SE1650144A1 - Device for a physical vapor deposition (pvd) process - Google Patents

Device for a physical vapor deposition (pvd) process Download PDF

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Publication number
SE1650144A1
SE1650144A1 SE1650144A SE1650144A SE1650144A1 SE 1650144 A1 SE1650144 A1 SE 1650144A1 SE 1650144 A SE1650144 A SE 1650144A SE 1650144 A SE1650144 A SE 1650144A SE 1650144 A1 SE1650144 A1 SE 1650144A1
Authority
SE
Sweden
Prior art keywords
holder
target
threaded portion
groove
pvd
Prior art date
Application number
SE1650144A
Other languages
Swedish (sv)
Inventor
Ljungcrantz Henrik
Original Assignee
Impact Coatings Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Impact Coatings Ab filed Critical Impact Coatings Ab
Priority to SE1650144A priority Critical patent/SE1650144A1/en
Priority to PCT/EP2017/052246 priority patent/WO2017134161A1/en
Priority to TW106103661A priority patent/TW201728772A/en
Publication of SE1650144A1 publication Critical patent/SE1650144A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32614—Consumable cathodes for arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets

Abstract

A device (1) for a physical vapor deposition process, wherein said device has a cylindrical body, and wherein said body comprises a bottom side (2), a top side (3), an upper portion (5) and a lower portion (4), wherein said lower portion (4) comprises a fastening arrangement, wherein said fastening arrangement at the lower portion (4) of the device (1) comprises at least one external groove (7), wherein said groove (7) extends at least partially around a circumference of said cylindrical body.Elected for publication: Fig. 1

Description

DEVICE FOR A PHYSICAL VAPOR DEPOSITION (PVD) PROCESS Technical fieldThe present document relates to a device for a physical vapor deposition(PVD) process having an improved fastening arrangement.
Backgroundln a physical vapor deposition (PVD) process, such as for instance a sputtering process, a cathode material, also called a target is used. The targetmaterial is consumed during the process, as the atoms of the target arephysically removed. The conventional degree of utilization for a target isaround 20%. This means that a substantial portion of the target material is notused. This is mainly due to limiting factors such as for instance the connectionor fastening of the target in the PVD equipment. Conventionally connectionmeans of the target comprises an externally threaded pin, which is fastened,i.e. screwed, into an internal thread of the target. The length of the threadedportion, thus extending inside the target material severely limits how much ofthe target that can be used.
Different attempts have been made at altering these connection means. ln forinstance US6551470B1 a target assembly comprising a clamp and a target isdescribed, i.e. instead of the pin and internal thread, the target is clamped.One difficulty with having a clamp arrangement is that the target becomesvery hot and may get stuck in the clamping holder. lt may therefore takelonger time for changing the target material, thus resulting in a decrease inthe efficiency of the PVD process.
There is thus a need for a new connection arrangement for a target or cathode, providing not only a way of utilizing more of the target, but also asafe and easy way of replacing a used target.
Summarylt is an object of the present disclosure, to provide an improved device for a physical vapor deposition process, which eliminates or alleviates at leastsome of the disadvantages of the prior art targets.
More specific objects include providing a device for a physical vapordeposition process having an improved fastening arrangement or connection.
The invention is defined by the appended independent claims.Embodiments are set forth in the appended dependent claims and in thefollowing description and drawings.
According to a first aspect, there is provided a device for a physicalvapor deposition process, wherein said device has a cylindrical body, andwherein said body comprises a bottom side, a top side, an upper portion anda lower portion, wherein said lower portion comprises a fasteningarrangement, wherein said fastening arrangement at the lower portion of thedevice comprises at least one external groove, wherein said groove extendsat least partially around a circumference of said cylindrical body.
By device for a physical vapor deposition (PVD) process is meantdevice such as a target or cathode for a PVD process such as a sputteringprocess, arc evaporation process or an ion plating process. ln contrast toconventional targets or cathodes for the PVD process, where the cathode isprovided with an internal thread, the fastening arrangement of this deviceprovides for a better degree of utilization of the target or cathode.
The at least one groove may comprise a threaded portion, extending ina longitudinal direction from the bottom side to a distance from the top sideand on the lower portion of the device body.
The external groove of the device is able to expand outwardly when itis heated, thus clamping the device into the corresponding holder portion offor instance a PVD equipment. A target having an external groove or thread isalso be easier and cheaper to produce.
The threaded portion may comprise a coarse thread.
A coarse thread may help in facilitating the removal of the device fromthe holder portion after that the device has been used.
The device may be adapted to be fastened in a corresponding holderportion. This means that the fastening arrangement of the device is adaptedto be fastened in or connected to a holder portion.
The holder portion may comprise a claw clutch.
The holder portion may be provided with an internal threaded portionwhich is mateingly connectable to the external threaded portion.
The device may be any one of a metal based device or a compoundbased device.
By metal based device is meant a target or cathode materialsubstantially comprising a pure metal, an alloy or a mixture of metals. 3 By compund based device is meant a target or cathod materialcomprising oxides, nitrides, borides, sulfides, selenides, tellurides, carbides,crystalline and composite mixtures.
According to a second aspect there is provided a system comprisingthe device according to the first aspect and a holder portion.
The holder portion may provided with an internal threaded portion which is mateingly connectable to the external threaded portion of the device.
The holder portion may comprise a biasing arrangement, which isconstructed or arranged such that it may bias or press the holder portiontowards the fastening arrangement of the device for a sputtering process.
The holder portion may comprise at least one claw clutch adapted tobe mateingly connectable to the at least one groove. The system may furthercomprise at least two claw clutches and a holder ring, which is adapted to bearranged to press said claw clutches towards device.
Brief Description of the DrawinqsEmbodiments of the present solution will now be described, by way ofexample, with reference to the accompanying schematic drawings.
Fig. 1 is a schematic side view of a device for a physical vapordeposition process.
Fig. 2 is a schematic bottom view of a device for a physical vapordeposition process.
Fig. 3 is a schematic top view of a device for a physical vapordeposition process.
Figs 4A and 4B are schematic cross sectional views of a prior artdevice for a physical vapor deposition process and the device for a physicalvapor deposition process according to the inventive concept respectively.
Detailed DescriptionFig. 1 illustrates a device 1 for PVD process, such as a target or cathode. ln the below description the terms device for a PVD or sputteringprocess, target or target device will be used. The device 1 has cylindricalshape or body, and has a bottom side 2 and a top side 3. The top side 3 isthe portion of the device or target which is consumed during the PVDprocess. From the bottom side 3 and upwards in a direction towards the topside a lower portion 4 is defined as a portion of the body extending substantially halfvvay to the top side. An upper portion 5 is defined as aportion of the cylindrical body extending from the opposite direction tosubstantially halfvvay to the bottom side.
The lower portion 4 of the device 1 provides a fastening arrangementwhich comprises at least one groove 7. The groove 7 may extend at leastpartially along the circumference of the body of the device 1. ln onealternative the groove 7 is intermittently slotted along the circumference (notshown).
Fig. 2 illustrates another alternative in which the lower portion 4, or thefastening arrangement, of the device 1 is provided with a male threadedportion 6, i.e. a screw thread, on an external circumference thereof. Thethreaded portion may be straight or tapered (not shown). The threadedportion thus comprises multiple grooves 7.
The threaded portion 6 may extend from the bottom side 2 andupwards towards the top side 3, i.e. in a longitudinal direction L, ending at adistance D from the top side 3. An upper portion 5 of the target may thus bedefined by this distance D.
The upper portion 5 of the device is thus the portion which is at leastpartially consumed during the PVD process.
The device, or the fastening arrangement of the device, may beadapted to be connected to a corresponding holder portion. The holderportion may be provided in a PVD equipment (also not shown).
The holder portion may be any type of biasing device, i.e. a devicepressing against the fastening arrangement of the target device to hold it intoplace in the PVD equipment.
The fastening arrangement of the target device and the holder portionor arrangement must be constructed such that the target device is securelyheld into place during the sputtering or PVD process, but is still easilyremoved aftervvards to ensure proper efficiency of the process. ln one alternative the holder portion may comprise at least one clawclutch or claw clutch arrangement 12, as shown in Fig. 1. The claw clutch 12may be adapted to mateingly connect to the at least one groove 7, or at leastone slot in the circumference of the device, i.e. be biased towards thefastening arrangement of the target device. The holder portion may furthercomprise a ring 13, to press or bias the claw clutch 12 against the device andthe groove. The ring 13 may be arranged to encompass the claw clutcharrangement. 5 The threaded portion 6 may be adapted to be connected, i.e. fastenedor screwed in a corresponding holder portion (not shown) having an internalor a female threaded portion.
The cross-sectional shape of the groove 7 is in Fig. 1 illustrated as aninverted V-shape or a wedge-shaped/key groove. The groove 7 may howeverhave any suitable shape, such as a channel or canaliculated shape, or berounded or even or be crenellated, i.e. comprise square or rectangular teeth.
Accordingly the shape of a corresponding holder portion, such as forinstance a claw clutch is adapted to be mateingly connected to the groove 7or the male threaded portion 6.
The cross-sectional shape of the threaded portion or the thread 6, i.e.its threadform, may be any one of square, triangular, trapezoidal, or othershapes. The term threadform may also refer to all design aspects takentogether, i.e. cross-sectional shape, pitch, and diameters.
According to one embodiment the angle characteristic of the cross-sectional shape, i.e. the thread angle, may be as the standardized 60 degreesfor a V-shaped thread, but any suitable thread angle can be used.
The threadform may be either a single-start or a double-startthreadform.
The threaded portion 6 may comprise a coarse thread, i.e. having alarger pitch, i.e. a larger distance from the crest of one thread to the next orfewer threads per axial distance (compared to a so called fine thread). Coarsethreads may have a larger threadform relative to the screw diameter. Thus bycoarse thread is not implied that the quality is lower than for a fine thread, butsimply refers to the size of the threads relative to the screw diameter The screw threads may be truncated, i.e. yielding a final thread depththat can be expressed as a fraction of the pitch value. According to oneembodiment the threads may be truncated to yield a thread depth of 60percent to 75 percent of the .65p value (standardized threads according toUTS or ISO thread has a height of around .65p).
The device may be a so called metal based target. The metal target ordevice for a sputtering process may comprise a pure metal, or an alloy or amixture of different metals.
The device may be a compound based target or device. Thecompound based target may comprise any one of an oxide, nitride, boride,sulfide, selenide, telluride, carbide, and crystalline and composite mixtures.
As illustrated in Fig. 3, the top side 3 of the target 1 may be taperedinwards, such that a circumferential ridge 9 and a sunken or Iowered uppersurface 8 are provided.
Figs 4A and 4B schematically illustrate the difference in degree ofutilization of a conventional prior art device or target (Fig. 4A) and the deviceaccording to the invention (Fig. 4B). As illustrated by the line U', a largerportion of the device can be used, i.e. be consumed, in the PVD process,since by the provision of the external groove 7 or threaded portion 6 ascompared to a device with an internally threaded portion 10, where theutilization of the target is depicted by line U. Further to this less material maybe used in the production of the target or cathode, since the threaded portion6 is arranged on the outside of the device, which allows for a higher utilizationthan the internal threaded portion 10. According to one example the degree ofutilization, as shown by lines U, U', may be around 40% with the targetaccording to the invention, as compared to only 20% with the conventionaltarget design.

Claims (12)

1. A device (1) for a physical vapor deposition process, wherein saiddevice has a cylindrical body, and wherein said body comprises a bottom side(2), a top side (3), an upper portion (5) and a lower portion (4), wherein saidlower portion (4) comprises a fastening arrangement characterized inthat said fastening arrangement at the lower portion (4) of the device (1)comprises at least one external groove (7), wherein said groove (7) extendsat least partially around a circumference of said cylindrical body.
2. The device as claimed in claim 1, wherein the at least one groovecomprises a threaded portion (6), extending in a longitudinal direction (L) fromthe bottom side (2) to a distance (D) from the top side (3) and on the lowerportion (4) of the device body.
3. The device as claimed in claim 2, wherein said threaded portion (6)comprises a coarse thread.
4. The device as claimed in any one of the preceding claims, whereinsaid device is adapted to be fastened in a corresponding holder portion.
5. The device as claimed in claim 4, wherein the holder portioncomprises a claw clutch (12).
6. The device as claimed in claim 4, wherein the holder portion isprovided with an internal threaded portion which is mateingly connectable tothe external threaded portion (6).
7. The device as claimed in any one of the preceding claims, whereinthe device is any one of a metal based device or a compound based device.
8. A system comprising the device as claimed in any one of claims 1 to7 and a holder portion.
9. The system as claimed in claim 8, wherein the holder portion isprovided with an internal threaded portion which is mateingly connectable tothe external threaded portion (6) of the device.
10. The system as claimed in claim 8, wherein the holder portioncomprises a biasing arrangement.
11. The system as claimed in any one of claims 8 or 10, wherein theholder portion comprises at least one claw clutch (12) adapted to bemateingly connectable to the at least one groove (7).
12. The system as claimed in claim 11, wherein said system furthercomprises at least two claw clutches (12) and a holder ring (13), which isadapted to be arranged to press said claw clutches towards device.
SE1650144A 2016-02-05 2016-02-05 Device for a physical vapor deposition (pvd) process SE1650144A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE1650144A SE1650144A1 (en) 2016-02-05 2016-02-05 Device for a physical vapor deposition (pvd) process
PCT/EP2017/052246 WO2017134161A1 (en) 2016-02-05 2017-02-02 Device for a physical vapor deposition process
TW106103661A TW201728772A (en) 2016-02-05 2017-02-03 Device for a physical vapor deposition(PVD)process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE1650144A SE1650144A1 (en) 2016-02-05 2016-02-05 Device for a physical vapor deposition (pvd) process

Publications (1)

Publication Number Publication Date
SE1650144A1 true SE1650144A1 (en) 2017-08-06

Family

ID=57965934

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1650144A SE1650144A1 (en) 2016-02-05 2016-02-05 Device for a physical vapor deposition (pvd) process

Country Status (3)

Country Link
SE (1) SE1650144A1 (en)
TW (1) TW201728772A (en)
WO (1) WO2017134161A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5032246A (en) * 1990-05-17 1991-07-16 Tosoh Smd, Inc. Sputtering target wrench and sputtering target design
US6551470B1 (en) 1999-06-15 2003-04-22 Academy Precision Materials Clamp and target assembly
US20040126492A1 (en) * 2002-12-30 2004-07-01 Weaver Scott Andrew Method and apparatus for using ion plasma deposition to produce coating
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
EP2243149B1 (en) * 2008-02-15 2011-11-09 Bekaert Advanced Coatings NV. Multiple grooved vacuum coupling
AT13830U1 (en) * 2013-04-22 2014-09-15 Plansee Se Arc evaporation coating source

Also Published As

Publication number Publication date
TW201728772A (en) 2017-08-16
WO2017134161A1 (en) 2017-08-10

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