CN101374971A - 用于圆柱形磁控管的适用的固定 - Google Patents

用于圆柱形磁控管的适用的固定 Download PDF

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Publication number
CN101374971A
CN101374971A CNA200680026020XA CN200680026020A CN101374971A CN 101374971 A CN101374971 A CN 101374971A CN A200680026020X A CNA200680026020X A CN A200680026020XA CN 200680026020 A CN200680026020 A CN 200680026020A CN 101374971 A CN101374971 A CN 101374971A
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CN
China
Prior art keywords
target
ring
retaining ring
axle
mandrel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200680026020XA
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English (en)
Chinese (zh)
Inventor
L·马拉斯泽夫斯基
O·G·加韦
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Applied Materials Inc
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Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN101374971A publication Critical patent/CN101374971A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CNA200680026020XA 2005-06-10 2006-05-15 用于圆柱形磁控管的适用的固定 Pending CN101374971A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/150,337 US20060278519A1 (en) 2005-06-10 2005-06-10 Adaptable fixation for cylindrical magnetrons
US11/150,337 2005-06-10

Publications (1)

Publication Number Publication Date
CN101374971A true CN101374971A (zh) 2009-02-25

Family

ID=37523145

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200680026020XA Pending CN101374971A (zh) 2005-06-10 2006-05-15 用于圆柱形磁控管的适用的固定

Country Status (8)

Country Link
US (1) US20060278519A1 (https=)
EP (1) EP1896628A4 (https=)
JP (1) JP5420240B2 (https=)
KR (1) KR20080042042A (https=)
CN (1) CN101374971A (https=)
RU (1) RU2007148905A (https=)
TW (1) TWI427174B (https=)
WO (1) WO2006135528A2 (https=)

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US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
US20100101946A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
US20100101948A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
EP2180501A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
EP2180502A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
EP2180500A1 (en) * 2008-10-24 2010-04-28 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, methods of producing and restoring a rotatable sputter target, and coating installation
CN102265376A (zh) * 2008-10-24 2011-11-30 应用材料股份有限公司 可旋转溅射靶材座、可旋转溅射靶材、涂覆设备、制造可旋转溅射靶材的方法、靶材座连接装置、以及将用于溅射设备的可旋转溅射靶材座装置连接至靶材座支撑件的方法
US20120037503A1 (en) * 2008-10-24 2012-02-16 Applied Materials, Inc. Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a target base support
US8951394B2 (en) * 2010-01-29 2015-02-10 Angstrom Sciences, Inc. Cylindrical magnetron having a shunt
EP2365515A1 (en) * 2010-03-09 2011-09-14 Applied Materials, Inc. Rotatable target, backing tube, sputtering installation and method for producing a rotatable target
JP5572710B2 (ja) * 2010-06-28 2014-08-13 アルバックテクノ株式会社 ターゲット取付機構
DE102010040267B4 (de) * 2010-09-03 2014-07-17 Von Ardenne Anlagentechnik Gmbh Sputtereinrichtung mit rohrförmigem Target
US9765726B2 (en) * 2013-03-13 2017-09-19 Federal-Mogul Cylinder liners with adhesive metallic layers and methods of forming the cylinder liners
DE102013103472B4 (de) 2013-04-08 2018-08-09 VON ARDENNE Asset GmbH & Co. KG Vakuumbetriebskomponente und Vakuumprozessanordnung
EP3310941B1 (de) * 2015-06-16 2020-12-30 Schneider GmbH & Co. KG Vorrichtung und verfahren zur beschichtung von linsen
SE1650144A1 (en) * 2016-02-05 2017-08-06 Impact Coatings Ab Device for a physical vapor deposition (pvd) process
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
US10580627B2 (en) 2018-04-26 2020-03-03 Keihin Ramtech Co., Ltd. Sputtering cathode, sputtering cathode assembly, and sputtering apparatus
CN113463044B (zh) * 2021-06-10 2023-02-03 芜湖映日科技股份有限公司 一种真空绑定靶材的设备
CN115691853B (zh) * 2022-09-26 2024-01-23 中国核动力研究设计院 一种用于研究堆同位素辐照生产的辐照靶件及组装方法

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Also Published As

Publication number Publication date
EP1896628A4 (en) 2009-12-09
EP1896628A2 (en) 2008-03-12
TW200704805A (en) 2007-02-01
JP2009512777A (ja) 2009-03-26
KR20080042042A (ko) 2008-05-14
RU2007148905A (ru) 2009-06-27
WO2006135528A3 (en) 2007-10-04
US20060278519A1 (en) 2006-12-14
WO2006135528A2 (en) 2006-12-21
JP5420240B2 (ja) 2014-02-19
TWI427174B (zh) 2014-02-21

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Open date: 20090225