 1998-11-12 2000-11-21 Applied Materials, Inc. Copper sputtering target
DE19958666C2 (de) * 1999-12-06 2003-10-30 Heraeus Gmbh W C Vorrichtung zur lösbaren Verbindung eines zylinderrohrförmigen Targetteiles mit einem Aufnahmeteil
TW574405B (en) * 2001-01-30 2004-02-01 Hannstar Display Corp Susceptor device in a masked sputtering chamber
US6375815B1 (en) * 2001-02-17 2002-04-23 David Mark Lynn Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
TWI229138B (en) * 2001-06-12 2005-03-11 Unaxis Balzers Ag Magnetron-sputtering source
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
US7014741B2 (en) * 2003-02-21 2006-03-21 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron with self cleaning target
DE602004020599D1 (de) * 2003-03-25 2009-05-28 Bekaert Advanced Coatings Universelle vakuumskupplung für ein zylindrisches aufnahmeteil

Also Published As

Publication number Publication date
EP1896628A4 (en) 2009-12-09
EP1896628A2 (en) 2008-03-12
TW200704805A (en) 2007-02-01
JP2009512777A (ja) 2009-03-26
KR20080042042A (ko) 2008-05-14
RU2007148905A (ru) 2009-06-27
WO2006135528A3 (en) 2007-10-04
US20060278519A1 (en) 2006-12-14
WO2006135528A2 (en) 2006-12-21
CN101374971A (zh) 2009-02-25
TWI427174B (zh) 2014-02-21

Similar Documents

Publication Publication Date Title
JP5420240B2 (ja) 円筒状マグネトロンの適応性のある固定
US6375815B1 (en) Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly
EP1092109B1 (en) Vacuum tight coupling for tube sections
EP2243149B1 (en) Multiple grooved vacuum coupling
TWI476290B (zh) 可旋轉濺射靶材座、可旋轉濺射靶材、塗覆設備、製造可旋轉濺射靶材之方法、靶材座連接裝置、以及將用於濺射設備之可旋轉濺射靶材座裝置連接至靶材座支撐件的方法
JP4155983B2 (ja) 回転可能なターゲット管をスパッタするための陰極装置
WO1997015697A1 (en) Apparatus for affixing a rotating cylindrical magnetron target to a spindle
CA2155295A1 (en) Rotatable magnetron including a replaceable target structure
EP1606543B1 (en) Universal vacuum coupling for cylindrical target
US20090183983A1 (en) Insert piece for an end-block of a sputtering installation
US20100101948A1 (en) Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
GB2561961B (en) Mechanical seal
EP2180501A1 (en) Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
CN102197453A (zh) 可旋转溅射靶材支撑圆柱、可旋转溅射靶材、制造可旋转溅射靶材的方法以及涂覆设备
JP7066109B2 (ja) 管継手の施工方法
JP6982789B2 (ja) 管継手用の施工補助具
JP7067292B2 (ja) 管継手
CN120941003A (zh) 一种发动机燃油总管卡箍装配限位装置及方法
CN121653599A (zh) 一种多口径光学元件镀膜工装

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090514

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090514

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120110

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120724

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121126

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121126

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20121219

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20130201

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130913

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130920

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130926

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131120

R150 Certificate of patent or registration of utility model

Ref document number: 5420240

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees