ATE13561T1 - Zylindrische magnetron-zerstaeuberkathode. - Google Patents

Zylindrische magnetron-zerstaeuberkathode.

Info

Publication number
ATE13561T1
ATE13561T1 AT80200753T AT80200753T ATE13561T1 AT E13561 T1 ATE13561 T1 AT E13561T1 AT 80200753 T AT80200753 T AT 80200753T AT 80200753 T AT80200753 T AT 80200753T AT E13561 T1 ATE13561 T1 AT E13561T1
Authority
AT
Austria
Prior art keywords
face
arch
sputtering
cathode
magnet assembly
Prior art date
Application number
AT80200753T
Other languages
English (en)
Inventor
Bogdan Zega
Original Assignee
Battelle Development Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Development Corp filed Critical Battelle Development Corp
Application granted granted Critical
Publication of ATE13561T1 publication Critical patent/ATE13561T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Microwave Tubes (AREA)
  • Photoreceptors In Electrophotography (AREA)
AT80200753T 1980-08-08 1980-08-08 Zylindrische magnetron-zerstaeuberkathode. ATE13561T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP80200753A EP0045822B1 (de) 1980-08-08 1980-08-08 Zylindrische Magnetron-Zerstäuberkathode

Publications (1)

Publication Number Publication Date
ATE13561T1 true ATE13561T1 (de) 1985-06-15

Family

ID=8187028

Family Applications (1)

Application Number Title Priority Date Filing Date
AT80200753T ATE13561T1 (de) 1980-08-08 1980-08-08 Zylindrische magnetron-zerstaeuberkathode.

Country Status (6)

Country Link
US (1) US4407713A (de)
EP (1) EP0045822B1 (de)
JP (1) JPS57114663A (de)
AT (1) ATE13561T1 (de)
CA (1) CA1169467A (de)
DE (1) DE3070700D1 (de)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376025A (en) * 1982-06-14 1983-03-08 Battelle Development Corporation Cylindrical cathode for magnetically-enhanced sputtering
GB2125441A (en) * 1982-07-13 1984-03-07 Christopher Elphick Tunnel magnetron for cathode sputtering
US4444643A (en) * 1982-09-03 1984-04-24 Gartek Systems, Inc. Planar magnetron sputtering device
AT376460B (de) * 1982-09-17 1984-11-26 Kljuchko Gennady V Plasmalichtbogeneinrichtung zum auftragen von ueberzuegen
US4437966A (en) * 1982-09-30 1984-03-20 Gte Products Corporation Sputtering cathode apparatus
US4512863A (en) * 1983-09-09 1985-04-23 Ppg Industries, Inc. Stainless steel primer for sputtered films
CH659484A5 (de) * 1984-04-19 1987-01-30 Balzers Hochvakuum Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
US4569746A (en) * 1984-05-17 1986-02-11 Varian Associates, Inc. Magnetron sputter device using the same pole piece for coupling separate confining magnetic fields to separate targets subject to separate discharges
US4657654A (en) * 1984-05-17 1987-04-14 Varian Associates, Inc. Targets for magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
US4595482A (en) * 1984-05-17 1986-06-17 Varian Associates, Inc. Apparatus for and the method of controlling magnetron sputter device having separate confining magnetic fields to separate targets subject to separate discharges
EP0173583B1 (de) * 1984-08-31 1990-12-19 Anelva Corporation Entladungsvorrichtung
US4774437A (en) * 1986-02-28 1988-09-27 Varian Associates, Inc. Inverted re-entrant magnetron ion source
DE3619194A1 (de) * 1986-06-06 1987-12-10 Leybold Heraeus Gmbh & Co Kg Magnetron-zerstaeubungskatode fuer vakuum-beschichtungsanlagen
DE3721373A1 (de) * 1987-06-29 1989-01-12 Leybold Ag Beschichtungsvorrichtung
AT392291B (de) * 1987-09-01 1991-02-25 Miba Gleitlager Ag Stabfoermige sowie magnetron- bzw. sputterkathodenanordnung, sputterverfahren, und vorrichtung zur durchfuehrung des verfahrens
DE3844064A1 (de) * 1988-12-28 1990-07-05 Leybold Ag Katodenzerstaeubungsvorrichtung nach dem magnetron-prinzip mit einer hohlkatode und einem zylindrischen target
US6024843A (en) * 1989-05-22 2000-02-15 Novellus Systems, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
US5178743A (en) * 1989-06-15 1993-01-12 Microelectronics And Computer Technology Corporation Cylindrical magnetron sputtering system
DE4009151A1 (de) * 1990-03-22 1991-09-26 Leybold Ag Vorrichtung zum beschichten von substraten durch katodenzerstaeubung
EP0581902A4 (de) * 1991-04-19 1994-03-23 Surface Solutions Inc Verfahren und vorrichtung zur linearen magnetronzerstäubung.
DE4117518C2 (de) * 1991-05-29 2000-06-21 Leybold Ag Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target
US5228963A (en) * 1991-07-01 1993-07-20 Himont Incorporated Hollow-cathode magnetron and method of making thin films
US5458759A (en) * 1991-08-02 1995-10-17 Anelva Corporation Magnetron sputtering cathode apparatus
KR950000906B1 (ko) * 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
GB9121699D0 (en) * 1991-10-11 1991-11-27 Hacker Dennis J Volume manufacture of low weight/cost fire stop(proof)doors & partitions with 1/2-1-1 1/2-2-3-4 hour capacities
US5374343A (en) * 1992-05-15 1994-12-20 Anelva Corporation Magnetron cathode assembly
US5301211A (en) * 1992-08-03 1994-04-05 Combustion Engineering, Inc. Fuel assembly sputtering process
US5272735A (en) * 1992-08-03 1993-12-21 Combustion Engineering, Inc. Sputtering process burnable poison coating
US5567289A (en) * 1993-12-30 1996-10-22 Viratec Thin Films, Inc. Rotating floating magnetron dark-space shield and cone end
EP0665304B1 (de) * 1994-01-31 1997-08-13 Nissin Electric Company, Limited Verfahren zur Herstellung einer Röhre mit einem Filmbelag auf der inneren peripheren Oberfläche und Vorrichtung zu seiner Herstellung
US5518597A (en) * 1995-03-28 1996-05-21 Minnesota Mining And Manufacturing Company Cathodic arc coating apparatus and method
US5591314A (en) * 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US6103074A (en) * 1998-02-14 2000-08-15 Phygen, Inc. Cathode arc vapor deposition method and apparatus
DE19827461A1 (de) * 1998-06-19 1999-12-23 Leybold Systems Gmbh Vorrichtung zum Beschichten von Substraten in einer Vakuumkammer
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
US7351480B2 (en) * 2002-06-11 2008-04-01 Southwest Research Institute Tubular structures with coated interior surfaces
US20040129561A1 (en) * 2003-01-07 2004-07-08 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron magnetic array mid span support
KR100917463B1 (ko) * 2003-01-15 2009-09-14 삼성전자주식회사 마그네트론 캐소드 및 이를 채용하는 마그네트론 스퍼터링장치
US7014741B2 (en) * 2003-02-21 2006-03-21 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron with self cleaning target
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
SG118232A1 (en) * 2004-02-27 2006-06-27 Superiorcoat Private Ltd Cathodic arc coating apparatus
CN1938813A (zh) * 2004-04-05 2007-03-28 贝卡尔特先进涂层公司 管状磁体组件
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
US20050236267A1 (en) * 2004-04-27 2005-10-27 Paul Rich Methods and apparatus for controlling rotating magnetic fields
GB0409337D0 (en) * 2004-04-27 2004-06-02 Trikon Technologies Ltd Methods and apparatus for controlling rotating magnetic fields
US7867366B1 (en) * 2004-04-28 2011-01-11 Alameda Applied Sciences Corp. Coaxial plasma arc vapor deposition apparatus and method
WO2006007504A1 (en) * 2004-07-01 2006-01-19 Cardinal Cg Company Cylindrical target with oscillating magnet from magnetron sputtering
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
US7520965B2 (en) * 2004-10-12 2009-04-21 Southwest Research Institute Magnetron sputtering apparatus and method for depositing a coating using same
US20060076231A1 (en) * 2004-10-12 2006-04-13 Southwest Research Institute Method for magnetron sputter deposition
US7790003B2 (en) * 2004-10-12 2010-09-07 Southwest Research Institute Method for magnetron sputter deposition
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
US7592051B2 (en) * 2005-02-09 2009-09-22 Southwest Research Institute Nanostructured low-Cr Cu-Cr coatings for high temperature oxidation resistance
US20060207871A1 (en) 2005-03-16 2006-09-21 Gennady Yumshtyk Sputtering devices and methods
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
DE502005005634D1 (de) * 2005-09-15 2008-11-20 Applied Materials Gmbh & Co Kg Beschichtungsanlage und Verfahren zum Betrieb einer Beschichtungsanlage
US8123919B2 (en) * 2005-09-20 2012-02-28 Guardian Industries Corp. Sputtering target with bonding layer of varying thickness under target material
US20070080056A1 (en) * 2005-10-07 2007-04-12 German John R Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US9082595B2 (en) * 2006-03-28 2015-07-14 Sulzer Metaplas Gmbh Sputtering apparatus
US8273222B2 (en) * 2006-05-16 2012-09-25 Southwest Research Institute Apparatus and method for RF plasma enhanced magnetron sputter deposition
EP1892314B1 (de) * 2006-08-24 2012-04-11 Atomic Energy Council - Institute of Nuclear Energy Research Targethalterung mit einer Kühleinrichtung
US7879203B2 (en) * 2006-12-11 2011-02-01 General Electric Company Method and apparatus for cathodic arc ion plasma deposition
TWI377264B (en) * 2007-02-05 2012-11-21 Hon Hai Prec Ind Co Ltd Sputtering device
US8277617B2 (en) * 2007-08-14 2012-10-02 Southwest Research Institute Conformal magnetron sputter deposition
DE102008039211B4 (de) * 2008-05-07 2011-08-25 VON ARDENNE Anlagentechnik GmbH, 01324 Rohrtarget mit Endblock zur Kühlmittelversorgung
US8652310B2 (en) * 2008-07-24 2014-02-18 Seagate Technology Llc Trim magnets to adjust erosion rate of cylindrical sputter targets
US20100101949A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation
US8277645B2 (en) 2008-12-17 2012-10-02 Jarvis Jr Ernest Automatic retractable screen system for storm drain inlets
TW201030168A (en) * 2009-02-03 2010-08-16 Wintek Corp Magnetron sputtering cathode
CN101899642B (zh) * 2009-05-25 2013-03-20 鸿富锦精密工业（深圳）有限公司 镀膜装置
CN101956170B (zh) * 2009-07-15 2013-12-11 鸿富锦精密工业（深圳）有限公司 磁控溅射靶
WO2011056581A2 (en) 2009-10-26 2011-05-12 General Plasma, Inc. Rotary magnetron magnet bar and apparatus containing the same for high target utilization
US8747631B2 (en) * 2010-03-15 2014-06-10 Southwest Research Institute Apparatus and method utilizing a double glow discharge plasma for sputter cleaning
US8398834B2 (en) 2010-04-02 2013-03-19 NuvoSun, Inc. Target utilization improvement for rotatable magnetrons
DE102010056343A1 (de) 2010-12-29 2012-07-05 Von Ardenne Anlagentechnik Gmbh Vorrichtung und Verfahren zur Rohrbeschichtung
KR101275673B1 (ko) 2011-04-29 2013-06-17 (주)울텍 스퍼터링 마그네트론
WO2013004563A1 (en) * 2011-07-04 2013-01-10 Tetra Laval Holdings & Finance S.A. Electron-beam device
CN102719799A (zh) * 2012-06-08 2012-10-10 深圳市华星光电技术有限公司 旋转磁控溅射靶及相应的磁控溅射装置
US9640359B2 (en) * 2012-08-09 2017-05-02 Vactronix Scientific, Inc. Inverted cylindrical magnetron (ICM) system and methods of use
JP6511813B2 (ja) * 2013-11-22 2019-05-15 東レ株式会社 プラズマ処理電極およびｃｖｄ電極
WO2015164257A1 (en) * 2014-04-21 2015-10-29 Kurt J. Lesker Company Surrounding field sputtering source
US9368330B2 (en) * 2014-05-02 2016-06-14 Bh5773 Ltd Sputtering targets and methods
US9546837B1 (en) 2015-10-09 2017-01-17 Bh5773 Ltd Advanced gun barrel
US20190032197A1 (en) * 2016-02-17 2019-01-31 Innohance Co., Ltd. Cathode for plasma treatment apparatus
BE1024754B9 (nl) * 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
GB201815842D0 (en) * 2018-09-28 2018-11-14 Power Roll Ltd Method of processing substrate for an energy storage device
CN110408902A (zh) * 2019-08-22 2019-11-05 深圳市金耀玻璃机械有限公司 一种绕线式电弧靶装置
US12224165B2 (en) 2019-12-06 2025-02-11 Board Of Trustees Of Michigan State University Magnetic-field-assisted plasma coating system
WO2022159633A1 (en) 2021-01-20 2022-07-28 Starfire Industries Llc Bellows coating by magnetron sputtering with kick pulse
JP7737830B2 (ja) * 2021-06-25 2025-09-11 東京エレクトロン株式会社 成膜装置、処理条件決定方法及び成膜方法
CN115491645A (zh) * 2022-09-19 2022-12-20 中核四0四有限公司 一种基于磁控溅射的镀膜系统及方法
CN119121163B (zh) * 2024-11-11 2025-02-25 中国科学院赣江创新研究院 一种中空磁控溅射阴极、磁控溅射镀膜装置及镀膜方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4031424A (en) * 1971-09-07 1977-06-21 Telic Corporation Electrode type glow discharge apparatus
US3884793A (en) * 1971-09-07 1975-05-20 Telic Corp Electrode type glow discharge apparatus
US3995187A (en) * 1971-09-07 1976-11-30 Telic Corporation Electrode type glow discharge apparatus
US4030996A (en) * 1971-09-07 1977-06-21 Telic Corporation Electrode type glow discharge method and apparatus
US3919678A (en) * 1974-04-01 1975-11-11 Telic Corp Magnetic field generation apparatus
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
DE2707144A1 (de) * 1976-02-19 1977-08-25 Sloan Technology Corp Kathodenzerstaeubungsvorrichtung
JPS5322879A (en) * 1976-08-16 1978-03-02 Matsushita Electric Ind Co Ltd Sputtering apparatus
US4179351A (en) * 1976-09-09 1979-12-18 Hewlett-Packard Company Cylindrical magnetron sputtering source
JPS5358489A (en) * 1976-11-08 1978-05-26 Ise Electronics Corp Spattering system
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4169031A (en) * 1978-01-13 1979-09-25 Polyohm, Inc. Magnetron sputter cathode assembly
US4198283A (en) * 1978-11-06 1980-04-15 Materials Research Corporation Magnetron sputtering target and cathode assembly
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus

Also Published As

Publication number Publication date
DE3070700D1 (en) 1985-07-04
JPS57114663A (en) 1982-07-16
US4407713A (en) 1983-10-04
EP0045822A1 (de) 1982-02-17
CA1169467A (en) 1984-06-19
EP0045822B1 (de) 1985-05-29

Similar Documents

Publication Publication Date Title
ATE13561T1 (de) Zylindrische magnetron-zerstaeuberkathode.
GB1476079A (en) Planar magnetron sputtering apparatus
EP0144572A3 (en) Magnetron-cathodes for the sputtering of ferromagnetic targets
JPS575871A (en) Cathode part of magnetron type sputtering apparatus
ATE47253T1 (de) Magnetronkatode zum zerstaeuben ferromagnetischer targets.
GB1464039A (en) Electron bearm gun system
GB2147916A (en) Cathodic evaporation of ferromagnetic targets
CA2099813A1 (en) X-z geometry periodic permanent magnet focusing system
GB1493276A (en) Magnetrons
JPS5512732A (en) Sputtering apparatus for making thin magnetic film
GB1237624A (en) Air cooled magnetron device
GB1438458A (en) Magnetic recording medium having binder-free phosphide coating
GB1192973A (en) Rotating Anode X-Ray Tube with Magnetic Damper
JPS5779170A (en) Target for magnetron sputtering
GB938022A (en) Ionic pump
GB1383189A (en) Apparatus for the vacuum deposition of thin layers
JPS55102162A (en) Ion source
JPS5328366A (en) Magnetron u nit
JPS56159042A (en) Magnetron
SU360008A1 (ru) Электромагнит бетатрона
SU785629A1 (ru) Устройство дл нагрева и перемешивани расплавленного металла
JPS6026095Y2 (ja) プラズマ放電電極の冷却装置
JPS52165A (en) Magnetron
SU1329597A1 (ru) Полюс бетатрона
GB1192484A (en) Improved Magnetic Focusing Systems for Discharge Tubes

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee