WO2017134161A1 - Device for a physical vapor deposition process - Google Patents

Device for a physical vapor deposition process Download PDF

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Publication number
WO2017134161A1
WO2017134161A1 PCT/EP2017/052246 EP2017052246W WO2017134161A1 WO 2017134161 A1 WO2017134161 A1 WO 2017134161A1 EP 2017052246 W EP2017052246 W EP 2017052246W WO 2017134161 A1 WO2017134161 A1 WO 2017134161A1
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WO
WIPO (PCT)
Prior art keywords
target
groove
threaded portion
holder
holder portion
Prior art date
Application number
PCT/EP2017/052246
Other languages
French (fr)
Inventor
Henrik Ljungcrantz
Original Assignee
Impact Coatings Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Impact Coatings Ab filed Critical Impact Coatings Ab
Publication of WO2017134161A1 publication Critical patent/WO2017134161A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32614—Consumable cathodes for arc discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets

Definitions

  • the present document relates to a device for a physical vapor deposition (PVD) process having an improved fastening arrangement.
  • PVD physical vapor deposition
  • a cathode material also called a target is used.
  • the target material is consumed during the process, as the atoms of the target are physically removed.
  • the conventional degree of utilization for a target is around 20%. This means that a substantial portion of the target material is not used. This is mainly due to limiting factors such as for instance the connection or fastening of the target in the PVD equipment.
  • connection means of the target comprises an externally threaded pin, which is fastened, i.e. screwed, into an internal thread of the target. The length of the threaded portion, thus extending inside the target material severely limits how much of the target that can be used.
  • More specific objects include providing a device for a physical vapor deposition process having an improved fastening arrangement or connection.
  • the invention is defined by the appended independent claims.
  • a device for a physical vapor deposition process wherein said device has a cylindrical body, and wherein said body comprises a bottom side, a top side, an upper portion and a lower portion, wherein said lower portion comprises a fastening
  • said fastening arrangement at the lower portion of the device comprises at least one external groove, wherein said groove extends at least partially around a circumference of said cylindrical body.
  • device for a physical vapor deposition (PVD) process is meant device such as a target or cathode for a PVD process such as a sputtering process, arc evaporation process or an ion plating process.
  • PVD physical vapor deposition
  • the fastening arrangement of this device provides for a better degree of utilization of the target or cathode.
  • the at least one groove may comprise a threaded portion, extending in a longitudinal direction from the bottom side to a distance from the top side and on the lower portion of the device body.
  • the external groove of the device is able to expand outwardly when it is heated, thus clamping the device into the corresponding holder portion of for instance a PVD equipment.
  • a target having an external groove or thread is also be easier and cheaper to produce.
  • the threaded portion may comprise a coarse thread.
  • a coarse thread may help in facilitating the removal of the device from the holder portion after that the device has been used.
  • the device may be adapted to be fastened in a corresponding holder portion. This means that the fastening arrangement of the device is adapted to be fastened in or connected to a holder portion.
  • the holder portion may comprise a claw clutch.
  • the holder portion may be provided with an internal threaded portion which is mateingly connectable to the external threaded portion.
  • the device may be any one of a metal based device or a compound based device.
  • metal based device a target or cathode material substantially comprising a pure metal, an alloy or a mixture of metals.
  • compund based device a target or cathod material comprising oxides, nitrides, borides, sulfides, selenides, tellurides, carbides, crystalline and composite mixtures.
  • a system comprising the device according to the first aspect and a holder portion.
  • the holder portion may provided with an internal threaded portion which is mateingly connectable to the external threaded portion of the device.
  • the holder portion may comprise a biasing arrangement, which is constructed or arranged such that it may bias or press the holder portion towards the fastening arrangement of the device for a sputtering process.
  • the holder portion may comprise at least one claw clutch adapted to be mateingly connectable to the at least one groove.
  • the system may further comprise at least two claw clutches and a holder ring, which is adapted to be arranged to press said claw clutches towards device.
  • Fig. 1 is a schematic side view of a device for a physical vapor deposition process.
  • Fig. 2 is a schematic bottom view of a device for a physical vapor deposition process.
  • Fig. 3 is a schematic top view of a device for a physical vapor deposition process.
  • Figs 4A and 4B are schematic cross sectional views of a prior art device for a physical vapor deposition process and the device for a physical vapor deposition process according to the inventive concept respectively.
  • Fig. 1 illustrates a device 1 for PVD process, such as a target or cathode.
  • the device 1 has cylindrical shape or body, and has a bottom side 2 and a top side 3.
  • the top side 3 is the portion of the device or target which is consumed during the PVD process.
  • From the bottom side 3 and upwards in a direction towards the top side a lower portion 4 is defined as a portion of the body extending substantially halfway to the top side.
  • An upper portion 5 is defined as a portion of the cylindrical body extending from the opposite direction to substantially halfway to the bottom side.
  • the lower portion 4 of the device 1 provides a fastening arrangement which comprises at least one groove 7.
  • the groove 7 may extend at least partially along the circumference of the body of the device 1 .
  • the groove 7 is intermittently slotted along the circumference (not shown).
  • Fig. 2 illustrates another alternative in which the lower portion 4, or the fastening arrangement, of the device 1 is provided with a male threaded portion 6, i.e. a screw thread, on an external circumference thereof.
  • the threaded portion may be straight or tapered (not shown).
  • the threaded portion thus comprises multiple grooves 7.
  • the threaded portion 6 may extend from the bottom side 2 and upwards towards the top side 3, i.e. in a longitudinal direction L, ending at a distance D from the top side 3.
  • An upper portion 5 of the target may thus be defined by this distance D.
  • the upper portion 5 of the device is thus the portion which is at least partially consumed during the PVD process.
  • the device may be adapted to be connected to a corresponding holder portion.
  • the holder portion may be provided in a PVD equipment (also not shown).
  • the holder portion may be any type of biasing device, i.e. a device pressing against the fastening arrangement of the target device to hold it into place in the PVD equipment.
  • the fastening arrangement of the target device and the holder portion or arrangement must be constructed such that the target device is securely held into place during the sputtering or PVD process, but is still easily removed afterwards to ensure proper efficiency of the process.
  • the holder portion may comprise at least one claw clutch or claw clutch arrangement 12, as shown in Fig. 1 .
  • the claw clutch 12 may be adapted to mateingly connect to the at least one groove 7, or at least one slot in the circumference of the device, i.e. be biased towards the fastening arrangement of the target device.
  • the holder portion may further comprise a ring 13, to press or bias the claw clutch 12 against the device and the groove.
  • the ring 13 may be arranged to encompass the claw clutch arrangement.
  • the threaded portion 6 may be adapted to be connected, i.e. fastened or screwed in a corresponding holder portion (not shown) having an internal or a female threaded portion.
  • the cross-sectional shape of the groove 7 is in Fig. 1 illustrated as an inverted V-shape or a wedge-shaped/key groove.
  • the groove 7 may however have any suitable shape, such as a channel or canaliculated shape, or be rounded or even or be crenellated, i.e. comprise square or rectangular teeth.
  • a corresponding holder portion such as for instance a claw clutch is adapted to be mateingly connected to the groove 7 or the male threaded portion 6.
  • the cross-sectional shape of the threaded portion or the thread 6, i.e. its threadform may be any one of square, triangular, trapezoidal, or other shapes.
  • the term threadform may also refer to all design aspects taken together, i.e. cross-sectional shape, pitch, and diameters.
  • the angle characteristic of the cross- sectional shape i.e. the thread angle
  • the thread angle may be as the standardized 60 degrees for a V-shaped thread, but any suitable thread angle can be used.
  • the threadform may be either a single-start or a double-start threadform.
  • the threaded portion 6 may comprise a coarse thread, i.e. having a larger pitch, i.e. a larger distance from the crest of one thread to the next or fewer threads per axial distance (compared to a so called fine thread).
  • coarse thread i.e. having a larger pitch, i.e. a larger distance from the crest of one thread to the next or fewer threads per axial distance (compared to a so called fine thread).
  • Coarse threads may have a larger threadform relative to the screw diameter.
  • coarse thread is not implied that the quality is lower than for a fine thread, but simply refers to the size of the threads relative to the screw diameter
  • the screw threads may be truncated, i.e. yielding a final thread depth that can be expressed as a fraction of the pitch value.
  • the threads may be truncated to yield a thread depth of 60 percent to 75 percent of the .65p value (standardized threads according to UTS or ISO thread has a height of around .65p).
  • the device may be a so called metal based target.
  • the metal target or device for a sputtering process may comprise a pure metal, or an alloy or a mixture of different metals.
  • the device may be a compound based target or device.
  • compound based target may comprise any one of an oxide, nitride, boride, sulfide, selenide, telluride, carbide, and crystalline and composite mixtures.
  • the top side 3 of the target 1 may be tapered inwards, such that a circumferential ridge 9 and a sunken or lowered upper surface 8 are provided.
  • Figs 4A and 4B schematically illustrate the difference in degree of utilization of a conventional prior art device or target (Fig. 4A) and the device according to the invention (Fig. 4B).
  • line IT a larger portion of the device can be used, i.e. be consumed, in the PVD process, since by the provision of the external groove 7 or threaded portion 6 as compared to a device with an internally threaded portion 10, where the utilization of the target is depicted by line U.
  • the degree of utilization as shown by lines U, IT, may be around 40% with the target according to the invention, as compared to only 20% with the conventional target design.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A device (1) for a physical vapor deposition process, wherein said device has a cylindrical body, and wherein said body comprises a bottom side (2), a top side (3), an upper portion (5) and a lower portion (4), wherein said lower portion (4) comprises a fastening arrangement, wherein said fastening arrangement at the lower portion (4) of the device (1) comprises at least one external groove (7), wherein said groove (7) extends at least partially around a circumference of said cylindrical body.

Description

DEVICE FOR A PHYSICAL VAPOR DEPOSITION PROCESS
Technical field
The present document relates to a device for a physical vapor deposition (PVD) process having an improved fastening arrangement.
Background
In a physical vapor deposition (PVD) process, such as for instance a sputtering process, a cathode material, also called a target is used. The target material is consumed during the process, as the atoms of the target are physically removed. The conventional degree of utilization for a target is around 20%. This means that a substantial portion of the target material is not used. This is mainly due to limiting factors such as for instance the connection or fastening of the target in the PVD equipment. Conventionally connection means of the target comprises an externally threaded pin, which is fastened, i.e. screwed, into an internal thread of the target. The length of the threaded portion, thus extending inside the target material severely limits how much of the target that can be used.
Different attempts have been made at altering these connection means. In for instance US6551470B1 a target assembly comprising a clamp and a target is described, i.e. instead of the pin and internal thread, the target is clamped. One difficulty with having a clamp arrangement is that the target becomes very hot and may get stuck in the clamping holder. It may therefore take longer time for changing the target material, thus resulting in a decrease in the efficiency of the PVD process.
There is thus a need for a new connection arrangement for a target or cathode, providing not only a way of utilizing more of the target, but also a safe and easy way of replacing a used target.
Summary
It is an object of the present disclosure, to provide an improved device for a physical vapor deposition process, which eliminates or alleviates at least some of the disadvantages of the prior art targets.
More specific objects include providing a device for a physical vapor deposition process having an improved fastening arrangement or connection. The invention is defined by the appended independent claims.
Embodiments are set forth in the appended dependent claims and in the following description and drawings.
According to a first aspect, there is provided a device for a physical vapor deposition process, wherein said device has a cylindrical body, and wherein said body comprises a bottom side, a top side, an upper portion and a lower portion, wherein said lower portion comprises a fastening
arrangement, wherein said fastening arrangement at the lower portion of the device comprises at least one external groove, wherein said groove extends at least partially around a circumference of said cylindrical body.
By device for a physical vapor deposition (PVD) process is meant device such as a target or cathode for a PVD process such as a sputtering process, arc evaporation process or an ion plating process. In contrast to conventional targets or cathodes for the PVD process, where the cathode is provided with an internal thread, the fastening arrangement of this device provides for a better degree of utilization of the target or cathode.
The at least one groove may comprise a threaded portion, extending in a longitudinal direction from the bottom side to a distance from the top side and on the lower portion of the device body.
The external groove of the device is able to expand outwardly when it is heated, thus clamping the device into the corresponding holder portion of for instance a PVD equipment. A target having an external groove or thread is also be easier and cheaper to produce.
The threaded portion may comprise a coarse thread.
A coarse thread may help in facilitating the removal of the device from the holder portion after that the device has been used.
The device may be adapted to be fastened in a corresponding holder portion. This means that the fastening arrangement of the device is adapted to be fastened in or connected to a holder portion.
The holder portion may comprise a claw clutch.
The holder portion may be provided with an internal threaded portion which is mateingly connectable to the external threaded portion.
The device may be any one of a metal based device or a compound based device.
By metal based device is meant a target or cathode material substantially comprising a pure metal, an alloy or a mixture of metals. By compund based device is meant a target or cathod material comprising oxides, nitrides, borides, sulfides, selenides, tellurides, carbides, crystalline and composite mixtures.
According to a second aspect there is provided a system comprising the device according to the first aspect and a holder portion.
The holder portion may provided with an internal threaded portion which is mateingly connectable to the external threaded portion of the device.
The holder portion may comprise a biasing arrangement, which is constructed or arranged such that it may bias or press the holder portion towards the fastening arrangement of the device for a sputtering process.
The holder portion may comprise at least one claw clutch adapted to be mateingly connectable to the at least one groove. The system may further comprise at least two claw clutches and a holder ring, which is adapted to be arranged to press said claw clutches towards device.
Brief Description of the Drawings
Embodiments of the present solution will now be described, by way of example, with reference to the accompanying schematic drawings. Fig. 1 is a schematic side view of a device for a physical vapor deposition process.
Fig. 2 is a schematic bottom view of a device for a physical vapor deposition process.
Fig. 3 is a schematic top view of a device for a physical vapor deposition process.
Figs 4A and 4B are schematic cross sectional views of a prior art device for a physical vapor deposition process and the device for a physical vapor deposition process according to the inventive concept respectively. Detailed Description
Fig. 1 illustrates a device 1 for PVD process, such as a target or cathode. In the below description the terms device for a PVD or sputtering process, target or target device will be used. The device 1 has cylindrical shape or body, and has a bottom side 2 and a top side 3. The top side 3 is the portion of the device or target which is consumed during the PVD process. From the bottom side 3 and upwards in a direction towards the top side a lower portion 4 is defined as a portion of the body extending substantially halfway to the top side. An upper portion 5 is defined as a portion of the cylindrical body extending from the opposite direction to substantially halfway to the bottom side.
The lower portion 4 of the device 1 provides a fastening arrangement which comprises at least one groove 7. The groove 7 may extend at least partially along the circumference of the body of the device 1 . In one alternative the groove 7 is intermittently slotted along the circumference (not shown).
Fig. 2 illustrates another alternative in which the lower portion 4, or the fastening arrangement, of the device 1 is provided with a male threaded portion 6, i.e. a screw thread, on an external circumference thereof. The threaded portion may be straight or tapered (not shown). The threaded portion thus comprises multiple grooves 7.
The threaded portion 6 may extend from the bottom side 2 and upwards towards the top side 3, i.e. in a longitudinal direction L, ending at a distance D from the top side 3. An upper portion 5 of the target may thus be defined by this distance D.
The upper portion 5 of the device is thus the portion which is at least partially consumed during the PVD process.
The device, or the fastening arrangement of the device, may be adapted to be connected to a corresponding holder portion. The holder portion may be provided in a PVD equipment (also not shown).
The holder portion may be any type of biasing device, i.e. a device pressing against the fastening arrangement of the target device to hold it into place in the PVD equipment.
The fastening arrangement of the target device and the holder portion or arrangement must be constructed such that the target device is securely held into place during the sputtering or PVD process, but is still easily removed afterwards to ensure proper efficiency of the process.
In one alternative the holder portion may comprise at least one claw clutch or claw clutch arrangement 12, as shown in Fig. 1 . The claw clutch 12 may be adapted to mateingly connect to the at least one groove 7, or at least one slot in the circumference of the device, i.e. be biased towards the fastening arrangement of the target device. The holder portion may further comprise a ring 13, to press or bias the claw clutch 12 against the device and the groove. The ring 13 may be arranged to encompass the claw clutch arrangement. The threaded portion 6 may be adapted to be connected, i.e. fastened or screwed in a corresponding holder portion (not shown) having an internal or a female threaded portion.
The cross-sectional shape of the groove 7 is in Fig. 1 illustrated as an inverted V-shape or a wedge-shaped/key groove. The groove 7 may however have any suitable shape, such as a channel or canaliculated shape, or be rounded or even or be crenellated, i.e. comprise square or rectangular teeth.
Accordingly the shape of a corresponding holder portion, such as for instance a claw clutch is adapted to be mateingly connected to the groove 7 or the male threaded portion 6.
The cross-sectional shape of the threaded portion or the thread 6, i.e. its threadform, may be any one of square, triangular, trapezoidal, or other shapes. The term threadform may also refer to all design aspects taken together, i.e. cross-sectional shape, pitch, and diameters.
According to one embodiment the angle characteristic of the cross- sectional shape, i.e. the thread angle, may be as the standardized 60 degrees for a V-shaped thread, but any suitable thread angle can be used.
The threadform may be either a single-start or a double-start threadform.
The threaded portion 6 may comprise a coarse thread, i.e. having a larger pitch, i.e. a larger distance from the crest of one thread to the next or fewer threads per axial distance (compared to a so called fine thread). Coarse threads may have a larger threadform relative to the screw diameter. Thus by coarse thread is not implied that the quality is lower than for a fine thread, but simply refers to the size of the threads relative to the screw diameter
The screw threads may be truncated, i.e. yielding a final thread depth that can be expressed as a fraction of the pitch value. According to one embodiment the threads may be truncated to yield a thread depth of 60 percent to 75 percent of the .65p value (standardized threads according to UTS or ISO thread has a height of around .65p).
The device may be a so called metal based target. The metal target or device for a sputtering process may comprise a pure metal, or an alloy or a mixture of different metals.
The device may be a compound based target or device. The
compound based target may comprise any one of an oxide, nitride, boride, sulfide, selenide, telluride, carbide, and crystalline and composite mixtures. As illustrated in Fig. 3, the top side 3 of the target 1 may be tapered inwards, such that a circumferential ridge 9 and a sunken or lowered upper surface 8 are provided.
Figs 4A and 4B schematically illustrate the difference in degree of utilization of a conventional prior art device or target (Fig. 4A) and the device according to the invention (Fig. 4B). As illustrated by the line IT, a larger portion of the device can be used, i.e. be consumed, in the PVD process, since by the provision of the external groove 7 or threaded portion 6 as compared to a device with an internally threaded portion 10, where the utilization of the target is depicted by line U. Further to this less material may be used in the production of the target or cathode, since the threaded portion 6 is arranged on the outside of the device, which allows for a higher utilization than the internal threaded portion 10. According to one example the degree of utilization, as shown by lines U, IT, may be around 40% with the target according to the invention, as compared to only 20% with the conventional target design.

Claims

1 . A device (1 ) for a physical vapor deposition process, wherein said device has a cylindrical body, and wherein said body comprises a bottom side (2), a top side (3), an upper portion (5) and a lower portion (4), wherein said lower portion (4) comprises a fastening arrangement
c h a r a c t e r i z e d in that
said fastening arrangement at the lower portion (4) of the device (1 ) comprises at least one external groove (7), wherein said groove (7) extends at least partially around a circumference of said cylindrical body.
2. The device as claimed in claim 1 , wherein the at least one groove comprises a threaded portion (6), extending in a longitudinal direction (L) from the bottom side (2) to a distance (D) from the top side (3) and on the lower portion (4) of the device body.
3. The device as claimed in claim 2, wherein said threaded portion (6) comprises a coarse thread.
4. The device as claimed in any one of the preceding claims, wherein said device is adapted to be fastened in a corresponding holder portion.
5. The device as claimed in claim 4, wherein the holder portion comprises a claw clutch (12).
6. The device as claimed in claim 4, wherein the holder portion is provided with an internal threaded portion which is mateingly connectable to the external threaded portion (6).
7. The device as claimed in any one of the preceding claims, wherein the device is any one of a metal based device or a compound based device.
8. A system comprising the device as claimed in any one of claims 1 to 7 and a holder portion.
9. The system as claimed in claim 8, wherein the holder portion is provided with an internal threaded portion which is mateingly connectable to the external threaded portion (6) of the device.
10. The system as claimed in claim 8, wherein the holder portion comprises a biasing arrangement.
1 1 . The system as claimed in any one of claims 8 or 10, wherein the holder portion comprises at least one claw clutch (12) adapted to be mateingly connectable to the at least one groove (7).
12. The system as claimed in claim 1 1 , wherein said system further comprises at least two claw clutches (12) and a holder ring (13), which is adapted to be arranged to press said claw clutches towards device.
PCT/EP2017/052246 2016-02-05 2017-02-02 Device for a physical vapor deposition process WO2017134161A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE1650144A SE1650144A1 (en) 2016-02-05 2016-02-05 Device for a physical vapor deposition (pvd) process
SE1650144-7 2016-02-05

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Citations (6)

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Publication number Priority date Publication date Assignee Title
US5032246A (en) * 1990-05-17 1991-07-16 Tosoh Smd, Inc. Sputtering target wrench and sputtering target design
US6551470B1 (en) 1999-06-15 2003-04-22 Academy Precision Materials Clamp and target assembly
US20040126492A1 (en) * 2002-12-30 2004-07-01 Weaver Scott Andrew Method and apparatus for using ion plasma deposition to produce coating
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
US20090208280A1 (en) * 2008-02-15 2009-08-20 Bekaert Advanced Coatings Multiple grooved vacuum coupling
WO2014172722A1 (en) * 2013-04-22 2014-10-30 Plansee Se Arc evaporation coating source having a permanent magnet

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