JPS5512732A - Sputtering apparatus for making thin magnetic film - Google Patents
Sputtering apparatus for making thin magnetic filmInfo
- Publication number
- JPS5512732A JPS5512732A JP8522978A JP8522978A JPS5512732A JP S5512732 A JPS5512732 A JP S5512732A JP 8522978 A JP8522978 A JP 8522978A JP 8522978 A JP8522978 A JP 8522978A JP S5512732 A JPS5512732 A JP S5512732A
- Authority
- JP
- Japan
- Prior art keywords
- target
- chrome
- making
- cobalt
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Thin Magnetic Films (AREA)
Abstract
PURPOSE: To increase the speed of making a thin film by employing magnetic material for constructing a target so as to make it produce a sufficient magnetic field when using such a sputtering method that the magnetic field generated intersects the electric field added between the target and subtrate holder.
CONSTITUTION: The target consists of the first target member 46 in the form of a plate, or an alloy of cobalt and chrome with the chrome content of 30% or more and without strong ferromagnetic properties; and the second target members 47, 48 and 49 made of an alloy of cobalt and chrome with the chrome content of 20%-0%, and with the saturated magnetization of 200 gauss or more. The second target members 47, 48, and 49 are arranged on the plane opposite to the one where permanent magnets 44 and 45 for the first target member 46 are arranged on it, then lines of magnetic force 105 and 106 which have components intersecting the electric fields at right angles are generated by making each of the second target members 47, 48 and 49 the auxiliary magnetic poles of the permanent magnets 44 and 45.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8522978A JPS5512732A (en) | 1978-07-14 | 1978-07-14 | Sputtering apparatus for making thin magnetic film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8522978A JPS5512732A (en) | 1978-07-14 | 1978-07-14 | Sputtering apparatus for making thin magnetic film |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5512732A true JPS5512732A (en) | 1980-01-29 |
JPS6151410B2 JPS6151410B2 (en) | 1986-11-08 |
Family
ID=13852729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8522978A Granted JPS5512732A (en) | 1978-07-14 | 1978-07-14 | Sputtering apparatus for making thin magnetic film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5512732A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734324A (en) * | 1980-08-08 | 1982-02-24 | Teijin Ltd | Manufacture of vertically magnetized film |
JPS57157511A (en) * | 1981-03-24 | 1982-09-29 | Teijin Ltd | Opposite target type sputtering device |
JPS59190364A (en) * | 1984-03-23 | 1984-10-29 | Hitachi Ltd | Sputtering device |
JPS60182712A (en) * | 1984-02-29 | 1985-09-18 | Anelva Corp | Ferromagnetic-material target |
US4626336A (en) * | 1985-05-02 | 1986-12-02 | Hewlett Packard Company | Target for sputter depositing thin films |
US4834855A (en) * | 1985-05-02 | 1989-05-30 | Hewlett-Packard Company | Method for sputter depositing thin films |
US5458759A (en) * | 1991-08-02 | 1995-10-17 | Anelva Corporation | Magnetron sputtering cathode apparatus |
US5464518A (en) * | 1993-01-15 | 1995-11-07 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
US5470452A (en) * | 1990-08-10 | 1995-11-28 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
US5527439A (en) * | 1995-01-23 | 1996-06-18 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
-
1978
- 1978-07-14 JP JP8522978A patent/JPS5512732A/en active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734324A (en) * | 1980-08-08 | 1982-02-24 | Teijin Ltd | Manufacture of vertically magnetized film |
JPS6367328B2 (en) * | 1980-08-08 | 1988-12-26 | Teijin Ltd | |
JPS57157511A (en) * | 1981-03-24 | 1982-09-29 | Teijin Ltd | Opposite target type sputtering device |
JPH031810B2 (en) * | 1981-03-24 | 1991-01-11 | Teijin Kk | |
JPS60182712A (en) * | 1984-02-29 | 1985-09-18 | Anelva Corp | Ferromagnetic-material target |
JPS59190364A (en) * | 1984-03-23 | 1984-10-29 | Hitachi Ltd | Sputtering device |
US4834855A (en) * | 1985-05-02 | 1989-05-30 | Hewlett-Packard Company | Method for sputter depositing thin films |
US4626336A (en) * | 1985-05-02 | 1986-12-02 | Hewlett Packard Company | Target for sputter depositing thin films |
US5470452A (en) * | 1990-08-10 | 1995-11-28 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
US5725746A (en) * | 1990-08-10 | 1998-03-10 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
US5458759A (en) * | 1991-08-02 | 1995-10-17 | Anelva Corporation | Magnetron sputtering cathode apparatus |
US5464518A (en) * | 1993-01-15 | 1995-11-07 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
US5527439A (en) * | 1995-01-23 | 1996-06-18 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
Also Published As
Publication number | Publication date |
---|---|
JPS6151410B2 (en) | 1986-11-08 |
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